이 특허에 인용된 특허 (52) 인용/피인용 타임라인 분석

1. Kimura, Kiyoshi; Shimoda, Sugiro; Yasuda, Naoshi; Yamada, Daisuke, Anisotropically conductive sheet, production process thereof and applied product thereof.

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2. Pasiecznik ; Jr. John (Malibu CA), Apparatus for testing integrated circuits.

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3. Forell,Richard; Schneider,Joachim; Glaser,Stefan; Schlinkheider,Joerg, Attachment device for the sun visor of a motor vehicle.

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4. Kirkman Michael (Barrington RI), Compliant pin for solderless termination to a printed wiring board.

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5. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L. ; Dozier Thomas H. ; Smith William D., Contact carriers (tiles) for populating larger substrates with spring contacts.

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6. Krger Gustav (Herrenberg DEX) Hinnerwisch Sven (Nufringen DEX), Contactor for an electronic tester.

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7. Guohua Zhang CN; ZiQiang Zhu CN, Electrical connector having compressive conductive contacts.

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8. ZiQiang Zhu CN, Electrical connector having improved spring contact member.

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9. Holt ; Richard C. ; Damon ; Neil F. ; Hanlon ; Richard J., Electrical interconnection boards with lead sockets mounted therein and method for making same.

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10. Johnston Charles J. (Walnut CA) Swart Mark A. (Upland CA), Electrical test probe having rotational control of the probe shaft.

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11. Alcoe David James ; Caletka David Vincent, Electronic component test apparatus with rotational probe and conductive spaced apart means.

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12. Khandros Igor Y. ; Mathieu Gaetan L., Flexible contact structure with an electrically conductive shell.

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13. Slocum Alexander H. ; Ziegenhagen ; II Rodney Scott, Flexible shielded laminated beam for electrical contacts and the like and method of contact operation.

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14. Cray Seymour R. (Chippewa Falls WI) Krajewski Nicholas J. (Elk Mound WI), Flying leads for integrated circuits.

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15. Bross Arthur (Poughkeepsie NY) Walsh Thomas J. (Poughkeepsie NY), High density probe.

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16. Ainslie Norman G. (Croton-on-Hudson NY) Krzanowski James E. (Watertown MA) Palmateer Paul H. (Wappingers Falls NY), High melting point process for Au:Sn:80:20 brazing alloy for chip carriers.

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17. Jones Mark R. ; Khoury Theodore A., High performance integrated circuit chip package.

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18. Levy Paul S. (Chandler AZ), High-frequency coaxial interface test fixture.

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19. Martel Anthony Paul ; McQuade Francis T., Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment.

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20. Perry Charles H. (Poughkeepsie NY) Bauer Tibor L. (Hopewell Junction NY) Long David C. (Wappingers Falls NY) Pickering Bruce C. (Wappingers Falls NY) Vittori Pierre C. (Cold Spring NY), Interface card for a probe card assembly.

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21. Lee Shaw Wei (10410 Miller Ave. Cupertino CA 95014), Known good die test apparatus and method.

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22. Ho Yu Q. (Kanata CAX) Jolly Gurvinder (Orleans CAX) Emesh Ismail T. (Cumberland CAX), Method for forming interconnect structures for integrated circuits.

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23. Belmont Andre,FRX ; Reynaud Vincent,FRX ; Daniau William,FRX, Method for making cards with multiple contact tips for testing semiconductor chips.

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24. Yanof Arnold W. (Tempe AZ) Dauksher William (Mesa AZ), Method for manufacturing a probe.

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25. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of mounting resilient contact structures to semiconductor devices.

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26. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.

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27. Watanabe Takashi,JPX ; Yoshida Minako,JPX, Micro contact pin structure with a piezoelectric element and probe card using the same.

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28. Palagonia Anthony Michael ; Pikna Paul Joseph ; Maddix John Thomas, Micro probe assembly and method of fabrication.

