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A spaced, bumped component structure including a first plate, a second plate spaced from the first plate by a first gap, a plurality of solder bumps interconnecting the plates and defining the first gap; at least one of the plates having an anomalous section including one of a raised platform and re

A spaced, bumped component structure including a first plate, a second plate spaced from the first plate by a first gap, a plurality of solder bumps interconnecting the plates and defining the first gap; at least one of the plates having an anomalous section including one of a raised platform and recess for defining a second gap having a different size from the first gap.

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What is claimed is: 1. A spaced, bumped component structure comprising: a first plate; a second plate spaced from said first plate by a first gap; a plurality of solder bumps interconnecting said plates and defining said first gap; at least one of said plates having an anomalous section including o

What is claimed is: 1. A spaced, bumped component structure comprising: a first plate; a second plate spaced from said first plate by a first gap; a plurality of solder bumps interconnecting said plates and defining said first gap; at least one of said plates having an anomalous section including one of a raised platform and recess for defining a second gap having a different size from said first gap, in which the facing surfaces of said plates in said second gap are metallized and effect one of a capacitive sensor and a pair of coupled inductors. 2. The spaced, bumped component structure of claim 1 in which said one of said plates includes an anomalous section including a raised platform and said second gap is smaller than said first gap. 3. The spaced, bumped component structure of claim 1 in which said one of said plates includes an anomalous section having a recess and said second gap is larger than said first gap. 4. The spaced, bumped component structure of claim 1 in which each of said plates has a recess. 5. The spaced, bumped component structure of claim 1 in which one of said plates has a raised platform and the other a recess. 6. The spaced, bumped component structure of claim 1 in which said bumps are outside said anomalous sections. 7. The spaced, bumped component structure of claim 1 in which said plates include more than one anomalous section and said bumps are inside said anomalous sections. 8. The spaced, bumped component structure of claim 1 in which said bumps surround said anomalous sections. 9. The spaced, bumped component structure of claim 1 in which said at least one of said plates includes a relieved portion for partially receiving said bumps. 10. The spaced, bumped component structure of claim 1 in which said first and second plates include a conductive plate and a substrate, respectively. 11. The spaced, bumped component structure of claim 10 in which said conductive plate and said substrate include alumina. 12. The spaced, bumped component structure of claim 1 in which said plates include an integrated circuit chip and a substrate. 13. The spaced, bumped component structure of claim 12 in which said integrated circuit chip includes silicon and said substrate includes alumina. 14. The spaced, bumped component structure of claim 1 in which one of said plates includes a well portion proximate said second gap constituting a diaphragm. 15. The spaced, bumped component structure of claim 1 in which said metallized facing surfaces in said second gap effect a capacitive sensor. 16. The spaced, bumped component structure of claim 1 in which said metallized facing surfaces in said second gap are patterned to effect a pair of coupled inductors. 17. The spaced, bumped component structure of claim 1 further including a plurality of pillars between said plates at said anomalous section for fixing the dimension of said second gap. 18. A spaced, bumped component structure comprising: a first plate; a second plate spaced from said first plate by a first gap; a channel in at least one of said plates; and a plurality of solder bumps disposed in said channel interconnecting said plates and defining said first gap smaller than said bumps in which the facing surfaces of said plates in said first gap are metallized and effect at one of a capacitive sensor or a pair of coupled inductors. 19. The spaced, bumper component structure of claim 18 in which at least one of said plates has an anomalous section including one of a raised platform and recess for defining a second gap having a different size from said first gap. 20. The spaced, bumped component structure of claim 18 in which said one of said plates includes an anomalous section having a raised platform for defining a second gap that is smaller than said first gap. 21. The spaced, bumped component structure of claim 18 in which said one of said plates includes an anomalous section having a recess for defining a second gap that is larger than said first gap. 22. The spaced, bumped component structure of claim 18 in which each of said plates has a recess. 23. The spaced, bumped component structure of claim 18 in which one of said plates has a raised platform and the other a recess. 24. The spaced, bumped component structure of claim 19 in which said bumps are outside said anomalous sections. 25. The spaced, bumped component structure of claim 19 in which said plates include more than one anomalous section and said bumps are inside said anomalous sections. 26. The spaced, bumped component structure of claim 19 in which said bumps surround said anomalous section. 27. The spaced, bumped component structure of claim 18 in which said at least one of said plates includes a relieved portion for partially receiving said bumps. 28. The spaced, bumped component structure of claim 18 in which said plates include a conductive plate and a substrate. 29. The spaced, bumped component structure of claim 28 in which said conductive plate and said substrate include alumina. 30. The spaced, bumped component structure of claim 18 in which said plates include an integrated circuit chip and a substrate. 31. The spaced, bumped component structure of claim 30 in which said integrated circuit chip includes silicon and said substrate includes alumina. 32. The spaced, bumped component structure of claim 19 in which one of said plates includes a well portion proximate said second gap constituting a diaphragm. 33. The spaced, bumped component structure of claim 19 in which said metallized facing surfaces in said second gap effect a capacitive sensor. 34. The spaced, bumped component structure of claim 19 in which said metallized facing surfaces in said second gap are patterned to effect a pair of coupled inductors. 35. The spaced, bumped component structure of claim 19 further including a plurality of pillars between said plates at said anomalous section for fixing the dimension of said second gap. 36. A spaced, bumped component structure comprising: a first plate comprising a conductive plate; a second plate comprising a substrate and spaced from said first plate by a first gap, the conductive plate and said substrate comprising alumina; a plurality of solder bumps interconnecting said plates and defining said first gap; at least one of said plates having an anomalous section including one of a raised platform and recess for defining a second gap having a different size from said first gap. 37. A spaced, bumped component structure comprising: a first plate; a second plate spaced from said first plate by a first gap, wherein the plates include an integrated circuit chip comprising silicon, and a substrate comprising alumina; a plurality of solder bumps interconnecting said plates and defining said first gap; at least one of said plates having an anomalous section including one of a raised platform and recess for defining a second gap having a different size from said first gap. 38. A spaced, bumped component structure comprising: a first plate; a second plate spaced from the first plate by a first gap, wherein the plates include a conductive plate comprising alumina and a substrate comprising alumina; a channel in at least one of the plates; and a plurality of solder bumps disposed in said channel interconnecting the plates and defining said first gap smaller than said bumps. 39. A spaced, bumped component structure comprising: a first plate; a second plate spaced from the first plate by a first gap, wherein the plates comprise an integrated circuit chip comprising silicon, and a substrate comprising alumina; a channel in at least one of the plates; and a plurality of solder bumps disposed in said channel interconnecting said plates and defining said first gap smaller than said bumps.