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A method can be used to perform an operation on a system that includes an assembly and a vessel that includes a wall and a thermal shield. The method can include breaking a thermal connection between the assembly and the thermal shield, separating the assembly and a surface within the vessel from ea

A method can be used to perform an operation on a system that includes an assembly and a vessel that includes a wall and a thermal shield. The method can include breaking a thermal connection between the assembly and the thermal shield, separating the assembly and a surface within the vessel from each other, or any combination thereof. The method can also include changing a pressure with the vessel to be closer to atmospheric pressure, heating the assembly, or any combination thereof. In one embodiment, the method can be performed while keeping a cryogenic region substantially sealed, keeping a superconducting magnet energized, or a combination thereof. In a particular embodiment, the method can be used when servicing the assembly, such as a cryocooler.

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What is claimed is: 1. A method of using a system comprising an assembly and a vessel, wherein the method comprises: providing the vessel including a wall that at least partly defines an interior space, wherein a superconducting component is disposed within the interior space, and at least a portio

What is claimed is: 1. A method of using a system comprising an assembly and a vessel, wherein the method comprises: providing the vessel including a wall that at least partly defines an interior space, wherein a superconducting component is disposed within the interior space, and at least a portion of an assembly is exposed to the interior space; separating the assembly and a surface within the vessel, such that the assembly and the surface are spaced apart from each other after separating; and lowering a pressure within the interior space of the vessel to be closer to atmospheric pressure, as compared to the pressure before lowering the pressure. 2. The method of claim 1, further comprising heating the assembly to a temperature in a range of approximately 250 to 350 K. 3. The method of claim 2, wherein heating the assembly is performed after separating the assembly and a wall. 4. The method of claim 1, wherein a cryogenic region adjacent to the assembly remains substantially sealed after separating the assembly and the surface. 5. The method of claim 1, wherein: before separating the assembly and the surface, the assembly is thermally connected to a thermal shield within the vessel; and after separating the assembly and the surface, the assembly is thermally disconnected from the thermal shield. 6. The method of claim 1, wherein separating the assembly and the surface comprises moving a housing of the assembly while maintaining a seal of a cryogenic region within the vessel. 7. The method of claim 1, wherein: the superconducting component comprises a superconducting magnet: and the method further comprises keeping the superconducting magnet energized within the vessel during separating the assembly and the surface and heating the assembly. 8. The method of claim 1, further comprising removing a portion of the assembly from a housing of the assembly. 9. The method of claim 1, wherein the system comprises a magnetic resonance imaging system. 10. A method of using a system comprising: operating the system including a vessel and a cryocooler, wherein: the vessel includes a thermal shield and a cryogenic region, wherein the cryogenic region includes liquid helium adjacent to a superconducting magnet; the thermal shield is at a temperature higher than the liquid helium; the cryocooler includes a housing, a cooling sub-assembly, and a flange, wherein the cooling sub-assembly is disposed within the housing; the cryogenic region lies outside and is exposed to the housing; and the housing is in a first position and is thermally connected to the thermal shield; and moving the cryocooler from the first position to a second position such that the cryocooler is thermally disconnected from the thermal shield, wherein during moving, the cryogenic region remains substantially sealed; lowering a pressure within a region of the vessel adjacent to the cryocooler; heating the housing to a temperature in a range of approximately 250 to 350 K; removing a portion of the cryocooler from the housing of the cryocooler; and keeping the superconducting magnet energized during moving the cryocooler, changing the pressure, heating the housing, and removing the cooling sub-assembly. 11. The method of claim 10, further comprising: inserting the portion of the cryocooler into the housing; removing air from an interior space of the housing; moving the housing from the second position to the first position; and operating the cryocooler after removing air from the interior of the housing, wherein the cryogenic region remains substantially sealed during heating the housing, removing the cooling sub-assembly, inserting the cooling sub-assembly, removing the air, and moving the housing from the second position to the first position.