[특허]Flame retardant and microbe inhibiting methods and compositions

SMT, Inc.

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특허 상세정보

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Flame retardant and microbe inhibiting methods and compositions

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	C09D-005/14 C09D-005/18
미국특허분류(USC)	106/015.05; 106/018.11; 106/018.13; 106/018.14; 106/018.26; 106/018.3; 106/018.31; 252/601
출원번호	UP-0805089 (2004-03-19)
등록번호	US-7767010 (2010-08-24)
발명자 / 주소	Curzon, Jon Lee Smoot, Thomas William
출원인 / 주소	SMT, Inc.
대리인 / 주소	Hastreiter, Roberta L.
인용정보	피인용 횟수 : 4 인용 특허 : 34

초록
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The present invention provides compositions for application to a material, such as building materials, prior to an exposure of the material to fire, or prior to, during or after exposure of the material to conditions favorable to the growth of microbes. When compositions within the present invention are properly applied to a material, they have the effect of reducing the amount of burning that occurs to the material, and/or reducing the amount or density of smoke and associated toxic gases produced by the material, when the material is exposed to fire, and inhibiting the growth of microbes on the material when the material is exposed to conditions favorable to the growth of microbes. The invention also provides methods for reducing the burning of a material that is exposed to fire, and for inhibiting the growth of microbes on a material exposed to conditions favorable to the growth of microbes.

