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Probes of a probe card assembly can be adjusted with respect to an element of the probe card assembly, which can be an element of the probe card assembly that facilitates mounting of the probe card assembly to a test apparatus. The probe card assembly can then be mounted in a test apparatus, and an

Probes of a probe card assembly can be adjusted with respect to an element of the probe card assembly, which can be an element of the probe card assembly that facilitates mounting of the probe card assembly to a test apparatus. The probe card assembly can then be mounted in a test apparatus, and an orientation of the probe card assembly can be adjusted with respect to the test apparatus, such as a structural part of the test apparatus or a structural element attached to the test apparatus.

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What is claimed is: 1. A probe card assembly comprising: a plurality of probes disposed on a rigid probe substrate and arranged to contact terminals of an electronic device to be tested while the probe card assembly is attached to a test station; a reference structure; a first adjustment mechanism

What is claimed is: 1. A probe card assembly comprising: a plurality of probes disposed on a rigid probe substrate and arranged to contact terminals of an electronic device to be tested while the probe card assembly is attached to a test station; a reference structure; a first adjustment mechanism coupled to the probe substrate and to the reference structure, the first adjustment mechanism comprising first adjustment elements that vary an orientation of the probes with respect to the reference structure; a mounting structure positioned to contact a second structure of the test station; and a second adjustment mechanism coupled to the mounting structure and to the reference structure, the second adjustment mechanism comprising second adjustment elements that vary, while the probe card assembly is attached to the test station, an orientation of the reference structure with respect to the second structure of the test station. 2. The probe card assembly of claim 1, wherein the second adjustment mechanism comprises a plurality of actuators disposed on the reference structure and oriented to apply forces to the mounting structure. 3. The probe card assembly of claim 2, wherein the second adjustment mechanism further comprises means for biasing the reference structure in opposition to the forces applied by the actuators. 4. The probe card assembly of claim 2, wherein the second adjustment mechanism further comprises means for receiving biasing forces from the means for biasing the reference structure in opposition to the forces applied by the actuators. 5. The probe card assembly of claim 1, wherein the second adjustment mechanism comprises a plurality of actuators disposed on the mounting structure and oriented to apply forces to the reference structure. 6. The probe card assembly of claim 5, wherein the second adjustment mechanism further comprises means for biasing the reference structure in opposition to the forces applied by the actuators. 7. The probe card assembly of claim 5, wherein the second adjustment mechanism further comprises means for receiving biasing forces from the means for biasing the reference structure in opposition to the forces applied by the actuators. 8. The probe card assembly of claim 1 further comprising an electrical interface to a tester, wherein ones of the probes are electrically connected to the interface. 9. A probe card assembly comprising: a plurality of probes disposed on a rigid probe substrate and arranged to contact terminals of an electronic device to be tested while the probe card assembly is attached to a test station; a reference structure; a first adjustment mechanism coupled to the probe substrate and to the reference structure, the first adjustment mechanism comprising first adjustment elements that vary an orientation of the probes with respect to the reference structure of the probe card assembly; a mounting structure positioned to contact a second structure of the test station; and a second adjustment mechanism coupled to the mounting structure and to the reference structure, the second adjustment mechanism comprising second adjustment elements that vary, while the probe card assembly is attached to the test station, an orientation of the reference structure with respect to the second structure of the test station; and a digital memory device configured to store digital data representing a predetermined orientation of the probe card assembly with respect to the test station. 10. The probe card assembly of claim 9, wherein the predetermined orientation comprises an orientation of the probe card assembly with respect to the test station previously determined to planarize the probes with terminals of the electronic device as disposed in a test position in the test station. 11. A probe card assembly comprising: a plurality of probes disposed on a rigid probe substrate and arranged to contact terminals of an electronic device to be tested while the probe card assembly is attached to a test station; a reference structure; a first adjustment mechanism coupled to the probe substrate and to the reference structure, the first adjustment mechanism comprising first adjustment elements that vary an orientation of the probes with respect to the reference structure of the probe card assembly; a mounting structure positioned to contact a second structure of the test station; and a second adjustment mechanism coupled to the mounting structure and to the reference structure, the second adjustment mechanism comprising second adjustment elements that vary, while the probe card assembly is attached to the test station, an orientation of the probe card assembly with respect to the second structure of the test station; and a wireless transmitting device configured to transmit digital data to a controller configured to control the second adjustment mechanism. 12. The probe card assembly of claim 1, wherein the electronic device comprises one or more dies of an unsingulated semiconductor wafer. 13. The probe card assembly of claim 1, wherein the electronic device comprises one or more singulated semiconductor dies. 14. A probe card assembly comprising: a plurality of probes disposed on a rigid probe substrate and arranged to contact terminals of an electronic device to be tested while the probe card assembly is attached to a test station; first adjusting means for adjusting an orientation of the probes with respect to a reference structure of the probe card assembly; mounting means for mounting the probe card assembly to the test station; and second adjusting means for adjusting an orientation of the reference structure with respect to a structure of the test station while the probe card assembly is attached to the test station. 15. The probe card assembly of claim 14, wherein the mounting means comprises means for attaching the probe card assembly to the test station. 16. The probe card assembly of claim 14, wherein the second adjusting means comprises means for adjusting the orientation of the probe card assembly relative to a reference structure of the test station. 17. The probe card assembly of claim 16, wherein the second adjusting means comprises means for connecting to the reference structure of the test station.