IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
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| 국제특허분류(IPC7판) |
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| 출원번호 |
UP-0779183
(2007-07-17)
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| 등록번호 |
US-7675301
(2010-04-21)
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발명자
/ 주소 |
- Eldridge, Benjamin N.
- Wenzel, Stuart W.
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| 출원인 / 주소 |
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| 대리인 / 주소 |
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| 인용정보 |
피인용 횟수 :
3 인용 특허 :
56 |
초록
▼
An electronic component is disclosed, having a plurality of microelectronic spring contacts mounted to a planar face of the component. Each of the microelectronic spring contacts has a contoured beam, which may be formed of an integral layer of resilient material deposited over a contoured sacrifici
An electronic component is disclosed, having a plurality of microelectronic spring contacts mounted to a planar face of the component. Each of the microelectronic spring contacts has a contoured beam, which may be formed of an integral layer of resilient material deposited over a contoured sacrificial substrate, and comprises a base mounted to the planar face of the component, a beam connected to the base at a first end of the beam, and a tip positioned at a free end of the beam opposite to the base. The beam has an unsupported span between its free end and its base. The microelectronic spring contacts are advantageously formed by depositing a resilient material over a molded, sacrificial substrate. The spring contacts may be provided with various innovative contoured shapes. In various embodiments of the invention, the electronic component comprises a semiconductor die, a semiconductor wafer, a LGA socket, an interposer, or a test head assembly.
대표청구항
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What is claimed is: 1. An electronic component, comprising: at least one face; a plurality of microelectronic spring contacts mounted to said at least one face, each of said plurality of microelectronic spring contacts comprising a base mounted to said at least one face, a beam integral with said b
What is claimed is: 1. An electronic component, comprising: at least one face; a plurality of microelectronic spring contacts mounted to said at least one face, each of said plurality of microelectronic spring contacts comprising a base mounted to said at least one face, a beam integral with said base and extending along a length thereof from a side of said base away from said at least one face, a free end of said beam opposite to said base, and a contact tip adjacent to said free end of said beam, wherein said beam has an unsupported span between said free end and said base, and wherein each of said microelectronic spring contacts comprises an integral layer of resilient material, wherein said beam comprises a contoured sheet like shape: a thickness of said beam decreases from said base to said free end of said beam, and a width of said beam decreases from said base to said free end of said beam. 2. The electronic component of claim 1, wherein said electronic component further comprises a die cut from a semiconductor wafer, said die comprising an integrated circuit having a plurality of terminals on said at least one face thereof, wherein selected ones of said plurality of microelectronic spring contacts are connected to selected ones of said plurality of terminals. 3. The electronic component of claim 1, wherein said electronic component further comprises a semiconductor wafer, said wafer comprising a plurality of integrated circuits having a plurality of terminals on said at least one face thereof, wherein selected ones of said plurality of microelectronic spring contacts are connected to selected ones of said plurality of terminals. 4. The electronic component of claim 1, wherein said electronic component further comprises an integrated circuit socket, said socket comprising a back surface opposing said at least one face, said back surface having a plurality of terminals, wherein selected ones of said plurality of microelectronic springs are connected to selected ones of said terminals. 5. The electronic component of claim 1, wherein said electronic component further comprises an interposer, said interposer comprising a substrate having a second surface opposing said at least one face; and a second plurality of microelectronic spring contacts mounted to said second surface, each of said second plurality of microelectronic spring contacts comprising a base mounted to said at least one face, a contoured essentially sheet-like beam integral with said base and extending from a side of said base away from said at least one face, and free end of said beam opposite to said base, wherein said beam has an unsupported span between said tip and said base, and wherein each of said microelectronic spring contacts comprises an integral layer of resilient material; wherein ones of said second plurality of microelectronic spring contacts are connected to ones of said plurality of microelectronic spring contacts on said at least one face. 6. The electronic component of claim 5, wherein said electronic component further comprises a test head assembly, said assembly comprising: a fixture, said interposer supported by said fixture; and a contactor coupled to said interposer. 7. The electronic component of claim 1, wherein said electronic component further comprises a test head assembly, said assembly comprising: a fixture; a contactor supported by said fixture, said contactor comprising said at least one face; and said at least one face of said contactor being placed in contact with at least one of said microelectronic spring contacts. 8. The electronic component of claim 1, wherein said beam, viewed in a direction normal to said substrate surface, is tapered so as to have a generally triangular shape. 9. The electronic component of claim 1, wherein each of said microelectronic spring contacts is formed by depositing the integral layer of resilient material on a sacrificial layer using a method selected from electroplating, electroless plating, sputtering, chemical vapor deposition, or physical vapor deposition. 10. The electronic component of claim 1, wherein said beam, viewed in a direction normal to said substrate surface, has an offset with respect to a central axis. 11. The electronic component of claim 1, wherein said beam, in a lengthwise sectional view, has an arcuate shape. 12. The electronic component of claim 1, wherein said beam, in a lengthwise sectional view, has a corrugated shape. 13. The electronic component of claim 1, wherein said beam, in a lengthwise sectional view, has a stepped portion near the base. 14. The electronic component of claim 1, wherein said beam, in a cross sectional view, is generally V-shaped. 15. The electronic component of claim 1, wherein said beam, in a cross sectional view, is generally U-shaped. 16. An electronic component, comprising: at least one face; a plurality of microelectronic spring contacts mounted to said at least one face, each of said plurality of microelectronic spring contacts comprising a base mounted to said at least one face, a contoured beam integral with said base and extending from a side of said base away from said at least one face, and a free end of said beam opposite to said base, wherein said beam has an unsupported span between said free end and said base, and wherein each of said microelectronic spring contacts comprises an integral layer of resilient material, wherein said spring includes a lengthwise rib extending over at least a portion of the beam, and wherein said lengthwise rib comprises a lengthwise channel that extends into a first surface of the beam and out of a second surface of the beam, the second surface being opposite the first surface. 17. The electronic component of claim 16, wherein said beam, in a lengthwise sectional view, has a stepped portion adjacent the base, and wherein said lengthwise rib extends to said stepped portion. 18. The electronic component of claim 16, wherein said lengthwise rib extends to said base. 19. The electronic component of claim 16, wherein said lengthwise rib extends into said base. 20. The electronic component of claim 16, wherein said lengthwise channel has a regular geometric cross-sectional shape. 21. The electronic component of claim 20, wherein said regular geometric cross-sectional shape is a shape selected from the group consisting of part-rectangular, part-trapezoidal, part-triangular and part-round shapes. 22. The electronic component of claim 16, wherein the cross-sectional dimensions of said lengthwise rib are similar over the length thereof. 23. An electronic component, comprising: at least one face; a plurality of microelectronic spring contacts mounted to said at least one face, each of said plurality of microelectronic spring contacts comprising a base mounted to said at least one face, a contoured beam integral with said base and extending from a side of said base away from said at least one face, and a free end of said beam opposite to said base, wherein said beam has an unsupported span between said free end and said base, and wherein each of said microelectronic spring contacts comprises an integral layer of resilient material, wherein said spring includes a lengthwise rib extending over at least a portion of the beam, wherein a cross-sectional dimension of said lengthwise rib differs over the length thereof.
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