The present invention relates to a new pharmaceutical blister with reduced permeability to water vapor and gas. It is proposed according to the invention to coat conventional blisters with a silicon oxide-containing functional layer to protect against gases, water vapor and organic molecules.
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What is claimed is: 1. A blister pack comprising: a substantially planar cover foil comprising a layer of aluminum; and a base foil comprising a flexible, translucent, vapor barrier layer consisting essentially of a carbon-containing oxide having the formula: MOxCyHz wherein M is silicon or ti
What is claimed is: 1. A blister pack comprising: a substantially planar cover foil comprising a layer of aluminum; and a base foil comprising a flexible, translucent, vapor barrier layer consisting essentially of a carbon-containing oxide having the formula: MOxCyHz wherein M is silicon or titanium, O is oxygen, C is carbon, H is hydrogen, x is an integer and x≧1, y is an integer and y≧1, and z is an integer and z≧0, and wherein the flexible barrier layer has a thickness of about 100 to 500 nm. 2. The blister pack of claim 1, wherein the base foil further comprises a polyvinylchloride film and the flexible, translucent, vapor barrier layer is applied to an inside of the polyvinylchloride film. 3. The blister pack of claim 2, wherein the cover foil further comprises a first, outermost cover layer of paper or lacquer, and a second cover layer of polyethylene terephthalate, the layer of aluminum being a third, innermost layer, and wherein the base foil further comprises an aluminum layer and a polyamide layer, an outside of the polyvinylchloride film being applied to an inside of the aluminum layer, and an outside of the aluminum layer being applied to an inside of the polyamide layer. 4. The blister pack of claim 3, wherein the second cover layer of polyethylene terephthalate has a thickness of about 5 to about 20 microns, the third, innermost cover layer of aluminum has a thickness of about 10 to about 60 microns, the polyvinylchloride film has a thickness of about 10 to about 200 microns, the aluminum layer in the base foil has a thickness of about 30 to about 60 microns, and the polyamide layer has a thickness of about 10 to about 40 microns, whereby the deformed base foil has a thickness of about 30 to about 500 microns. 5. A blister pack comprising: a layer comprising a flexible, translucent, vapor barrier layer consisting essentially of a carbon-containing oxide having the formula: SiOxCyHz wherein Si is silicon, O is oxygen, C is carbon, H is hydrogen, x is an integer and x≧1, y is an integer and y≧1, and z is an integer and z≧0; a layer comprising SiO2; a layer comprising a flexible, translucent, vapor barrier layer consisting essentially of a carbon-containing oxide having the formula: SiOaCbHc wherein Si is silicon, O is oxygen, C is carbon, H is hydrogen, a is an integer and a≧1, b is an integer and b≧1, and c is an integer and c≧0; and wherein the SiO2 layer is located between the SiOxCyHz layer and the SiOaCbHc layer. 6. The blister pack of claim 5, wherein the blister pack further comprises a planar cover foil comprising a layer of aluminum. 7. A blister pack comprising: a substantially planar cover foil comprising a layer of aluminum; and a base foil comprising a flexible, translucent, vapor barrier layer consisting of a carbon-containing oxide having the formula: MOxCyHz wherein M is silicon or titanium, O is oxygen, C is carbon, H is hydrogen, x is an integer and x≧1, y is an integer and y≧1, and z is an integer and z≧0, and wherein the flexible barrier layer has a thickness of about 100 to 500 nm.
Etzkorn Heinz W. (Neu Anspach DEX) Krmmel Harald (Mainz DEX) Paquet Volker (Mainz DEX) Weidmann Gnter (Armsheim DEX), Plasma CVD process for coating a dome-shaped substrate.
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