초록 ▼

According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. Th

According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.

대표청구항 ▼

What is claimed is: 1. A cooling structure for a rackmount-type control device, comprising: an enclosure having a front side and rear side which are each open; a connection substrate that is provided at the center of the enclosure to divide the interior of the enclosure in a front-rear direction; a

What is claimed is: 1. A cooling structure for a rackmount-type control device, comprising: an enclosure having a front side and rear side which are each open; a connection substrate that is provided at the center of the enclosure to divide the interior of the enclosure in a front-rear direction; a control substrate group which comprises a plurality of control substrates for executing storage device-related control and which is provided at the front and rear of the enclosure respectively; a power-related device that is provided on both the left and right sides of the respective control substrate groups; a first cooling passage that cools the respective control substrate groups by means of a first cooling air stream, the first cooling passage comprises a first lower passage; a second cooling passage that cools the respective power-related devices located on one side of the respective control substrate groups among the respective power-related devices by means of a second cooling air stream, the second cooling passage comprises a second lower passage; and a third cooling passage that cools the respective power-related devices located on the other side of the respective control substrate groups among the respective power-related devices by means of a third cooling air stream, the third cooling passage comprises a third lower passage, wherein the upstream sides of the first, second, and third cooling passages are provided independent of one another and the downstream sides of the first, second, and third cooling passages are common; wherein a cable passage for connecting cables to the respective control substrates constituting the front control substrate group is provided between the bottom of the first lower passage and the inner surface of the enclosure; and the second lower passage and the third lower passage are provided between the bottom of the respective power-related device and the inner surface of the enclosure and at the same height as the cable passage. 2. The cooling structure for a rackmount-type control device according to claim 1, wherein an inlet of the first cooling passage is provided with an intake fan and an outlet of the first cooling passage is provided with a discharge fan. 3. The cooling structure for a rackmount-type control device according to claim 2, wherein the intake fan is provided at the top of a front control substrate group which is located at the front of the enclosure among the respective control substrate groups and the discharge fan is provided at the top of a rear control substrate group which is located at the rear of the enclosure among the respective control substrate groups. 4. The cooling structure for a rackmount-type control device according to claim 3, wherein the first cooling passage is configured to comprise: an inlet section that is provided at the top of the front control substrate group and which is located downstream of the intake fan; a first front flow path section that is formed between the respective control substrates constituting the front control substrate group and which is provided in communication with the inlet section; the first lower passage that is formed at the bottom of the enclosure extending from the front to the rear of the enclosure and which is provided in communication with the first front flow path section; a first rear flow path section that is formed between the respective control substrates constituting the rear control substrate group and which is provided in communication with the first lower passage; and an outlet section that is provided at the top of the rear control substrate group and which is located upstream of the discharge fan in communication with the first rear flow path section. 5. The cooling structure for a rackmount-type control device according to claim 4, wherein the second cooling passage is configured to comprise: a second front flow path section that discharges air that flows in via the front of the front power-related device downward and which is provided in the front power-related device that is located at the front of the enclosure among the respective power-related devices; the second lower passage that is formed at the bottom of the enclosure extending from the front to the rear of the enclosure and which is provided in communication with the second front flow path section; a second rear flow path section which discharges air that flows in via the second lower passage upward, which is provided in a rear power-related device that is located at the rear of the enclosure among the respective power-related devices and which is provided in communication with the second lower passage; and a connection section that is provided at the top of the rear power-related device so that the second rear flow path section and the outlet section of the first cooling passage communicate with one another; and wherein the third cooling passage is configured to comprise: a third front flow oath section that discharges air that flows in via the front of the front power-related device downward and which is provided in the front power-related device that is located at the front of the enclosure among the respective power-related devices; the third lower passage that is formed at the bottom of the enclosure extending from the front to the rear of the enclosure and which is provided in communication with the third front flow oath section; a third rear flow oath section which discharges air that flows in via the second lower passage upward, which is provided in a rear power-related device that is located at the rear of the enclosure among the respective power-related devices and which is provided in communication with the second lower passage; and a connection section that is provided at the top of the rear power-related device so that the third rear flow path section and the outlet section of the first cooling passage communicate with one another. 6. The cooling structure for a rackmount-type control device according to claim 5, wherein the first lower passage, the second lower passage, and the third lower passage are provided independently so that air does not pass. 7. The cooling structure for a rackmount-type control device according to claim 5, wherein the rear power-related device comprises a built-in cooling fan. 8. The cooling structure for a rackmount-type control device according to claim 5, wherein the front power-related device is a battery device and the rear power-related device is a power supply device. 9. The cooling structure for a rackmount-type control device according to claim 5, wherein a plurality of front power-related devices are each provided on both the left and right sides of the front control substrate group, and a plurality of the rear power-related devices are provided on both the left and right sides of the rear control substrate. 10. The cooling structure for a rackmount-type control device according to claim 9, wherein the respective front power-related devices are located on both the left and right sides of the front control substrate group and provided stacked vertically in two steps so that air is able to pass, and the respective rear power-related devices are located on both the left and right sides of the rear control substrate group and provided stacked vertically in two steps so that air is able to pass. 11. The cooling structure for a rackmount-type control device according to claim 4, wherein the connection substrate is provided with a substrate support section which is located at both the top and bottom ends of the respective control substrate groups and which serves to support respective control substrates constituting the respective control substrate groups, the substrate support section being provided with cooling holes for allowing air to pass between the respective control substrates. 12. The cooling structure for a rackmount-type control device according to claim 1, wherein a first cluster is constituted by the respective control substrate groups and the respective power-related devices which belong to the left half of the enclosure among the respective control substrate groups and the respective power-related devices, and a second cluster is constituted by the respective control substrate groups and the respective power-related devices which belong to the right half of the enclosure among the respective control substrate groups and the respective power-related devices. 