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Stock materials for manual and/or high speed industrial automated bonding applications having a curable pre-applied adhesive or sealant compositions on the bonding surfaces wherein the curative for the pre-applied adhesive or sealant composition is contained within a carrier which prevents its prema

Stock materials for manual and/or high speed industrial automated bonding applications having a curable pre-applied adhesive or sealant compositions on the bonding surfaces wherein the curative for the pre-applied adhesive or sealant composition is contained within a carrier which prevents its premature release.

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We claim: 1. A stock material for use in the assembly of apparatuses, devices or articles of manufacture which stock material is in a finished or semi-finished state and has one or more surfaces that are to be bonded or fastened to itself or other components of the apparatus, device or article of m

We claim: 1. A stock material for use in the assembly of apparatuses, devices or articles of manufacture which stock material is in a finished or semi-finished state and has one or more surfaces that are to be bonded or fastened to itself or other components of the apparatus, device or article of manufacture during the assembly thereof wherein at least a portion of said one or more surfaces has applied thereto a substantially dry-to-the-touch, pre-applied, curable adhesive composition comprising an encapsulated liquid curable material and a separately encapsulated curative complex, said curative complex being encased in a polymer capsule and comprising an in-situ formed carrier material and an effective amount of a curative or combination of curatives contained in the carrier material and capable of effecting, directly or indirectly, the cure of the aforementioned liquid curable material, said carrier material being a natural or synthetic material or composition that is substantially non-flowing in the absence of external forces, elevated temperatures or both impacting upon said curative complex wherein the in-situ formed carrier material is formed concurrent with or subsequent to the encapsulation of the curative complex by the action of a curative with or on a precursor composition for said carrier material and either (i) the curative for the in-situ formed carrier material is different from and in addition to the curative contained in said carrier material or (ii) the curative for the in-situ polymerized carrier material is the same as the curative contained in the carrier and the amount of the curative prior to in-situ polymerization of the carrier material is at least 1.6 weight % based on the weight of the carrier material and the amount of curative remaining after polymerization of the carrier material is effective for effecting cure of the liquid curable material. 2. The stock material of claim 1 wherein the stock material has one or more surfaces or portions thereof which are threaded and the pre-applied curable adhesive covers at least a portion of said threaded surface or surfaces. 3. The stock material of claim 2 wherein the stock material is threaded fastener. 4. The stock material of claim 3 wherein the threaded fastener is selected from the group consisting of screws, bolts, nuts, eyehooks, eyebolts, and wing nuts. 5. The stock material of claim 2 wherein the stock material is a component of a conduit. 6. The stock material of claim 5 wherein the conduit component is selected from the group consisting of pipes, tubes, end caps, spigots, valves, and connectors. 7. The stock material of claim 2 wherein the stock material is a device having a threaded element associated therewith for attaching the device to a larger apparatus or structure. 8. The stock material of claim 7 wherein the stock material is selected from the group consisting of solenoids, filters, valves, pressure gauges and sensors. 9. The stock material of claim 1 wherein the stock material (a) is to be employed in a retaining or blind hole bonding application in which the piston of a male connector is inserted into or through the blind hole or keyway of a female connector and (b) has at least one male connector or female connector or both wherein the pre-applied adhesive is within the blind hole or keyway of the female connector or applied to that portion of the piston of the male connector that, in the assembled state, is bonded to the female connector. 10. The stock material of claim 9 wherein the stock material is selected from shafts, dowels, engine core plugs, press-fit caps, rotors, sprockets, hubs, and bearings. 11. The stock material of claim 1 wherein the one or more surfaces to be bonded are substantially planar and capable of being acted upon manually or by automation in order to sufficiently activate the pre-applied adhesive before mating of the surface. 12. The stock material of claim 11 wherein the stock material is selected from the group consisting of magnets, trim, motor mounts, and housing panels. 13. The stock material of claim 1 wherein the carrier material is (a) of a soft, putty-like or gel-like character or (b) a solid or semi-solid that is (i) soluble in the liquid curable material, (ii) softened by the liquid curable material, (iii) softened by the reaction conditions under which the liquid curable material is cured, (iv) softened by the environmental conditions under which the liquid curable material is cured, (v) softened by the method or process by which the curative is to be made available to other components of the curable adhesive composition, (vi) rendered flowable by the liquid curable material, (vii) rendered flowable by the reaction conditions under which the liquid curable material is cured, (viii) rendered flowable by the environmental conditions under which liquid curable material is cured, or (ix) rendered flowable by the method or process by which the curative is to be made available to other components of the curable adhesive composition. 14. The stock material of claim 1 wherein the carrier material is of a soft putty-like or gel-like character and comprises a thixotropic or thickened composition of one or more monomers, oligomers or pre-polymers, or combinations thereof, which composition is substantially non-reactive with the curative in the encapsulated state. 15. The stock material of claim 1 wherein the carrier material includes or comprises one or more thixotropic agents or one or more thixotropic or non-thixotropic gelling or thickening agents that are generated in-situ or act latently concurrent with or following encapsulation of the carrier material. 16. The stock material of claim 1 wherein the carrier material is selected from the group consisting of hot melts, pressure sensitive adhesives, rubber materials, elastomer/tackifier compositions, a polymer whose Tg is less than 35° C., semi-solid and solid resins, starches and starch-based polymers, hydrogels, low temperature waxes and a thickened or gel-like mass of one or more monomers, oligomers, or prepolymers or combinations thereof. 17. The stock material of claim 1 wherein the carrier material is an adhesive or has latent adhesive properties. 