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Laser micromachining and methods of same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-026/14
출원번호 UP-0437378 (2003-05-13)
등록번호 US-7754999 (2010-08-02)
발명자 / 주소
  • Pollard, Jeffrey R.
출원인 / 주소
  • Hewlett-Packard Development Company, L.P.
인용정보 피인용 횟수 : 2  인용 특허 : 79

초록

The described embodiments relate to laser micromachining a substrate. One exemplary embodiment removes substrate material from a substrate to a first depth relative to a first surface of the substrate while delivering an assist gas at a first flow rate; and, removes substrate material at a second gr

대표청구항

What is claimed is: 1. A semiconductor substrate processing method comprising: positioning a substrate relative to a laser machine; energizing, with a laser beam produced by the laser machine, a portion of the substrate to promote removal of at least some substrate material to form a desired featur

이 특허에 인용된 특허 (79)

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이 특허를 인용한 특허 (2)

  1. {hacek over (S)}ik, Jan; Kostelník, Petr; Válek, Luká{hacek over (s)}; Lorenc, Michal; Pospí{hacek over (s)}il, Milo{hacek over (s)}; Lysá{hacek over (c)}ek, David; Parsey, Jr., John Michael, Methods of laser marking semiconductor substrates.
  2. {hacek over (S)}ik, Jan; Kostelnik, Petr; Válek, Luká{hacek over (s)}; Lorenc, Michal; Pospí{hacek over (s)}il, Milo{hacek over (s)}; Lysá{hacek over (c)}ek, David; Parsey, Jr., John Michael, Semiconductor devices and methods of making the same.
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