Orthogonally system arrangements for data center facility
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
G06F-001/20
E04C-002/52
출원번호
UP-0146281
(2008-06-25)
등록번호
US-7724518
(2010-06-14)
발명자
/ 주소
Carlson, Andrew B.
Hamburgen, William
Clidaras, Jimmy
Weber, Wolf-Dietrich
Fan, Xiaobo
출원인 / 주소
Exaflop LLC
대리인 / 주소
Fish & Richardson P.C.
인용정보
피인용 횟수 :
34인용 특허 :
12
초록▼
A facility is described that includes one or more enclosures defining an interior space, a plurality of power taps, a plurality of coolant supply taps, and a plurality of coolant return taps. A flow capacity of the supply taps and a flow capacity of the return taps can be approximately equal over a
A facility is described that includes one or more enclosures defining an interior space, a plurality of power taps, a plurality of coolant supply taps, and a plurality of coolant return taps. A flow capacity of the supply taps and a flow capacity of the return taps can be approximately equal over a local area of the interior space. The plurality of power taps, the plurality of supply taps, and the plurality of return taps can be divided into a plurality of zones, with taps of each zone are configured to be controllably coupled to a power source or a coolant source independently of the taps of other zones. The taps can be positioned along paths, and paths of the power taps can be spaced from associated proximate paths of supply and return taps by a substantially uniform distance along a substantial length of the first path.
대표청구항▼
What is claimed is: 1. A data center, comprising: one or more enclosures defining an interior space; a plurality of power lines, each of the power lines including a plurality of power taps in the interior space; a plurality of coolant supply lines, each of the coolant supply lines including a plura
What is claimed is: 1. A data center, comprising: one or more enclosures defining an interior space; a plurality of power lines, each of the power lines including a plurality of power taps in the interior space; a plurality of coolant supply lines, each of the coolant supply lines including a plurality of coolant supply taps in the interior space; a plurality of coolant return lines, each of the coolant return lines including a plurality of coolant return taps in the interior space; and a plurality of clusters of modules in the interior space, each cluster located in a spatially contiguous area horizontally separated from other clusters by an access aisle, each module including a plurality of rack-mounted computers connected to a power tap adjacent the module and a cooling coil to remove heat from air near the rack-mounted computers, the cooling coil fluidly connected between a supply tap and a return tap adjacent the module; wherein each cluster includes two or more modules, and wherein the two or more modules in each cluster are serviced by a common coolant supply line and a common coolant return line, each of the two or more modules in each cluster are connected to different ones of the plurality of power lines, and the different ones of the plurality of power lines each service a plurality of clusters, or the two or more modules in each cluster are serviced by a common power line, each of the two or more modules in each cluster are connected to different ones of the plurality of coolant supply lines and the plurality of coolant return lines, and the different ones of the plurality of coolant supply lines and the plurality of coolant return lines each service a plurality of clusters. 2. The data center of claim 1, wherein each of the two or more modules is connected to different ones of the plurality of power lines. 3. The data center of claim 1, wherein each of the two or more modules is connected to different ones of the plurality of coolant supply lines and the plurality of coolant return lines. 4. The data center of claim 1, wherein substantially all of the rack-mounted computers of a particular cluster are dedicated to the same application. 5. The data center of claim 1, wherein the rack-mounted computers of at least two different clusters of the plurality of clusters are dedicated to different applications. 6. The data center of claim 1, wherein the plurality of power taps are distributed with a substantially regular spacing in the interior space, the plurality of coolant supply taps are distributed with a substantially regular spacing in the interior space, and the plurality of coolant return taps are distributed with a substantially regular spacing in the interior space. 7. The data center of claim 1, wherein the power lines, the coolant supply lines and the coolant return lines are substantially linear. 8. The data center of claim 7, wherein modules are arranged in substantially linear rows. 9. The data center of claim 8, wherein the linear rows of the modules are perpendicular to the power lines. 10. The data center of claim 9, wherein the linear rows of the modules are parallel to the coolant supply lines and the coolant return lines. 11. The data center of claim 10, wherein the power lines are uniformly spaced. 12. The data center of claim 11, wherein the power lines are spaced with a pitch approximately equal to a spacing between modules in the rows. 13. The data center of claim 8, wherein the linear rows of the modules are perpendicular to the coolant supply lines and the coolant return lines. 14. The data center of claim 13, wherein the linear rows of the modules are parallel to the power lines. 15. The data center of claim 8, wherein the rows of modules are separated by access aisles. 16. The data center of claim 1, wherein at least two of the coolant supply lines and at least two of the coolant return lines are connected to different cooling plants. 17. The data center of claim 1, wherein the power taps are disposed with substantially uniform first spacing along the power lines, the supply taps are disposed with substantially uniform second spacing along the coolant supply lines, and the return taps are disposed with substantially uniform third spacing along the coolant return lines. 18. The data center of claim 17, wherein the second spacing is approximately equal to the third spacing. 19. The data center of claim 1, wherein the coolant supply lines and the coolant return lines are uniformly spaced with a first pitch. 20. The data center of claim 1, wherein the modules are distributed with a substantially regular spacing in the interior space.
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이 특허에 인용된 특허 (12)
Hillis,W. Daniel; Duttweiler,Mark; Salter,Kenneth D.; Yates,Randall A., Balanced chilled fluid cooling system for a data center in a shipping container.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Method and air-cooling unit with dynamic airflow and heat removal adjustability.
Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations.
Hamburgen, William; Clidaras, Jimmy; Leung, Winnie; Stiver, David W.; Beck, Jonathan D.; Carlson, Andrew B.; Chow, Steven T. Y.; Imwalle, Gregory P.; Michael, Amir M., Modular data center cooling.
Hamburgen, William; Clidaras, Jimmy; Leung, Winnie; Stiver, David W.; Beck, Jonathan D.; Carlson, Andrew B.; Chow, Steven T. Y.; Imwalle, Gregory P.; Michael, Amir M., Modular data center cooling.
Schmitt, Ty; Bailey, Mark M.; Middleton, Anthony; Duncan, Tyler, System and method for structural, modular power distribution in a modular data center.
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