초록 ▼

A cooling system including one or more piezo fans for an electronic assembly is disclosed. The electronic assembly may include heat-generating components coupled with a front side of a printed circuit board (PCB) and one or more piezo fans coupled with a back side of the PCB. One or more piezo fans

A cooling system including one or more piezo fans for an electronic assembly is disclosed. The electronic assembly may include heat-generating components coupled with a front side of a printed circuit board (PCB) and one or more piezo fans coupled with a back side of the PCB. One or more piezo fans may be capable of cooling the heat-generating components from the back side. The cooling system may further include a heat sink coupled with the back side of the PCB.

대표청구항 ▼

What is claimed is: 1. A cooling system for an electronic device, the cooling system comprising: one or more piezo fans coupled to a first side of a printed circuit board (PCB) capable of carrying one or more heated components coupled to a second side of the PCB; and one or more attachment mechanis

What is claimed is: 1. A cooling system for an electronic device, the cooling system comprising: one or more piezo fans coupled to a first side of a printed circuit board (PCB) capable of carrying one or more heated components coupled to a second side of the PCB; and one or more attachment mechanisms coupling said one or more piezo fans to the first side of the PCB; wherein said one or more piezo fans are capable of increasing airflow to the first side of the PCB and cooling said one or more heated components. 2. The cooling system of claim 1 wherein the PCB comprises a motherboard and the electronic device comprises a processor disposed in a package coupled to the motherboard. 3. The cooling system of claim 1 wherein said one or more heated components comprises one or more voltage regulators. 4. The cooling system of claim 3 wherein said one or more piezo fans are located near said one or more voltage regulators. 5. The cooling system of claim 1 wherein said one or more piezo fans are located near at least one of a socket or solder balls coupled to the PCB. 6. The cooling system of claim 1 wherein said one or more piezo fans comprises a blade capable of vibrating in response to a piezo actuator coupled to the blade. 7. The cooling system of claim 6 wherein a height of the blade is less than the distance between the first side of the PCB and a chassis of the electronic device. 8. The cooling system of claim 6 wherein a height of the blade is less than the distance between the first side of the PCB and an adjacent PCB. 9. The cooling system of claim 6 wherein a height of the blade ranges from about 1 mm to about 4 mm. 10. The cooling system of claim 6 wherein the blade is oriented substantially parallel to the PCB. 11. A cooling method for a computer assembly, the method comprising: coupling one or more piezo fans to a first side of a printed circuit board (PCB); and positioning said one or more piezo fans capable of increasing airflow to the first side of the PCB; wherein said one or more piezo fans comprises a blade coupled to a piezo element and capable of flexing in response to deformation of the piezo element; and wherein one or more heated components are coupled to a second side of the PCB. 12. The cooling method of claim 11 wherein said coupling one or more piezo fans to a first side of a PCB comprises providing an attachment mechanism to couple said one or more piezo fans to the first side of the PCB. 13. The cooling method of claim 11 further comprising orienting said one or more piezo fans substantially parallel to the PCB. 14. The cooling method of claim 11 further comprising positioning said one or more piezo fans near a heated component of the computer assembly. 15. The cooling method of claim 11 wherein further comprising positioning said one or more piezo fans based on, at least in part, selection of a heat transfer coefficient. 16. An electronic assembly comprising: a printed circuit board (PCB) comprising a first side and a second side; a die or a socket coupled with the first side of the PCB; and one or more piezo fans coupled with an attachment mechanism capable of positioning said one or more piezo fans on the second side of the PCB. 17. The electronic assembly of claim 16 wherein said one or more piezo fans are capable of cooling the die or the socket, or combinations thereof. 18. The electronic assembly of claim 16 further comprising a heat sink coupled to the second side of the PCB. 19. The electronic assembly of claim 16 further comprising an additional PCB coupled to the second side of the PCB, wherein said one or more piezo fans are sandwiched in between the PCB and the additional PCB.