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Wafer attracting plate 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • 13-03
출원번호 UP-0331222 (2009-01-22)
등록번호 US-D609652 (2010-04-02)
우선권정보 JP-2008-018761(2008-07-22)
발명자 / 주소
  • Nagasaka, Munetoshi
  • Ogasawara, Ikuo
  • Shinohara, Eiichi
출원인 / 주소
  • Tokyo Electron Limited
대리인 / 주소
    Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
인용정보 피인용 횟수 : 88  인용 특허 : 8

초록

초록이 없습니다.

대표청구항

CLAIM The ornamental design for wafer attracting plate, as shown and described.

이 특허에 인용된 특허 (8)

  1. Hayashi,Daisuke, Attracting disc for an electrostatic chuck for semiconductor production.
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  2. Sasaki,Yasuharu; Kosakai,Mamoru, Attracting plate of an electrostatic chuck for semiconductor manufacturing.
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  3. Weldon, Edwin C.; Collins, Kenneth S.; Donde, Arik; Lue, Brian; Maydan, Dan; Steger, Robert J.; Dyer, Timothy; Kumar, Ananda H.; Veytser, Alexander M.; Narendrnath, Kadthala R.; Kats, Semyon L.; Khol, Electrostatic chuck having composite dielectric layer and method of manufacture.
    상세보기
  4. Shamouilian Shamouil ; Kholodenko Arnold ; Kats Semyon ; Sherstinsky Semyon ; Clinton Jon ; Bedi Surinder, Electrostatic chuck with improved temperature control and puncture resistance.
    상세보기
  5. Sogard, Michael, Gas cooled electrostatic pin chuck for vacuum applications.
    상세보기
  6. Sun,Jennifer Y.; Thach,Senh; Dempster,James; Xu,Li; Pham,Thanh N., Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate.
    상세보기
  7. Yamaguchi, Akira; Tomita, Hideshi, Highly heat-resistant plasma etching electrode and dry etching device including the same.
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  8. Lee, Keum-Joo, Wafer spin drying apparatus with a plurality of supply nozzles and methods for using the same.
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이 특허를 인용한 특허 (88)

