초록 ▼

The present invention relates to a press for encapsulating electronic components, comprising: two displaceable mold parts (5,6), feed means for encapsulating material, and a drive mechanism connecting onto the mold parts. In a first embodiment the drive mechanism is provided with a fluid bed (14) an

The present invention relates to a press for encapsulating electronic components, comprising: two displaceable mold parts (5,6), feed means for encapsulating material, and a drive mechanism connecting onto the mold parts. In a first embodiment the drive mechanism is provided with a fluid bed (14) and a first fluid feed (15) whereby their connection can be interrupted by a displacer (16). In a further embodiment a displacer (28) is provided in the feed channel (26) to place the encapsulating material (25) under pressure. Furthermore, the present invention relates to methods for encapsulating electronic components with encapsulating material in such presses.

대표청구항 ▼

The invention claimed is: 1. A press for encapsulating electronic components with an encapsulating material, comprising: opposed first and second mould parts, wherein at least the first mould part is displaceable relative to the second mould part between closed and open conditions, and wherein the

The invention claimed is: 1. A press for encapsulating electronic components with an encapsulating material, comprising: opposed first and second mould parts, wherein at least the first mould part is displaceable relative to the second mould part between closed and open conditions, and wherein the first and second mould parts define a mold cavity when in the closed condition thereof for containing an electronic component to be encapsulated, feed means for feeding the encapsulating material to mold cavity defined by the first and second mould parts, and a drive mechanism operatively connected to at least the first mould part, wherein the drive mechanism includes, (i) a fluid bed having a fixed base part, a moveable operating part connected to the first mould part, a fluid-containing space defined between the fixed base part and the moveable operating part, and a first fluid feed which is fluid-connected to the fluid-containing space; and (ii) a fluid-activated cylinder having a second fluid feed; (iii) a displacer operatively connected to the cylinder and positioned with respect to the fluid-containing space and the first fluid feed so as to be moveably displaceable upon operation of the cylinder between a first position wherein the first fluid feed is in fluid-communication with the fluid-containing space to allow a fluid from a fluid source to be introduced into the fluid-containing space, and a second condition wherein the displacer extends into the fluid-containing space so as to disconnect fluid communication between the first fluid feed and the fluid-containing space and to increase pressure of the fluid in the fluid-containing space when the first and second mould parts are in the closed condition thereof, and (iv) a common fluid feed source operatively connected to both the first fluid feed of the fluid bed and second fluid feed of the cylinder. 2. A press as claimed in claim 1, which further comprises a frame provided with at least two plate-like frame parts placed substantially vertically adjacent to the first and second mould parts. 3. A press as claimed in claim 1, which comprises a plurality of mutually adjacent first and second mould parts. 4. A press as claimed in claim 3, wherein the drive mechanism includes a plurality of fluid beds, and wherein each of the mutually adjacent displaceable mould parts includes a separate one of the fluid beds. 5. A press as claimed in claim 1, wherein the fluid bed and the cylinder have respective transmission ratio, and wherein the transmission ratio of the fluid bed is smaller than the transmission ratio of the cylinder. 6. A press as claimed in claim 1, wherein the cylinder is a pneumatic cylinder. 7. A press was claimed in claim 1, wherein the first and second mould parts define respective contact surfaces, and wherein the fluid bed is disposed parallel to the contact surfaces of the first and second mould parts. 8. A press as claimed in claim 7, wherein the displacer is moveably displaceable parallel to the contact surfaces of mould parts. 9. A press as claimed in claim 1, wherein the displaceable first mould part forms part of the fluid bed. 10. A press as claimed in claim 9, wherein the first and second mould parts define respective contact surfaces, and wherein the displacer is moveably displaceable parallel to the contact surfaces of the first and second mould parts. 11. A press as claimed in claim 10, wherein the displacer is moveably displaceable on a side of the first and second mould parts that is remote from the contact surfaces thereof. 12. Method for encapsulating electronic components with encapsulating material in a press according to claim 1, wherein the method comprises the processing steps of: A) placing an electronic component for encapsulating on one of the opposite mould parts; B) moving the two opposite mould parts each other at a first speed, C) after processing step B) making the opposite mould parts connect onto each other at a second speed which is less than the first speed such that the electronic component for encapsulating is enclosed between the mould parts; and D) feeding the encapsulating material to the electronic component, wherein the processing steps B) and C) are forcibly mutually separated in that during processing step C) a safeguard prevents that processing step B) also takes place simultaneously.