초록 ▼

A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly h

A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. The resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of a layered silicate inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of up to 17×10−3 [° C.−1 ] over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

대표청구항 ▼

The invention claimed is: 1. A resin composition containing: 100 parts by weight of a thermosetting resin being at least one selected from the group consisting of an epoxy resin, a thermosetting modified polyphenylene ether resin, a thermosetting polyimide resin, a silicone resin, a benzoxazine res

The invention claimed is: 1. A resin composition containing: 100 parts by weight of a thermosetting resin being at least one selected from the group consisting of an epoxy resin, a thermosetting modified polyphenylene ether resin, a thermosetting polyimide resin, a silicone resin, a benzoxazine resin, and a melamine resin; 0.1-65 parts by weight of an inorganic compound; and one or more curing agents, catalysts or initiators, as required to increase the molecular weight of the thermosetting resin and finally form a cured product of the resin composition having a three-dimensional network structure, wherein said inorganic compound comprises a layered silicate being dispersed in the thermosetting resin such that stacks of the layered silicate have a mean interlayer spacing of between 3 to 5 nm along (001) plane within said cured product; and wherein said cured product has a mean linear expansion coefficient (α2) of up to 17×10−5(° C.−1) over a temperature range of from 10° C. higher than a glass transition temperature of said cured product to a temperature 50° C. higher than the glass transition temperature of said cured product. 2. The resin composition as recited in claim 1, wherein said cured product has a mean linear expansion coefficient ratio (α2/α1) of up to 2, where said mean linear expansion coefficient ratio is calculated by dividing the mean linear expansion coefficient (α2) over the temperature range from a temperature 10° C. higher than the glass transition temperature of said cured product of said resin composition to a temperature 50° C. higher than the glass transition temperature of the cured product of said resin composition by a mean linear expansion coefficient (α1) over the temperature range from a temperature 50° C. lower than the glass transition temperature of said cured product to a temperature 10° C. lower than the glass transition temperature of said cured product. 3. The resin composition as recited in claim 1, wherein said cured product has a mean linear expansion coefficient which does not exceed 10×10−5 (° C.−1) over the 50-100° C. temperature range and which does not exceed 25×10−5 (° C.−1) over the 200-240° C. temperature range. 4. The resin composition as recited in claim 1, wherein said cured product has a mean linear expansion coefficient ratio (1) of up to 2.5 and a mean linear expansion coefficient ratio (2) of up to 4.5, where the former ratio is calculated by dividing a mean linear expansion coefficient over the 150-200° C. temperature range by the mean linear expansion coefficient over the 50-100° C. temperature range and the latter ratio is calculated by dividing a mean linear expansion coefficient over the 250-300° C. temperature range by the mean linear expansion coefficient over the 50-100° C. temperature range. 5. The resin composition as recited in claim 1, wherein said cured product has a rate of change of up to 5%, where the rate of change is calculated by dividing a change in length of a resin piece comprised of said cured product when heated from 25-300° C. by a length of said resin piece at 25° C. 6. The resin composition as recited in claim 1, wherein said cured product has a value of up to 1.05 for a mean linear expansion coefficient ratio (3) as determined by the following equation (1): mean linear expansion coefficient ratio (3)=mean linear expansion coefficient over the (α+40)−(α+60)° C. range/mean linear expansion coefficient over the α−(α+20)° C. range  equation (1); wherein α(° C.) is between 50° C. and 400° C. and the cases where the mean linear expansion coefficient ratio (3) is determined over a temperature range across Tg are excluded. 7. The resin composition as recited in claim 1, wherein said cured product has an improvement factor of up to 0.98, wherein the improvement factor is determined by dividing the mean linear expansion coefficient over the temperature range from a temperature 10° C. higher than the glass transition temperature of said cured product to a temperature 50° C. higher than the glass transition temperature of said cured product by a mean linear expansion coefficient over the temperature range from a temperature 10° C. higher than a glass transition temperature of said cured product to a temperature 50° C. higher than the glass transition temperature of said cured product. 8. The resin composition as recited in claim 1, wherein said cured product has a tensile modulus at 140° C. of 10 MPa or above and a dielectric constant at 1 MHz of 4.5 or below. 9. The resin composition as recited in claim 1, wherein said cured product has a water absorbency of 2.0% or below. 10. The resin composition as recited in claim 1, wherein said cured product has a water absorbency of 2.0% or below, a dielectric constant at 1 MHz of up to 4.5 and a dielectric constant after water absorption of up to 5.0. 11. The resin composition as recited in claim 1, wherein said cured product, when formed into a 25 μm thick resin sheet, exhibits an insulation resistance of at least 108Ω. 12. The resin composition as recited in claim 1, wherein said cured product has a glass transition temperature of 100° C. or above. 13. The resin composition as recited in claim 1, wherein said cured product has a breaking extension at 260° C. of at least 10%. 14. The resin composition as recited in claim 1, wherein said cured product has a glass transition temperature of 100° C. or above and a dielectric constant at 1 MHz of up to 4.5. 15. The resin composition as recited in claim 1, wherein said cured product has a solubility parameter of 42 (J/cm3)1/2 or above, when calculated using a Fedors equation. 16. The resin composition as recited in claim 1, wherein said thermosetting resin exhibits a 10% weight loss temperature of 400° C. or above, based on its weight at 25° C., in the thermogravimetric measurement under the nitrogen atmosphere. 17. The resin composition as recited in claim 1, wherein said inorganic compound further comprises whisker. 18. The resin composition as recited in claim 1, wherein said layered silicate is at least one selected from the group consisting of montmorillonite, hectorite, swelling mica and vermiculite. 19. The resin composition as recited in claim 1, wherein said layered silicate contains an alkyl ammonium ion having 6 or more carbon atoms in the alkyl, aromatic quaternary ammonium ion or heterocyclic quaternary ammonium ion. 20. The resin composition as recited in claim 1, wherein said layered silicate is dispersed in the thermosetting resin such that and a part or all of said stacks consists of 5 or less layers. 21. A substrate material comprising a cured product of said resin composition as recited in claim 1. 22. A sheet comprising a cured product of said resin composition as recited in claim 1. 23. An adhesive sheet comprising a cured product of said resin composition as recited in claim 1. 24. An optical circuit forming material comprising a cured product of said resin composition as recited in claim 1.