초록 ▼

A cathodic protection coating is disclosed that unexpectedly protects a treated metal substrate, notwithstanding the presence of a phosphate-containing conversion coating between the metal substrate and the cathodic protection compound. The cathodic protection coating includes sacrificial metallic p

A cathodic protection coating is disclosed that unexpectedly protects a treated metal substrate, notwithstanding the presence of a phosphate-containing conversion coating between the metal substrate and the cathodic protection compound. The cathodic protection coating includes sacrificial metallic particles less noble than metal in the metal substrate to be protected. The coating also includes inherently conductive polymer.

대표청구항 ▼

What is claimed is: 1. A method of using a cathodic protection compound to protect a metal substrate, comprising the step of applying a coating of the cathodic protection compound to a surface of a metal substrate that has been treated with a phosphate-containing conversion coating, wherein the cat

What is claimed is: 1. A method of using a cathodic protection compound to protect a metal substrate, comprising the step of applying a coating of the cathodic protection compound to a surface of a metal substrate that has been treated with a phosphate-containing conversion coating, wherein the cathodic protection coating comprises (a) an electrically effective amount of inherently conductive polymer; (b) an electrically effective amount of metal particles wherein the metal is less noble than metal of the metal substrate; and (c) binder. 2. A treated metal substrate comprising: (a) metal, (b) phosphate-containing conversion coating on the metal, and (c) cathodic protection coating on the phosphate-containing conversion coating, wherein the cathodic protection coating comprises (a) an electrically effective amount of inherently conductive polymer; (b) an electrically effective amount of metal particles wherein the metal is less noble than metal of the metal substrate; and (c) binder. 3. The substrate of claim 2, wherein the binder comprises a flowable material comprising a film-forming liquid, an amorphous solid, a powder, or a vapor. 4. The substrate of claim 2, wherein the metal particles have an average particle size ranging from about 0.2 to about 25 μm and have a particle shape ranging from spheres to platelets. 5. The substrate of claim 2, wherein the substrate comprises iron and the metal particles are selected from the group consisting of zinc, aluminum, tin, and combinations thereof. 6. The substrate of claim 3, wherein the flowable material is electrically inactive and a polymer made from one or more of olefins, acrylics, epoxies, urethanes, alkyds, uv-curable or electron-beam curable acrylates, polyvinyl chloride, polyester, polyvinyl alcohol, ethylene vinyl acetate, ionomers of ethylene acrylic acid, fluoropolymers, polymers of silicone, phenolic resins, melamine, polyamide, natural and synthetic rubbers, styrenic block copolymers, polyacrylamide, polyvinyloxazoline, and polyethylenimine. 7. The substrate of claim 6, wherein the polymer is adhesive. 8. The substrate of claim 3, wherein the flowable material is electrically active and includes carbon fibers, carbon particles, carbon nanotubes, and combinations thereof. 9. The substrate of claim 3, wherein the flowable material is electrically active and includes an inherently conductive polymer. 10. The substrate of claim 9, wherein the inherently conductive polymer comprises polymers having repeating monomeric units of aniline, thiophene, pyrrole, phenyl mercaptan, and combinations thereof. 11. The substrate of claim 9, wherein the inherently conductive polymer is selected from the group consisting of substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polyanilines, substituted and unsubstituted polyazines, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted poly-p-phenylene sulfides, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted polyacetylenes, mixtures thereof, and copolymers thereof. 12. The substrate of claim 9, wherein the inherently conductive polymer is substituted or unsubstituted polyaniline.