13. The cooling structure for a rackmount-type control device according to claim 1, wherein a management device for managing the control device is provided in a horizontal direction at either the top of the enclosure at the front or the top of the enclosure at the rear. 14. The cooling structure for a rackmount-type control device according to claim 1, wherein the respective control substrate groups and the respective power-related devices are configured so as to be capable of being used as is for an enclosure with a different structure from the rack. 15. A rack-type storage control device having a rack, a plurality of storage device housing devices which are detachably provided on the rack, and one control device which controls a plurality of storage devices housed in the respective storage device housing devices and which is detachably provided on the rack, wherein the control device comprises: a rackmount-type enclosure that is housed in the rack; a connection substrate that is provided at the center of the enclosure so as to divide the interior of the enclosure in a front-rear direction; a control substrate group which is provided at a front side and a rear side of the enclosure respectively, the control substrate group having a first communication control substrate that handles communications with a device that issues commands requesting data inputs and outputs, a second communication control substrate that handles communications with the respective storage devices, and a memory control substrate that provides each of the first and second communication control substrates with memory regions; a substrate support section which supports the respective control substrate groups from the top and bottom ends thereof, the substrate support section having a plurality of cooling holes that allow air to pass between control substrates constituting the respective control substrate groups; a battery device that is disposed stacked vertically in two steps on both the left and right sides of a front control substrate group that is located at the front of the enclosure among the respective control substrate groups; a power supply device that is disposed stacked vertically in two steps on both the left and right sides of a rear control substrate group that is located at the rear of the enclosure among the respective control substrate groups, the power supply device comprising a built-in cooling fan; an intake fan that is provided at the top of the front control substrate group; a discharge fan that is provided at the top of the rear control substrate group; a first cooling passage which serves to cool the respective control substrate groups, the first cooling passage having an inlet section that is provided at the top of the front control substrate group and which is located downstream of the intake fan; a first front flow path section that is formed by the respective cooling holes of the substrate support section and a gap between the respective control substrates constituting the front control substrate group and which is provided in communication with the inlet section; a first lower passage that is formed at the bottom of the enclosure extending from the front to the rear of the enclosure and which is provided in communication with the first front flow path section; a first rear flow path section that is formed by the respective cooling holes of the substrate support section and a gap between the respective control substrates constituting the rear control substrate group and which is provided in communication with the first lower passage; and an outlet section that is provided at the top of the rear control substrate group and which is located upstream of the discharge fan in communication with the first rear flow path section; a second cooling passage which serves to cool the battery devices and the power supply devices located on the left side of the enclosure, the second cooling passage having a second front flow path section that discharges air that flows in via the front of the battery device downward; a second lower passage that is formed at the bottom of the enclosure extending from the front to the rear of the enclosure and which is provided in communication with the second front flow path section; a second rear flow path section that discharges air that flows in via the second lower passage upward and which is provided in the power supply device in communication with the second lower passage; and a first connection section that is provided at the top of the power supply device so that the second rear flow path section and the outlet section of the first cooling passage communicate with one another; a third cooling passage which serves to cool the battery devices and the power supply devices located on the right side of the enclosure, the third cooling passage having a third front flow path section that discharges air that flows in via the front of the battery device downward; a third lower passage that is formed at the bottom of the enclosure extending from the front to the rear of the enclosure and which is provided in communication with the third front flow path section; a third rear flow path section that discharges air that flows in via the second lower passage upward and which is provided in the power supply device in communication with the second lower passage; and a second connection section that is provided at the top of the power supply device so that the third rear flow path section and the outlet section of the first cooling passage communicate with one another; and a cable passage for connecting a cable to the respective control substrates constituting the front control substrate group and which is provided between the bottom of the first lower passage and the inner surface of the enclosure. 16. The rack-type storage control device according to claim 15, wherein the connection substrate is not provided with cooling holes for actively allowing air to pass in a front-rear direction of the enclosure at least within the range in which the respective control substrate groups are connected. 17. The rack-type storage control device according to claim 15, wherein a management device for collecting information relating to the state of the control device from the respective control substrates and managing this information is placed in a horizontal direction at the top of the enclosure; and a fourth cooling passage for supplying a cooling air stream to the management device is provided at the top of the enclosure independently from the first, second, and third cooling passages. 18. A cooling structure for a control device, comprising: an enclosure having a front side and rear side which are each open; a connection substrate that is provided at the center of the enclosure to divide the interior of the enclosure in a front-rear direction and which substantially does not comprise cooling holes; a control substrate group which comprises a plurality of control substrates for executing storage device-related control and which is provided at the front and rear of the enclosure respectively; a power-related device that is provided on both the left and right sides of the respective control substrate groups; a first cooling passage that cools the respective control substrate groups by means of a first cooling air stream, the first cooling passage comprises a first lower passage; a second cooling passage that cools the respective power-related devices located on one side of the respective control substrate groups among the respective power-related devices by means of a second cooling air stream, the second cooling passage comprises a second lower passage; and a third cooling passage that cools the respective power-related devices located on the other side of the respective control substrate groups among the respective power-related devices by means of a third cooling air stream, the third cooling passage comprises a third lower passage, wherein the first, second, and third cooling passages are formed bent so as to bypass the connection substrate; wherein a cable passage for connecting cables to the respective control substrates constituting the front control substrate group is provided between the bottom of the first lower passage and the inner surface of the enclosure; and the second lower passage and the third lower passage are provided between the bottom of the respective power-related device and the inner surface of the enclosure and at the same height as the cable passage.