18. The stock material of claim 1 wherein the carrier material does not flow or deform except when subjected to forces of at least 1 psi. 19. The stock material of claim 1 wherein the carrier material is formed in-situ concurrent with the encapsulation of the curative complex. 20. The stock material of claim 1 wherein the liquid curable material comprises one or more liquid curable monomers, oligomers, or prepolymers or combinations thereof. 21. The stock material of claim 1 wherein the liquid polymerizable material is selected from the group consisting of one or more monomers, oligomers or prepolymers or combinations thereof that undergo vinyl polymerization; unsaturated polyesters; urethanes; epoxy resins; polysulfides; isocyanates; silicones; polyethers, polyurethanes and polyolefins having silanol moieties capable of undergoing silanol condensation or hydrosilation reactions; and phenoxy resins. 22. The stock material of claim 1 wherein both the encapsulated liquid polymerizable material and the encapsulated cure system are discrete microcapsules held to the surface of the stock material by a binder material. 23. The stock material of claim 22 wherein the binder material is an adhesive or a coating material. 24. The stock material of claim 22 wherein the binder material is an actinic radiation cured composition. 25. The stock material of claim 1 wherein the encapsulation of the liquid curable material is achieved by sandwiching the liquid curable material between the surface of the stock material to which it is applied and a film of a cured coating material and wherein the encapsulated curative is present as discrete microcapsules dispersed in the liquid curable material. 26. The stock material of claim 25 wherein the cured coating material is an actinic radiation cured composition. 27. The stock material of claim 1 wherein the carrier material is formed in-situ subsequent to the encapsulation of the curative complex. 28. A substrate having a substantially dry-to-the-touch, pre-applied, curable adhesive composition comprising an encapsulated liquid curable material and a separately encapsulated curative complex, said curative complex being encased in a polymer capsule and comprising an in-situ formed carrier material and an effective amount of a curative or combination of curatives contained in the carrier material and capable of effecting, directly or indirectly, the cure of the aforementioned liquid curable material, said carrier material being a natural or synthetic material or composition that is substantially non-flowing in the absence of external forces, elevated temperatures or both impacting upon said curative complex wherein the in-situ formed carrier material is formed concurrent with or subsequent to the encapsulation of the curative complex by the action of a curative with or on a precursor composition for said carrier material and either (i) the curative for the in-situ formed carrier material is different from and in addition to the curative contained in said carrier material or (ii) the curative for the in-situ polymerized carrier material is the same as the curative contained in the carrier and the amount of the curative prior to in-situ polymerization of the carrier material is at least 1.6 weight % based on the weight of the carrier material and the amount of curative remaining after polymerization of the carrier material is effective for effecting cure of the liquid curable material. 29. The substrate of claim 28 wherein the carrier material is (a) of a soft, putty-like or gel-like character or (b) a solid or semi-solid that is (i) soluble in the liquid curable material, (ii) softened by the liquid curable material, (iii) softened by the reaction conditions under which the liquid curable material is cured, (iv) softened by the environmental conditions under which the liquid curable material is cured, (v) softened by the method or process by which the curative is to be made available to other components of the curable adhesive composition, (vi) rendered flowable by the liquid curable material, (vii) rendered flowable by the reaction conditions under which the liquid curable material is cured, (viii) rendered flowable by the environmental conditions under which liquid curable material is cured, or (ix) rendered flowable by the method or process by which the curative is to be made available to other components of the curable adhesive composition. 30. The substrate of claim 28 wherein the carrier material is of a soft putty-like or gel-like character and comprises a thixotropic or thickened composition of one or more monomers, oligomers or pre-polymers or combinations thereof, which composition is substantially non-reactive with the curative in the encapsulated state. 31. The substrate of claim 28 wherein the carrier material includes or comprises one or more thixotropic agents or one or more thixotropic or non-thixotropic gelling or thickening agents that are generated in-situ or act latently concurrent with or following encapsulation of the carrier material. 32. The substrate of claim 28 wherein the carrier material is selected from the group consisting of hot melts, pressure sensitive adhesives, rubber materials, elastomer/tackifier compositions, a polymer whose Tg is less than 35° C., semi-solid and solid resins, starches and starch-based polymers, hydrogels, low temperature waxes and a thickened or gel-like mass of one or more monomers, oligomers or prepolymers or combinations thereof. 33. The substrate of claim 28 wherein the carrier material is an adhesive or has latent adhesive properties. 34. The substrate of claim 28 wherein the carrier material does not flow or deform except when subjected to forces of at least 1 psi. 35. The substrate of claim 28 wherein the carrier material is formed in-situ concurrent with the encapsulation of the curative complex. 36. The substrate of claim 28 wherein the liquid curable material comprises one or more curable monomers, oligomers, or prepolymers or combinations thereof. 37. The substrate of claim 28 wherein the liquid curable material is selected from the group consisting of one or more monomers, oligomers, or prepolymers or combinations thereof that undergo vinyl polymerization; unsaturated polyesters; urethanes; epoxy resins; polysulfides; isocyanates; silicones; polyethers, polyurethanes and polyolefins having silanol moieties capable of undergoing silanol condensation or hydrosilation reactions; and phenoxy resins. 38. The substrate of claim 28 wherein both the encapsulated liquid polymerizable material and the encapsulated cure system are discrete microcapsules held to the surface of the substrate by a binder material. 39. The substrate of claim 28 wherein the encapsulation of the liquid curable material is achieved by sandwiching the liquid curable material between the surface of the substrate and a film of a cured coating material and wherein the encapsulated curative complex is present as discrete microcapsules dispersed in the liquid curable material. 40. The substrate of claim 28 wherein the carrier material is formed in-situ subsequent to the encapsulation of the curative complex.