초록 ▼

A method of increasing manufacturing efficiency of printed wiring boards is provided that includes packaging a photosensitive film roll with a resin case, wherein the photosensitive film roll is formed, by winding around a core, a photosensitive film that comprises a supporting film and a photosensi

A method of increasing manufacturing efficiency of printed wiring boards is provided that includes packaging a photosensitive film roll with a resin case, wherein the photosensitive film roll is formed, by winding around a core, a photosensitive film that comprises a supporting film and a photosensitive resin composition layer formed on the supporting film, wherein the photosensitive resin composition layer comprises a photosensitive resin composition that contains a binder polymer and a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule and a photopolymerization initiator, and wherein the resin case consists of a resin having a lower surface energy than the photosensitive resin composition.

대표청구항 ▼

The invention claimed is: 1. A method of increasing manufacturing efficiency of printed wiring boards, comprising the steps of: packaging a photosensitive film roll with a resin case; wherein the photosensitive film roll is formed, by winding around a core, a photosensitive film that comprises a su

The invention claimed is: 1. A method of increasing manufacturing efficiency of printed wiring boards, comprising the steps of: packaging a photosensitive film roll with a resin case; wherein the photosensitive film roll is formed, by winding around a core, a photosensitive film that comprises a supporting film and a photosensitive resin composition layer formed on the supporting film, wherein the photosensitive resin composition layer comprises a photosensitive resin composition that contains: a binder polymer that is a copolymer comprising components selected from the group consisting of (i) at least methacrylic acid alkyl ester and methacrylic acid as monomers, (ii) at least methacrylic acid alkyl ester and acrylic acid as monomers, (iii) at least acrylic acid alkyl ester and methacrylic acid as monomers, and (iv) at least acrylic acid alkyl ester and acrylic acid as monomers, and a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule and a photopolymerization initiator, and wherein the resin case consists of a resin having a lower surface energy than the photosensitive resin composition. 2. A method as recited by claim 1, wherein the surface energy of the resin of the resin case is 18 to 37 dyne/cm, and the photosensitive resin composition layer is soft and exhibits tackiness at room temperature and the photosensitive film is suitable for use in manufacturing a printed wiring board. 3. A method as recited by claim 1, wherein the photosensitive film is suitable for use in manufacturing a printed wiring board. 4. A method as recited by claim 1, wherein the photosensitive film further comprises a protective film on top of and covering the photosensitive resin composition layer. 5. A method as recited by claim 4, wherein at least one of the supporting film and the protective film consist of a polyolefin film; and the resin case is a polyolefin case. 6. A method as recited by claim 5, wherein the polyolefin film and the polyolefin case consists of the same or different polyolefins, and the polyolefins are selected from a group consisting of polyethylenes, polypropylenes and polyethylene-polypropylenes. 7. A method as recited by claim 1, wherein the binder polymer is a copolymer comprising at least methacrylic acid alkyl ester and methacrylic acid as monomers. 8. A method as recited by claim 7, wherein the binder polymer further comprises a vinyl monomer. 9. A method as recited by claim 1, wherein the resin case is a reusable and collapsible resin case that is collapsible without generating any waste materials that must be thrown away after the case is collapsed, and the method further comprises the step of: after using the photosensitive film roll to manufacture a printed wiring board, collapsing the reusable resin case without generating any waste materials. 10. A method as recited by claim 9, wherein when the reusable resin case is collapsed, no dust is generated. 11. A method as recited by claim 10, further comprising the step of: reusing the resin case to package another photosensitive film roll. 12. A method as recited by claim 9, further comprising the step of: reusing the resin case to package another photosensitive film roll. 13. A method as recited by claim 1, further comprising the step of: disposing the photosensitive film roll inside a light blocking plastic bag when packaging the photosensitive film roll with the resin case. 14. A method as recited by claim 13, wherein the plastic bag is a polyolefin plastic bag. 15. A method as recited by claim 14, wherein the polyolefin plastic bag consists of a polyolefin selected from a group consisting of polyethylenes, polypropylenes and polyethylene-polypropylenes. 16. A method as recited by claim 1, wherein the resin case is a reusable and collapsible resin case that is collapsible without generating any waste materials that must be thrown away after the case is collapsed, and the method further comprises the step of: unpackaging the photosensitive film roll and using the photosensitive film roll to manufacture a printed wiring board, and collapsing the reusable resin case without generating any waste materials. 17. A method as recited by claim 16, wherein when the reusable resin case is collapsed, no dust is generated. 18. A method as recited by claim 16, further comprising the step of: reusing the resin case to package another photosensitive film roll. 19. A method of increasing manufacturing efficiency of printed wiring boards, comprising the steps of: (a) forming a first photosensitive film roll by winding, around a core, a photosensitive film comprising a supporting film and a photosensitive resin composition layer formed on the supporting film, wherein the photosensitive resin composition layer is soft and exhibits tackiness at room temperature and the photosensitive film is suitable for use in manufacturing a printed wiring board; (b) packaging the first photosensitive film roll with a reusable resin case, wherein the resin case is collapsible without generating any waste materials that must be thrown away after the case is collapsed; (c) unpackaging the first photosensitive film roll and using the first photosensitive film roll to manufacture a first printed circuit board, and collapsing the resin case without generating any waste materials including dust; and (d) reusing the resin case to package a second photosensitive film roll suitable for use in manufacturing a printed wiring board, wherein the photosensitive resin composition layer comprises a photosensitive resin composition containing a binder polymer and a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule and a photopolymerization initiator; and wherein the resin case consists of a resin having a lower surface energy than the photosensitive resin composition and the binder polymer is a copolymer comprising components selected from the group consisting of (i) at least methacrylic acid alkyl ester and methacrylic acid as monomers, (ii) at least methacrylic acid alkyl ester and acrylic acid as monomers, (iii) at least acrylic acid alkyl ester and methacrylic acid as monomers, and (iv) at least acrylic acid alkyl ester and acrylic acid as monomers, and the surface energy of the resin of the resin case is 18 to 37 dyne/cm. 20. A method as recited by claim 19, further comprising the step of: (e) unpackaging the second photosensitive film roll and using the second photosensitive film roll to manufacture a second printed circuit board.