  1. Ootsuka, Fumio, 3D stacked multilayer semiconductor memory using doped select transistor channel.
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  2. He, Zhian, Anisotropic high resistance ionic current source (AHRICS).
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  3. Kagajwala, Burhanuddin; Buckalew, Bryan L.; Chua, Lee Peng; Berke, Aaron; Rash, Robert; Mayer, Steven T., Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity.
    상세보기
  4. Oosterlaken, Theodorus; de Ridder, Chris; Jdira, Lucian, Apparatus and method for manufacturing a semiconductor device.
    상세보기
  5. Kamiya, Tatsuo, Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum.
    상세보기
  6. Buckalew, Bryan L.; Mayer, Steven T.; Porter, David; Ponnuswamy, Thomas A., Apparatus for advanced packaging applications.
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  7. Buckalew, Bryan L.; Mayer, Steven T.; Porter, David; Ponnuswamy, Thomas A., Apparatus for advanced packaging applications.
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  8. den Hartog Besselink, Edwin; Garssen, Adriaan; Dirkmaat, Marco, Cassette holder assembly for a substrate cassette and holding member for use in such assembly.
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  9. Zaitsu, Masaru; Fukazawa, Atsuki; Fukuda, Hideaki, Continuous process incorporating atomic layer etching.
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  10. He, Zhian; Zhou, Jian; Feng, Jingbin; Reid, Jonathan D.; Ghongadi, Shantinath, Control of electrolyte flow dynamics for uniform electroplating.
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  11. Mayer, Steven T.; Porter, David W., Control of electrolyte hydrodynamics for efficient mass transfer during electroplating.
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  12. Mayer, Steven T.; Porter, David W., Control of electrolyte hydrodynamics for efficient mass transfer during electroplating.
    상세보기
  13. Mayer, Steven T.; Porter, David W.; Goh, Edwin; Buckalew, Bryan L.; Rash, Robert, Control of electrolyte hydrodynamics for efficient mass transfer during electroplating.
    상세보기
  14. Abraham, Richard; Mayer, Steven T.; Buckalew, Bryan L.; Rash, Robert, Cross flow manifold for electroplating apparatus.
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  15. Abraham, Richard; Mayer, Steven T.; Buckalew, Bryan L.; Rash, Robert, Cross flow manifold for electroplating apparatus.
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  16. Raisanen, Petri; Shero, Eric; Haukka, Suvi; Milligan, Robert Brennan; Givens, Michael Eugene, Deposition of metal borides.
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  17. Zhu, Chiyu; Shrestha, Kiran; Haukka, Suvi, Deposition of metal borides.
    상세보기
  18. Motoyama, Yutaka; Fukushima, Kohei, Dummy wafer.
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  19. Motoyama, Yutaka; Fukushima, Kohei, Dummy wafer.
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  20. Motoyama, Yutaka; Fukushima, Kohei, Dummy wafer.
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  21. Graham, Gabriel Hay; Hiester, Jacob Lee; Chua, Lee Peng; Buckalew, Bryan L., Dynamic modulation of cross flow manifold during electroplating.
    상세보기
  22. Graham, Gabriel Hay; Buckalew, Bryan L.; Mayer, Steven T.; Rash, Robert; Fortner, James Isaac; Chua, Lee Peng, Edge flow element for electroplating apparatus.
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  23. Fukushima, Makoto; Yasuda, Hozumi; Nabeya, Osamu; Watanabe, Katsuhide; Namiki, Keisuke, Elastic membrane for semiconductor wafer polishing.
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  24. Fukushima, Makoto; Yasuda, Hozumi; Nabeya, Osamu; Watanabe, Katsuhide; Namiki, Keisuke, Elastic membrane for semiconductor wafer polishing.
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  25. Nagakubo, Keiichi, Electrode member for a plasma processing apparatus.
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  26. Kuwabara, Yusei; Nagakubo, Keiichi, Electrode plate for a plasma processing apparatus.
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  27. Jang, Hyun Soo; Lee, Jeong Ho; Kim, Young Hoon; Kim, Jong Su, Electrode plate for semiconductor manufacturing apparatus.
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  28. Mayer, Steven T.; Porter, David; Rash, Robert, Electroplating flow shaping plate having offset spiral hole pattern.
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  29. Smith, Eryn, Electrostatic carrier tray.
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  30. Mayer, Steven T.; Buckalew, Bryan L.; Fu, Haiying; Ponnuswamy, Thomas; Diaz Camilo, Hilton; Rash, Robert; Porter, David W., Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating.
    상세보기
  31. Mayer, Steven T.; Buckalew, Bryan L.; Fu, Haiying; Ponnuswamy, Thomas; Diaz Camilo, Hilton; Rash, Robert; Porter, David W., Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating.