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What is claimed is: 1. A composition for application to a material comprising: (a) at least one alkaline metal inorganic salt, wherein the alkaline metal inorganic salt is present in the composition in an amount ranging from about 5% to about 45% by weight; (b) at least one potassium salt of an organic acid, wherein the potassium salt of an organic acid is present in the composition in an amount ranging from about 1% to about 72% by weight; (c) optionally, at least one boron-containing compound, wherein the boron-containing compound is present in the composition in an amount ranging from about 0% to about 10% by weight; (d) optionally, at least one surfactant, wherein the surfactant is present in the composition in an amount ranging from about 0% to about 5% by weight; (e) at least one microbe-inhibiting compound, wherein the microbe-inhibiting compound is present in the composition in an amount ranging from about 0.1% to about 6% by weight; (f) at least one detection component, wherein the detection component is present in the composition in an amount ranging from about 0.01% to about 3% by weight such that it permits a determination of whether or not the composition has been applied to the material; and (g) an aqueous liquid, wherein the aqueous liquid is present in the composition in an amount that brings the percent weight of the composition to 100%; wherein the composition has a pH ranging from about 7.1 to about 14, and wherein the composition, when applied to the material, reduces the amount of burning that occurs to the material, or the amount or density of smoke produced by the material, when the material is subsequently exposed to fire, and when the composition is applied to a material prior to, during or after the material being exposed to conditions favorable to the growth of microbes, reduces, inhibits or prevents the growth of microbes on the material when the material is exposed to conditions favorable to the growth of microbes. 2. The composition of claim 1 wherein the detection component is present in an amount ranging from about 0.01% to about 2% by weight. 3. The composition of claim 2 wherein the detection component is present in an amount of about 0.7%. 4. A composition for application to a material comprising: (a) at least one alkaline metal inorganic salt, wherein the alkaline metal inorganic salt is present in the composition in an amount ranging from about 5% to about 45% by weight; (b) at least one potassium salt of an organic acid, wherein the potassium salt of an organic acid is present in the composition in an amount ranging from about 1% to about 72% by weight; (c) optionally, at least one boron-containing compound, wherein the boron-containing compound is present in the composition in an amount ranging from about 0% to about 10% by weight; (d) optionally, at least one surfactant, wherein the surfactant is present in the composition in an amount ranging from about 0% to about 5% by weight; (e) at least one microbe-inhibiting compound, wherein the microbe-inhibiting cmpound is present in the composition in an amount ranging from about 0.1% to about 6% by weight; (f) at least one detection component, wherein the detection component is present in the composition in an amount ranging from about 0.01% to about 10% by weight such that it permits a determination of whether or not the composition has been applied to the material; and (g) an aqueous liquid, wherein the aqueous liquid is present in the composition in an amount that brings the percent weight of the composition to 100%; wherein the composition has a pH ranging from about 7.1 to about 14, and wherein the composition, when applied to the material, reduces the amount of burning that occurs to the material, or the amount or density of smoke produced by the material, when the material is subsequently exposed to fire, and when the composition is applied to a material prior to, during or after the material being exposed to conditions favorable to the growth of microbes, reduces, inhibits or prevents the growth of microbes on the material when the material is exposed to conditions favorable to the growth of microbes. 5. The composition of claim 4 wherein the microbe-inhibiting compound functions as the detection component. 6. The composition of claim 4 wherein the alkaline metal inorganic salt is present in an amount ranging from about 20% to about 42% by weight. 7. The composition of claim 6 wherein the potassium salt of an organic acid is present in an amount ranging from about 2% to about 60% by weight. 8. The composition of claim 7 wherein the potassium salt of an organic acid is present in an amount ranging from about 2% to about 40% by weight. 9. The composition of claim 8 wherein the potassium salt of an organic acid is present in an amount ranging from about 8% to about 15% by weight. 10. The composition of claim 9 wherein the composition contains a boron-containing compound, and wherein the boron-containing compound is present in an amount ranging from about 0.4% to about 8% by weight. 11. The composition of claim 10 wherein the composition contains a surfactant, and wherein the surfactant is present in an amount ranging from about 0.3% to about 3% by weight. 12. The composition of claim 11 wherein the microbe-inhibiting compound is present in an amount ranging from about 0.1% to about 3% by weight. 13. The composition of claim 12 wherein the detection component is present in an amount ranging from about 0.01% to about 3% by weight. 14. The composition of claim 13 wherein the boron-containing compound is present in an amount ranging from about 1% to about 6% by weight. 15. The composition of claim 14 wherein the surfactant is present in an amount ranging from about 0.5% to about 0.7% by weight. 