초록 ▼

The present invention relates to methods and systems for purifying gases, such as for example semiconductor process gases. The invention more particularly relates to fluid purification methods and systems having improved heat transfer capabilities and controls such that the purified fluid produced f

The present invention relates to methods and systems for purifying gases, such as for example semiconductor process gases. The invention more particularly relates to fluid purification methods and systems having improved heat transfer capabilities and controls such that the purified fluid produced from the process contains reduced impurity levels and/or exhibits more uniform concentrations within the final product. In another aspect of the invention, the activation time for adsorbent beds used in such processes and systems can be reduced.

대표청구항 ▼

What is claimed is: 1. An adsorbent vessel having an inner surface and an outer surface, the vessel comprising: at least one adsorbent bed formed of at least one adsorbent; at least one plate in thermal contact with the inner surface of the vessel and formed of material having higher thermal conduc

What is claimed is: 1. An adsorbent vessel having an inner surface and an outer surface, the vessel comprising: at least one adsorbent bed formed of at least one adsorbent; at least one plate in thermal contact with the inner surface of the vessel and formed of material having higher thermal conductivity than the thermal conductivity of the at least one adsorbent; an external heat exchanger in contact with the outer surface of the vessel to maintain a fluid being purified within an operating purification temperature range; and wherein the at least one plate is configured to transfer heat and/or cooling to and from the at least one adsorbent bed. 2. The adsorbent vessel of claim 1, wherein the at least one plate is formed of a solid material. 3. The adsorbent vessel of claim 2, wherein the at least one plate is foiled of material selected from the group consisting of: metals, ceramics, thermally conductive plastics and combinations thereof. 4. The adsorbent vessel of claim 3, wherein the metal is selected from the group consisting of: aluminum, steel, nickel, gold, tantalum and metal alloys. 5. The adsorbent vessel of claim 1, wherein the at least one plate is perforated. 6. The adsorbent vessel of claim 5, wherein the at least one plate is formed of material selected from the group consisting of: metals, ceramics, thermally conductive plastics and combinations thereof. 7. The adsorbent vessel of claim 6, wherein the metal is selected from the group consisting of: aluminum, steel, nickel, gold, tantalum and metal alloys. 8. The adsorbent vessel of claim 1, wherein the at least one plate is secured to the inner wall of the vessel. 9. The adsorbent vessel of claim 8, wherein the at least one plate is welded to the inner surface of the vessel. 10. The adsorbent vessel of claim 1, wherein the number of plates is greater than 2. 11. The adsorbent vessel of claim 1, further including means to monitor temperature inside the vessel. 12. The adsorbent vessel of claim 11, wherein the means to monitor temperature comprises at least one thermocouple. 13. The adsorbent vessel of claim 1, wherein the external heat exchanger comprises an electrical jacket. 14. The adsorbent vessel of claim 1, wherein the external heat exchanger comprises a heat transfer fluid configured to transfer heat to and from the vessel. 15. The adsorbent vessel of claim 14, wherein the external heat exchanger comprises a circulating heat transfer fluid. 16. The adsorbent vessel of claim 14, wherein the external heat exchanger comprises a bath for at least partially immersing the vessel therein. 17. The adsorbent vessel of claim 1, wherein the at least one plate has a width less than the radius of the vessel. 18. The adsorbent vessel of claim 1, wherein the at least one plate has a width less than the diameter of the vessel. 19. The adsorbent vessel of claim 1, wherein the at least one plate has a length equal to a length of the at least one adsorbent vessel. 20. The adsorbent vessel of claim 19, wherein the number of plates is greater than two. 21. The adsorbent vessel of claim 19, wherein the at least one plate has a width less than a radius of the adsorbent vessel. 22. The adsorbent vessel of claim 21, wherein the at least one adsorbent bed has a radius equal to the radius of the adsorbent vessel. 23. The adsorbent vessel of claim 22, wherein the number of plates is greater than two. 24. The adsorbent vessel of claim 19, wherein the at least one plate has a width equal to a radius of the adsorbent vessel. 25. The adsorbent vessel of claim 24, wherein the at least one adsorbent bed has a radius equal to the radius of the adsorbent vessel and the width of the at least one plate. 26. The adsorbent vessel of claim 25, wherein the number of plates is greater than two. 27. The adsorbent vessel of claim 19, wherein the at least one plate has a width greater than a radius of the adsorbent vessel. 28. The adsorbent vessel of claim 27, wherein the at least one adsorbent bed has a radius equal to the radius of the adsorbent vessel. 29. The adsorbent vessel of claim 27, wherein the number of plates is greater than two. 30. The adsorbent vessel of claim 19, wherein the at least one plate has a length equal to a length of the at least one adsorption bed and a length of the adsorbent vessel. 31. The adsorbent vessel of claim 1, wherein the at least one plate has a length greater than the at least one adsorption bed and less than a length of the adsorbent vessel. 32. The adsorbent vessel of claim 1, wherein the vessel is formed of aluminum, steel, ceramic material or combinations thereof. 33. The adsorbent vessel of claim 30, wherein the vessel is formed of stainless steel. 34. The adsorbent vessel of claim 1, further including at least one thermally conductive layer positioned in the adsorbent vessel such that during operation process media flows through the at least one adsorbent bed and the at least one thermally conductive layer. 35. The adsorbent vessel of claim 34, wherein the at least one thermally conductive layer is formed of one or more materials comprising metals, ceramics, thermally conductive plastics or combinations thereof.