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29. Maddix John Thomas ; Palagonia Anthony Michael ; Pikna Paul Joseph ; Vallett David Paul, Micro probe ring assembly and method of fabrication.

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30. Grube, Gary W.; Mathieu, Gaetan L.; Madsen, Alec, Microelectronic contact structure.

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31. Sugihara Osamu (Nagasaka JPX), Microprobe provided circuit substrate and method for producing the same.

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32. Lewis Stephan P. (Hermosa Beach CA), Multiple mode buckling beam probe assembly.

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33. Johnston Charles J. (Walnut CA), One-piece compliant probe.

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34. Jones Mark R. ; Khoury Theodore A., Packaging and interconnection of contact structure.

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35. Driller Hubert (Schmitten DEX) Mang Paul (Schmitten DEX), Printed circuit board testing device with foil adapter.

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36. Soejima Koji,JPX ; Senba Naoji,JPX, Probe card and method of forming a probe card.

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37. Higgins H. Dan ; Pandey Rajiv ; Armendariz Norman J. ; Bates R. Dennis, Probe card assembly for high density integrated circuits.

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38. Trenary Dale T. (San Jose CA), Probe card for integrated circuit chip.

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39. Mizuta Masaharu,JPX, Probe card with vertical needle for enabling improved wafer testing and method of manufacturing the same.

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40. Nakano Shoukichi (Kawasaki JPX), Prober for semiconductor integrated circuit element wafer.

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41. Yanof Arnold W. (Tempe AZ) Dauksher William (Mesa AZ), Semiconductor structure and method of manufacture.

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42. Leas James M. (South Burlington VT) Koss Robert W. (Burlington VT) Walker George F. (New York NY) Perry Charles H. (Poughkeepsie NY) Van Horn Jody J. (Underhill VT), Semiconductor wafer test and burn-in.

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43. Swart Mark A. ; Johnston Charles J., Solid spring electrical contacts for electrical connectors and probes.

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44. Reymond Welles K. (Waterbury CT), Spring biased tapered contact elements for electrical connectors and integrated circuit packages.

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45. Kuan Chi-Te,TWX, Structure of a terminal.

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46. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA), Tandem loop contact for an electrical connector.

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47. Schmid Rainer,DEX ; Giringer Klaus,DEX ; Gauss Ulrich,DEX ; Deusch Heinz,DEX, Test head for microstructures with interface.

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48. Faure Louis H. (Poughkeepsie NY) Spoor Terence W. (Marlboro NY), Test probe assembly using buckling wire probes within tubes having opposed overlapping slots.

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49. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof.

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50. Barabi, Nasser, Test socket for an IC device.

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51. Shiraishi Shogo (Kitakyushu JPX), Universal probe card for use in a semiconductor chip die sorter test.

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52. Mizuta Masaharu,JPX, Vertical needle type probe card, method of manufacturing thereof, method of replacing defective probe needle and test method of wafer using the probe card.

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이 특허를 인용한 특허 (8) 인용/피인용 타임라인 분석

1. Vinther, Gordon A, Compliant electrical contact.

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2. Chang, I-Chang, Contact pin structure.

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3. Kimura, Teppei; Fukushima, Noriyuki; Urata, Atsuo; Arita, Naoki; Takeda, Tomoyuki, Contact probe.

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4. Kimura, Teppei; Fukushima, Noriyuki; Urata, Atsuo; Arita, Naoki; Takeda, Tomoyuki, Contact probe.

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5. Nelson, John E.; Sherry, Jeffrey C.; Alladio, Patrick J.; Oberg, Russell F.; Warwick, Brian; Michalko, Gary W., Electrically conductive pins for microcircuit tester.

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6. Yao, Yushuang; Chew, Chee Hiong; Prajuckamol, Atapol, Flexible press fit pins for semiconductor packages and related methods.

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7. Yao, Yushuang; Chew, Chee Hiong; Prajuckamol, Atapol, Flexible press fit pins for semiconductor packages and related methods.

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8. Jo, Byung Ho, Method for fabricating probe needle tip of probe card.

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