16. The composition of claim 4 wherein the alkaline metal inorganic salt is potassium carbonate, potassium carbonate sesquihydrate, potassium gluconate, potassium citrate, potassium sorbate, potassium bromide, potassium chloride, potassium chromate, potassium fluoride, potassium iodide, potassium salicylate, potassium selinate, potassium silicate, potassium thioantimonate, potassium sulfide, potassium sulfate, potassium thiosulfate, potassium tartrate, potassium phosphate, sodium acetate, sodium carbonate, sodium formate, sodium sorbate, sodium sulfate, sodium tartrate, sodium nitrate, sodium phosphate, sodium gluconate, sodium citrate, sodium sorbate, lithium sulfate, lithium tartrate, lithium nitrate, lithium phosphate, rubidium acetate, rubidium carbonate, rubidium sulfate, cesium acetate, cesium sulfate or a combination of one or more of the foregoing. 17. The composition of claim 16 wherein the potassium salt of an organic acid is potassium acetate, potassium formate, potassium tartrate, potassium citrate, potassium sorbate, potassium lactate or potassium gluconate. 18. The composition of claim 17 wherein the composition contains a boron-containing compound, and wherein the boron-containing compound is ammonium borate, sodium borate, potassium borate, calcium borate, potassium tetraborate or potassium pentaborate. 19. The composition of claim 18 wherein the composition contains a surfactant, and wherein the surfactant is isodecyloxypropyl dihydroxy methyl ammonium chloride, cetyl trimethyl ammonium bromide, telomer B monoether, alkyl imino acid, monosodium salt, B-alanine, N-(2-carboxyethyl)-N-3 decyloxy propyl monosodium salt, Neodol 25-7, Neodol 25-9, alkyloxypolyethoxeneoxyethanol, Tergitol 15-S-7, Nonylphenol, NP-9 Ethoxalted nonylphenol or Octyphenol. 20. The composition of claim 19 wherein the microbe-inhibiting compound is 2-pyridinethiol-1-oxide, sodium salt, 3-iodo-2-propynyl butyl carbamate, disodium cyanoditholmidocarbonate, potassium N-methyldithiocarbamate, ethanol, 2,2′-(cocoimino)-bis, salt with phosphoric acid, bis (2-ethylhexyl ester (1:1), ethanol, 2,2′-(cocoimino)-bis, salt with phosphoric acid, mono (2-ethylhexyl) ester (1:1), phosphoric acid, mono (2-ethylhexyl) ester, bis(tri-N-butylin)oxide, ortho-phenyl phenol, potassium iodide, ammonium iodide, potassium iodate, ammonium iodate, 10-10 oxybisphenoxyarsine, octadecyl.nodim.ethyltrihydroxy silypropyl ammonium chloride or 3-(trimethoxysilyl) propyloctadecyldimethyl ammonium chloride. 21. The composition of claim 20 wherein the microbe-inhibiting compound is 2-pyridinethiol-1-oxide, sodium salt. 22. The composition of claim 20 wherein the detection component is 3-iodo-2-propynyl butyl carbamate, zirconia, selenium dioxide, zirconium acetate or a boron-containing compound. 23. The composition of claim 22 wherein the alkaline metal inorganic salt is potassium carbonate. 24. The composition of claim 23 wherein the potassium salt of an organic acid is potassium acetate. 25. The composition of claim 24 wherein the boron-containing compound is potassium tetraborate or potassium pentaborate. 26. The composition of claim 25 wherein the surfactant is isodecyloxypropyl dihydroxy methyl ammonium chloride. 27. The composition of claim 26 wherein the detection component is 3-iodo-2-propynyl butyl carbamate or a boron-containing compound. 28. The composition of claim 27 wherein the microbe-inhibiting compound is 3-iodo-2-propynyl butyl carbamate, and the 3-iodo-2-propynyl butyl carbamate also functions as the detection component. 29. The composition of claim 28 wherein the pH of the composition is about 11 or higher. 30. The composition of claim 17 wherein the boron-containing compound is potassium metaborate. 31. The composition of claim 8 wherein the detection component is 3-iodo-2-propynyl butyl carbamate, zirconia, selenium dioxide, zirconium acetate or a boron-containing compound. 32. The composition of claim 31 wherein the detection component is 3-iodo-2-propynyl butyl carbamate or a boron-containing compound. 33. The composition of claim 4 wherein the alkaline metal inorganic salt is potassium bicarbonate. 34. A composition for application to a material comprising: (a) potassium carbonate in an amount of about 25% by weight; (b) potassium acetate in an amount of about 13% by weight; (c) potassium tetraborate or potassium pentaborate in an amount of about 2% by weight; (d) optionally, at least one surfactant, wherein the surfactant is present in the composition in an amount ranging from about 0% to about 5% by weight; (e) at least one microbe-inhibiting compound, wherein the microbe-inhibiting compound is present in the composition in an amount ranging from about 0.1% to about 6% by weight; (f) optionally, at least one detection component, wherein the detection component is present in the composition in an amount ranging from about 0% to about 10% by weight; and (g) water, wherein the water is present in the composition in an amount that brings the percent weight of the composition to 100%; wherein the composition has a pH of about 11 or higher, and wherein the composition, when applied to the material, reduces the amount of burning that occurs to the material, or the amount or density of smoke produced by the material, when the material is subsequently exposed to fire, and when the composition is applied to a material prior to, during or after the material being exposed to conditions favorable to the growth of microbes, reduces, inhibits or prevents the growth of microbes on the material when the material is exposed to conditions favorable to the growth of microbes. 35. The composition of claim 34 wherein the composition additionally contains isodecyloxypropyl dihydroxy methyl ammonium chloride in an amount of about 0.5% by weight, and wherein the microbe-inhibiting compound is 2-pyridinethiol-1-oxide, sodium salt in an amount ranging from about 0.4% to about 0.9% by weight. 36. The composition of claim 35 wherein the 2-pyridinethiol-1-oxide, sodium salt is present in an amount of about 0.5% by weight. 37. The composition of claim 34 wherein the composition additionally contains isodecyloxypropyl dihydroxy methyl ammonium chloride in an amount of about 0.5% by weight, and wherein the microbe-inhibiting compound is 3-iodo-2-propynyl butyl carbamate in an amount of about 0.7% by weight.

이 특허에 인용된 특허 (34)

이 특허를 인용한 특허 피인용횟수: 4

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Flame retardant and microbe inhibiting methods and compositions

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