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A probe card assembly, according to some embodiments of the invention, can comprise a tester interface configured to make electrical connections with a test controller, a plurality of electrically conductive probes disposed to contact terminals of an electronic device to be tested, and a plurality o

A probe card assembly, according to some embodiments of the invention, can comprise a tester interface configured to make electrical connections with a test controller, a plurality of electrically conductive probes disposed to contact terminals of an electronic device to be tested, and a plurality of electrically conductive data paths connecting the tester interface and the probes. At least one of the data paths can comprise an air bridge structure trace comprising an electrically conductive trace spaced away from an electrically conductive plate by a plurality of pylons.

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What is claimed is: 1. A probe card assembly comprising: a wiring substrate; a tester interface coupled to the wiring substrate and configured to make electrical connections with a test controller; a probe head assembly coupled to the wiring substrate; a plurality of electrically conductive probes

What is claimed is: 1. A probe card assembly comprising: a wiring substrate; a tester interface coupled to the wiring substrate and configured to make electrical connections with a test controller; a probe head assembly coupled to the wiring substrate; a plurality of electrically conductive probes disposed on the probe head assembly and arranged to contact terminals of an electronic device to be tested; and a plurality of electrically conductive data paths disposed on said wiring substrate and said probe head assembly electrically connecting the tester interface and the probes, wherein at least one of the data paths comprises an air bridge structure trace comprising an electrically conductive trace spaced away from an electrically conductive plate by a plurality of pylons. 2. The probe card assembly of claim 1, wherein ones of the pylons comprise a dielectric material. 3. The probe card assembly of claim 1, where in the air bridge structure trace is disposed on the wiring substrate and wherein the plate is disposed on the wiring substrate, first ends of the pylons are attached to the plate, and the trace is attached to second ends of the pylons. 4. The probe card assembly of claim 1, wherein a plurality of the data paths each comprise an air bridge structure trace comprising an electrically conductive trace spaced away from the plate by a plurality of dielectric pylons. 5. The probe card assembly of claim 1, wherein a dielectric material between the trace and the plate along at least seventy-five percent of a length of the trace is air. 6. The probe card assembly of claim 1, wherein a dielectric material between the trace and the plate along at least ninety percent of a length of the trace is air. 7. The probe card assembly of claim 1, wherein the at least one of the data paths is configured to provide test data to or from the electronic device to be tested, wherein the test data comprises at least one of data to be input into the electronic device and data output by the electronic device. 8. The probe card assembly of claim 1, wherein the plate is electrically connected to a voltage potential. 9. The probe card assembly of claim 8, wherein the voltage potential is ground. 10. The probe card assembly of claim 1, wherein the air bridge structure trace is disposed on the probe head and wherein the plate is disposed on the probe head, first ends of the pylons are attached to the plate, and the trace is attached to second ends of the pylons. 11. The probe card assembly of claim 10, wherein at least one of the probes is disposed on the air bridge structure trace. 12. A method of testing at least one electronic device, the method comprising: providing a probe card assembly wherein the probe card assembly comprises at least one substrate and a plurality of probes disposed on the at least one substrate, wherein the probe card assembly is electrically and mechanically coupled to the tester; and providing test data through the probe card assembly between the tester and at least one electronic device in electrical contact with ones of the probes, wherein the providing test data comprises passing at least a portion of the test data through an air bridge structure trace on the probe card assembly, the air bridge structure trace comprising an electrically conductive trace spaced away from an electrically conductive plate by a plurality of pylons. 13. The method of claim 12, wherein ones of the pylons comprise a dielectric material. 14. The method of claim 12, wherein a dielectric material between the trace and the plate along at least seventy-five percent of a length of the trace is air. 15. The method of claim 12, wherein a dielectric material between the trace and the plate along at least ninety percent of a length of the trace is air. 16. The method of claim 12, wherein the test data comprises test input data to be input into the at least one electronic device and response data generated by said at least one electronic device in response to ones of the test input data. 17. The method of claim 12, wherein the plate is disposed on the at least one substrate, first ends of the pylons are attached to the plate, and the trace is attached to second ends of the pylons. 18. The method of claim 17, wherein the plate is electrically connected to a voltage potential. 19. The method of claim 18, wherein the voltage potential is ground. 20. The method of claim 12, wherein the providing test data comprises passing at least portions of the test data through a plurality of air bridge structure traces on the probe card assembly, each of the air bridge structure traces comprising an electrically conductive trace spaced away from an electrically conductive plate by a plurality of dielectric pylons. 21. The method of claim 20, wherein the at least one electronic device comprises at least one semiconductor die, and the providing test data further comprises: providing test input data to be input into the at least one die from the tester through communications channels to the probe card assembly; providing the test input data through the probe card assembly to ones of probes of the probe card assembly in contact with input terminals of the at least one die; providing response data generated by the at least one die from ones of the probes of the probe card assembly in contact with output terminals of the at least one die through the probe card assembly to communications channels to the tester. 22. The method of claim 21, wherein the passing at least a portion of the test data through an air bridge structure comprises passing at least a portion of the test input data through at least one of the air bridge structure traces. 23. The method of claim 21, wherein the passing at least a portion of the test data through an air bridge structure comprises passing at least a portion of the response data through at least one of the air bridge structure traces. 24. The method of claim 21, further comprising evaluating the response data to determine whether the at least one die responded properly to the test input data.