[특허]Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers

[미국특허] Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-021/00
출원번호	UP-0451398 (2006-06-13)
등록번호	US-7723741 (2010-06-14)
발명자 / 주소	Farnworth, Warren M. Wood, Alan G. Wark, James M. Hembree, David R. Lake, Rickie C.
출원인 / 주소	Aptina Imaging Corporation
대리인 / 주소	Dickstein Shapiro LLP
인용정보	피인용 횟수 : 3 인용 특허 : 70

초록 ▼

Methods of packaging microelectronic imagers and packaged microelectronic imagers. An embodiment of such a method can include providing an imager workpiece having a plurality of imager dies arranged in a die pattern and providing a cover substrate through which a desired radiation can propagate. The imager dies include image sensors and integrated circuitry coupled to the image sensors. The method further includes providing a spacer having a web that includes an adhesive and has openings arranged to be aligned with the image sensors. For example, the web can be a film having an adhesive coating, or the web itself can be a layer of adhesive. The method continues by assembling the imager workpiece with the cover substrate such that (a) the spacer is between the imager workpiece and the cover substrate, and (b) the openings are aligned with the image sensors. The attached web is not cured after the imager workpiece and the cover substrate have both been adhered to the web. As such, the web does not outgas contaminants into the compartments in which the image sensors are housed.

대표청구항 ▼

The invention claimed is: 1. A microelectronic imager assembly, comprising: an imager workpiece having a plurality of imager dies arranged in a die pattern, wherein individual imager dies include an image sensor and an integrated circuit operatively coupled to the imager sensor; an optically transmissive cover substrate; and a framed spacer having an integral web of independent frames, the frames having a first side adhered to the imager workpiece, a second side spaced apart from the first side by a prefabricated separation distance and adhered to the cover substrate, openings arranged in the die pattern and aligned with corresponding image sensors, and gaps between the independent frames, wherein the web includes a material in a cured and non-flowable state before the imager workpiece and the cover substrate are both adhered to the spacer. 2. The imager assembly of claim 1 wherein the web comprises a film composed of a tape, and the spacer further comprises a first layer of adhesive on one side of the tape and a second layer of adhesive on an opposing side of the tape. 3. The imager assembly of claim 1 wherein the web comprises an adhesive formed and cured separately from the imager workpiece and the cover substrate, the web having cut-edged openings and a thickness at least approximately equal to the separation distance. 4. The imager assembly of claim 1 wherein the web comprises a liquid adhesive deposited directly onto the imager workpiece in a flowable state and cured on the imager workpiece, wherein the adhesive has a thickness at least approximately equal to the separation distance and etched openings aligned with the image sensors. 5. The imager assembly of claim 1 wherein the web comprises a dry adhesive deposited directly onto the imager workpiece in an unactivated state and subsequently activated on the imager workpiece, wherein the adhesive has a thickness at least approximately equal to the separation distance and etched openings aligned with the image sensors. 6. The imager assembly of claim 1 wherein the web comprises a liquid adhesive deposited directly onto the cover substrate in a flowable state and cured on the cover substrate, wherein the adhesive has a thickness at least approximately equal to the separation distance and etched openings arranged to be aligned with the image sensors. 7. The imager assembly of claim 1 wherein the web comprises a dry adhesive deposited directly onto the cover substrate in an unactivated state and subsequently activated on the cover substrate, wherein the adhesive has a thickness at least approximately equal to the separation distance and etched openings arranged to be aligned with the image sensors. 8. The imager assembly of claim 2, further comprising a first release element over the first layer of adhesive and a second release element over the second layer of adhesive. 9. A microelectronic imager assembly, comprising: an imager workpiece having a plurality of imager dies arranged in a die pattern, wherein individual imager dies include an imager sensor and an integrated circuit operatively coupled to the image sensor; a cover substrate transmissive to radiation in an operating spectrum of the image sensors; and a prefabricated framed spacer having a web of independent frames including a plurality of cut-edged openings arranged in the die pattern and aligned with the image sensors, the independent frames arranged to form gaps between adjacent frames, a first side adhered to the imager workpiece, a second side adhered to the cover substrate, and a thickness that spaces the image sensors apart from the cover substrate by a desired distance, wherein the web is made of a material in a cured and non-flowable state. 10. The imager assembly of claim 9 wherein the web comprises a film composed of a tape, and the spacer further comprises a first layer of adhesive on one side of the tape and a second layer of adhesive on an opposing side of the tape. 11. The imager assembly of claim 9 wherein the web comprises an adhesive formed and cured separately from the imager workpiece and the cover substrate, the adhesive having the cut-edged openings and a thickness at least approximately equal to the desired distance. 12. The imager assembly of claim 9 wherein the web comprises a liquid adhesive deposited directly onto the imager workpiece in a flowable state and cured on the imager workpiece, wherein the adhesive has a thickness at least approximately equal to the desired distance and etched openings aligned with the image sensors. 13. The imager assembly of claim 9 wherein the web comprises a dry adhesive deposited directly onto the imager workpiece in an unactivated state and subsequently activated on the imager workpiece, wherein the adhesive has a thickness at least approximately equal to the desired distance and etched openings aligned with the image sensors. 14. The imager assembly of claim 9 wherein the web comprises a liquid adhesive deposited directly onto the cover substrate in a flowable state and cured on the cover substrate, wherein the adhesive has a thickness at least approximately equal to the desired distance and etched openings arranged to be aligned with the image sensors. 15. The imager assembly of claim 9 wherein the web comprises a dry adhesive deposited directly onto the cover substrate in an unactivated state and subsequently activated on the cover substrate, wherein the adhesive has a thickness at least approximately equal to the desired distance and etched openings arranged to be aligned with the image sensors.

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[미국특허] Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers 원문보기

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[미국특허] Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers 원문보기

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