초록 ▼

A dielectric layer including cerium oxide and aluminum oxide acting as a single dielectric layer, and a method of fabricating such a dielectric layer, produces a reliable structure with a high dielectric constant (high-k) for use in a variety of electronic devices. Such a dielectric layer including

A dielectric layer including cerium oxide and aluminum oxide acting as a single dielectric layer, and a method of fabricating such a dielectric layer, produces a reliable structure with a high dielectric constant (high-k) for use in a variety of electronic devices. Such a dielectric layer including cerium oxide and aluminum oxide may be used as the gate insulator of a MOSFET, as a capacitor dielectric in a DRAM, as a tunnel gate insulator in flash memory, or as a dielectric in an NROM device, among others, because the high dielectric constant (high-k) of the film provides the functionality of a much thinner silicon dioxide film.

대표청구항 ▼

What is claimed is: 1. A method comprising: forming a memory array in a substrate including: forming a dielectric layer containing cerium oxide and aluminum oxide in an integrated circuit including forming the cerium oxide and aluminum oxide layers using an atomic layer deposition (ALD) process; an

What is claimed is: 1. A method comprising: forming a memory array in a substrate including: forming a dielectric layer containing cerium oxide and aluminum oxide in an integrated circuit including forming the cerium oxide and aluminum oxide layers using an atomic layer deposition (ALD) process; and depositing a conductive layer contacting the dielectric layer; and forming an address decoder in the substrate, the address decoder coupled to the memory array. 2. The method of claim 1, wherein the method is a method of forming a flash memory device, and forming the dielectric layer includes forming the dielectric layer as an inter-gate insulator having the conductive layer as a gate of a transistor in the flash memory device. 3. The method of claim 1, wherein the method is a method of forming a memory device, including forming the conductive layer as an electrode of a capacitor and forming the dielectric layer as a dielectric of the capacitor in the memory device. 4. The method of claim 1, wherein the method further includes: forming metallization lines in the memory array; and annealing the memory array in a H2 ambient after forming the metallization lines. 5. The method of claim 1, wherein depositing a conductive layer includes depositing by sputtering. 6. A method comprising: providing a controller; coupling an integrated circuit to the controller, wherein the integrated circuit includes a dielectric layer contacting a conductive layer, the dielectric comprising cerium oxide and aluminum oxide, wherein forming the dielectric layer contacting the conductive layer includes: forming the dielectric layer using an atomic layer deposition process; and depositing the conductive layer such that the conductive layer contacts the dielectric layer. 7. The method of claim 6, wherein coupling an integrated circuit to the controller includes coupling a memory device formed as the integrated circuit. 8. The method of claim 6, wherein providing a controller includes providing a processor. 9. The method of claim 6, wherein coupling an integrated circuit to the controller includes coupling a mixed signal integrated circuit formed as the integrated circuit having the dielectric layer contacting the conductive layer. 10. The method of claim 6, wherein the method is a method of forming an information handling system. 11. A method comprising: forming a memory array in a substrate including forming a dielectric layer containing cerium oxide and aluminum oxide in an integrated circuit as a gate insulator, the cerium oxide formed as a layer with a cerium oxide thickness and the aluminum formed as a layer with a aluminum oxide thickness such that a ratio of the cerium oxide thickness to the aluminum oxide thickness is within a 20% variation from a 2 to 1 value; and depositing a conductive layer contacting the dielectric layer as a gate of a transistor in the memory array. 12. A method comprising: forming a memory array in a substrate including forming a dielectric layer containing cerium oxide and aluminum oxide in an integrated circuit as a gate insulator; and depositing a conductive layer contacting the dielectric layer as a gate of a transistor in the memory array, further including forming the conductive layer as an electrode of a capacitor and forming the dielectric layer as a dielectric of the capacitor in the memory array, forming metallization lines in a portion of the conductive layer, and annealing the memory array in a H2 ambient after forming the metallization lines. 13. The method of claim 11, wherein forming the dielectric layer includes forming an amorphous oxide having a formula of at least one of Al2O3 and CeO2. 14. The method of claim 11, wherein the dielectric layer comprises a first plurality of cerium oxide layers having a selected thickness and a second plurality of aluminum oxide layers having a second selected thickness. 15. The method of claim 14, wherein a ratio of cerium oxide thickness to aluminum oxide thickness is approximately 2 to 1. 16. The method of claim 14, wherein a ratio of cerium oxide thickness to aluminum oxide thickness includes a 20% variation from an approximate 2 to 1 value. 17. The method of claim 11, wherein forming the dielectric layer containing cerium oxide and aluminum oxide includes an atomic layer deposition process. 18. A method comprising: forming a memory array in a substrate including forming a dielectric layer containing cerium oxide and aluminum oxide in an integrated circuit as a gate insulator, wherein forming the dielectric layer containing cerium oxide and aluminum oxide includes an atomic layer deposition process; and depositing a conductive layer contacting the dielectric layer as a gate of a transistor in the memory array, wherein forming the dielectric layer includes having at least two separate cerium oxide deposition steps and one separate aluminum oxide deposition step. 19. The method of claim 11, further including forming an address decoder in the substrate, the address decoder coupled to the memory array. 20. The method of claim 11, wherein forming the memory array includes forming a gate insulator on the substrate, forming a conductive floating gate electrode on the gate insulator, forming the dielectric layer containing cerium oxide and aluminum oxide as an intergate insulator on the conductive floating gate electrode, and forming a conductive control gate electrode on the intergate insulator. 21. The method of claim 11, wherein forming the memory array includes forming a flash memory. 22. A method comprising: forming a memory array in a substrate including forming a dielectric layer containing cerium oxide and aluminum oxide in an integrated circuit as a gate insulator; and depositing a conductive layer contacting the dielectric layer as a gate of a transistor in the memory array, wherein the dielectric layer includes a root mean square surface roughness less than one tenth of a thickness of the dielectric layer. 23. A method comprising: forming a memory array in a substrate including forming a dielectric layer containing cerium oxide and aluminum oxide in an integrated circuit as a gate insulator; and depositing a conductive layer contacting the dielectric layer as a gate of a transistor in the memory array, wherein forming the dielectric layer includes a root mean square surface roughness of less than 5 Angstroms peak to peak. 24. A method comprising: forming a memory array in a substrate including forming a dielectric layer containing cerium oxide and aluminum oxide in an integrated circuit as a gate insulator; and depositing a conductive layer contacting the dielectric layer as a gate of a transistor in the memory array, wherein the dielectric layer has a dielectric constant greater than 20. 25. The method of claim 11, wherein forming the dielectric layer includes forming a diffusion barrier layer disposed between the substrate and the dielectric layer.