    상세보기
  32. Wang, Qunhua; Tiner, Robin L., Flow blocker plate.
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  33. Kuwabara, Yusei; Nagakubo, Keiichi, Focusing ring.
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  34. Kuwabara, Yusei; Nagakubo, Keiichi, Focusing ring.
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  35. Mizukami, Shunsuke, Focusing ring.
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  36. Yoshimura, Akihiro; Miyagawa, Masaaki; Sato, Tetsuji, Focusing ring.
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  37. Milligan, Robert Brennan, Formation of boron-doped titanium metal films with high work function.
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  38. Jang, Hyun Soo; Lee, Jeong Ho; Kim, Young Hoon; Jeon, Young Hyo, Gas dispersing plate for semiconductor manufacturing apparatus.
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  39. Root, Bryan J.; Funk, William A., Grooved wire support for a probe test core.
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  40. Aida, Koei, Heater block.
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  41. Akana, Jody; Andre, Bartley K.; Aoyagi, Shota; Bataillou, Jeremy; Coster, Daniel J.; De Iuliis, Daniele; Hankey, M. Evans; Hill, Matthew David; Hoenig, Julian; Howarth, Richard P.; Ive, Jonathan P.; Kerr, Duncan Robert; Kole, Jared; Mag, Stefan; Merz, Nicholas George LeBreton; Myers, Scott A.; Pope, Benjamin J.; Rao, Matthew; Rohrbach, Matthew Dean; Russell-Clarke, Peter; Silvanto, Mikael; Stringer, Christopher J.; Tan, Tang Yew; Whang, Eugene Antony; Zörkendörfer, Rico, Input for an electronic device.
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  42. Mori, Yoshinobu; Okabe, Akira, Lid for epitaxial growing device.
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  43. Mayer, Steven; Feng, Jingbin; He, Zhian; Reid, Jonathan; Varadarajan, Seshasayee, Method and apparatus for electroplating.
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  44. Mayer, Steven; Feng, Jingbin; He, Zhian; Reid, Jonathan; Varadarajan, Seshasayee, Method and apparatus for electroplating.
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  45. Mayer, Steven; Feng, Jingbin; He, Zhian; Reid, Jonathan; Varadarajan, Seshasayee, Method and apparatus for electroplating.
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  46. Reid, Jonathan; Buckalew, Bryan; He, Zhian; Park, Seyang; Varadarajan, Seshasayee; Pennington, Bryan; Ponnuswamy, Thomas; Breling, Patrick; Ibarreta, Glenn; Mayer, Steven, Method and apparatus for electroplating.
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  47. Pore, Viljami, Method and apparatus for filling a gap.
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  48. Pore, Viljami; Knaepen, Werner; Jongbloed, Bert; Pierreux, Dieter; Van Aerde, Steven R. A.; Haukka, Suvi; Fukuzawa, Atsuki; Fukuda, Hideaki, Method and apparatus for filling a gap.
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  49. Pore, Viljami; Knaepen, Werner; Jongbloed, Bert; Pierreux, Dieter; Van Der Star, Gido; Suzuki, Toshiya, Method and apparatus for filling a gap.
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  50. Suemori, Hidemi, Method for depositing dielectric film in trenches by PEALD.
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  51. Kang, DongSeok, Method for depositing thin film.
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  52. Takamure, Noboru; Okabe, Tatsuhiro, Method for forming Ti-containing film by PEALD using TDMAT or TDEAT.
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  53. Shiba, Eiichiro, Method for forming aluminum nitride-based film by PEALD.
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  54. Fukazawa, Atsuki, Method for forming conformal nitrided, oxidized, or carbonized dielectric film by atomic layer deposition.
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  55. Fukazawa, Atsuki; Fukuda, Hideaki; Takamure, Noboru; Zaitsu, Masaru, Method for forming dielectric film in trenches by PEALD using H-containing gas.
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  56. Kimura, Yosuke; de Roest, David, Method for forming film having low resistance and shallow junction depth.
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  57. Ishikawa, Dai; Fukazawa, Atsuki, Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches.
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  58. Namba, Kunitoshi, Method for forming silicon oxide cap layer for solid state diffusion process.
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  59. Shiba, Eiichiro, Method for performing uniform processing in gas system-sharing multiple reaction chambers.
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  60. Yamagishi, Takayuki; Suwada, Masaei; Tanaka, Hiroyuki, Method for positioning wafers in multiple wafer transport.
