[특허]Electrical contactor, especially wafer level contactor, using fluid pressure

[미국특허] Electrical contactor, especially wafer level contactor, using fluid pressure 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01R-004/60
출원번호	UP-0277653 (2008-11-25)
등록번호	US-7722371 (2010-06-14)
발명자 / 주소	Eldridge, Benjamin N.
출원인 / 주소	FormFactor, Inc.
대리인 / 주소	Burraston, N. Kenneth
인용정보	피인용 횟수 : 0 인용 특허 : 100

초록 ▼

An electrical interconnect assembly and methods for making an electrical interconnect assembly. In one embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact elements and a fluid containing structure which is coupled to the flexible wiring layer. The fluid, when contained in the fluid containing structure, presses the flexible wiring layer towards a device under test to form electrical interconnections between the first contact elements and corresponding second contact elements on the device under test. In a further embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact terminals and a semiconductor substrate which includes a plurality of second contact terminals. A plurality of freestanding, resilient contact elements, in one embodiment, are mechanically coupled to one of the flexible wiring layers or the semiconductor substrate and make electrical contacts between corresponding ones of the first contact terminals and the second contact terminals. In another embodiment, a method of making electrical interconnections includes joining a flexible wiring layer and a substrate together in proximity and causing a pressure differential between a first side and a second side of the flexible wiring layer. The pressure differential deforms the flexible wiring layer and causes a plurality of first contact terminals on the flexible wiring layer to electrically connect with a corresponding plurality of second contact terminals on the substrate.

대표청구항 ▼

What is claimed is: 1. An interconnect assembly for forming temporary pressure electrical connections to a device under test, the interconnect assembly comprising: a flexible substrate comprising a plurality of first electrical contacts extending from a surface of said substrate, said first electrical contacts being compliant; a fluid containment chamber enclosed on one side by said flexible substrate; and a pump in fluid communication with said fluid chamber, wherein circulation of a fluid through said fluid chamber causes said flexible substrate to deform. 2. The interconnect assembly of claim 1, wherein said fluid chamber includes at least one inlet port. 3. The interconnect assembly of claim 1, wherein said fluid chamber includes at least one outlet port. 4. The interconnect assembly of claim 1, wherein said fluid is a liquid. 5. The interconnect assembly of claim 1 further comprising a temperature control device for controlling a temperature of said fluid. 6. The interconnect assembly of claim 5, wherein said temperature control device is capable of heating said fluid. 7. The interconnect assembly of claim 5, wherein said temperature control device is capable of cooling said fluid. 8. The interconnect assembly of claim 1, wherein said plurality of first electrical contacts comprises at least one elongate contact element. 9. The interconnect assembly of claim 1 further comprising at least one stop structure disposed on said flexible substrate. 10. The interconnect assembly of claim 1, wherein said flexible substrate is electrically connected to semiconductor test equipment. 11. The interconnect assembly of claim 1, wherein said flexible substrate comprises at least one wiring layer. 12. The interconnect assembly of claim 1, further comprising at least one electrical device disposed on said flexible substrate. 13. The interconnect assembly of claim 12, wherein said electrical device comprises an integrated circuit. 14. The interconnect assembly of claim 12, wherein said electrical device comprises a test circuit. 15. The interconnect assembly of claim 1, wherein said plurality of first electrical contacts are positioned to contact corresponding second electrical contacts of a device under test when said flexible substrate deforms. 16. The interconnect assembly of claim 15, wherein said flexible substrate deforms to position said first electrical contacts in a non planar orientation in contact with non planar oriented second electrical contacts.

이 특허에 인용된 특허 (100) 인용/피인용 타임라인 분석

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[미국특허] Electrical contactor, especially wafer level contactor, using fluid pressure 원문보기

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[미국특허] Electrical contactor, especially wafer level contactor, using fluid pressure 원문보기

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