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  61. Kato, Richika; Nakano, Ryu, Method for protecting layer by forming hydrocarbon-based extremely thin film.
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  62. Kato, Richika; Okuro, Seiji; Namba, Kunitoshi; Nonaka, Yuya; Nakano, Akinori, Method for protecting layer by forming hydrocarbon-based extremely thin film.
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  63. Zaitsu, Masaru, Method of atomic layer etching using functional group-containing fluorocarbon.
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  64. Zaitsu, Masaru; Kobayashi, Nobuyoshi; Kobayashi, Akiko; Hori, Masaru; Kondo, Hiroki; Tsutsumi, Takayoshi, Method of cyclic dry etching using etchant film.
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  65. Mayer, Steven T; Reid, Jonathan D., Method of electroplating using a high resistance ionic current source.
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  66. Knaepen, Werner; Maes, Jan Willem; Jongbloed, Bert; Kachel, Krzysztof Kamil; Pierreux, Dieter; De Roest, David Kurt, Method of forming a structure on a substrate.
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  67. Lee, Choong Man; Yoo, Yong Min; Kim, Young Jae; Chun, Seung Ju; Kim, Sun Ja, Method of forming metal interconnection and method of fabricating semiconductor apparatus using the method.
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  68. Chun, Seung Ju; Yoo, Yong Min; Choi, Jong Wan; Kim, Young Jae; Kim, Sun Ja; Lim, Wan Gyu; Min, Yoon Ki; Lee, Hae Jin; Yoo, Tae Hee, Method of processing a substrate and a device manufactured by using the method.
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  69. Kohen, David; Profijt, Harald Benjamin, Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures.
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  70. Raisanen, Petri; Givens, Michael Eugene, Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures.
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  71. Zhu, Chiyu; Asikainen, Timo; Milligan, Robert Brennan, NbMC layers.
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  72. Mayer, Steven; Ghongadi, Shantinath; Ganesan, Kousik; He, Zhian; Feng, Jingbin, Plating method and apparatus with multiple internally irrigated chambers.
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  73. Margetis, Joe; Tolle, John; Bartlett, Gregory; Bhargava, Nupur, Process for forming a film on a substrate using multi-port injection assemblies.
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  74. Alokozai, Fred; Milligan, Robert Brennan, Process gas management for an inductively-coupled plasma deposition reactor.
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  75. Feng, Jingbin; Stowell, Marshall, Segmented electroplating anode and anode segment.
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  76. Zhu, Chiyu, Selective film deposition method to form air gaps.
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  77. Kim, Young Jae; Choi, Seung Woo; Yoo, Yong Min, Semiconductor device and manufacturing method thereof.
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  78. Arai, Izumi, Single-and dual-chamber module-attachable wafer-handling chamber.
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  79. Xie, Qi; de Roest, David; Woodruff, Jacob; Givens, Michael Eugene; Maes, Jan Willem; Blanquart, Timothee, Source/drain performance through conformal solid state doping.
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  80. Tolle, John, Structures and devices including germanium-tin films and methods of forming same.
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  81. Choi, Seung Woo; Noh, Hyung Wook; Woo, Jeong Jun; Kim, Dae Youn; Jang, Hyun Soo, Substrate supporter for semiconductor deposition apparatus.
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  82. Jang, Hyun Soo; Kim, Dae Youn; Lee, Jeong Ho; Lee, Seung Seob; Kwon, Hak Yong, Substrate supporter for semiconductor deposition apparatus.
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  83. Funk, William A.; Flanders, Dennis; Dunklee, John L.; Root, Bryan J., Support for a probe test core.
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  84. Jeong, Sang Jin; Han, Jeung Hoon; Choi, Young Seok; Park, Ju Hyuk, Susceptor for semiconductor substrate processing apparatus.
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  85. Yamagishi, Takayuki; Sato, Kazuo; Tsuji, Naoto, Top plate.
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  86. Morisaki, Eisuke; Machiyama, Wataru; Kobayashi, Hirokatsu; Harashima, Masayuki; Sano, Yukio, Wafer holder for manufacturing semiconductor.
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  87. Tamaso, Hideto, Wafer holder for stepper.
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  88. Nguyen, Phuong Van, Wafer polishing pad holder.
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