초록 ▼

A processing apparatus configured to transfer a pattern of a mold onto a target member by pressing the mold against a resin applied to the target member includes a driver configured to move the mold and the target member relative to each other, and a controller configured to control the driver so th

A processing apparatus configured to transfer a pattern of a mold onto a target member by pressing the mold against a resin applied to the target member includes a driver configured to move the mold and the target member relative to each other, and a controller configured to control the driver so that a changing rate of a load generated between the mold and the resin in a first state is smaller than that in a second state, and the first state being a state in which the mold that adheres to the resin starts moving in a direction separating from the resin, and the second state being a state in which the mold that moves in the direction separating from the resin is about to separate from the resin.

대표청구항 ▼

What is claimed is: 1. A processing apparatus configured to transfer a pattern of a mold onto a target member by pressing the mold against an adhesive resin applied to the target member and releasing the mold from the adhesive resin, said processing apparatus comprising: a first driver configured t

What is claimed is: 1. A processing apparatus configured to transfer a pattern of a mold onto a target member by pressing the mold against an adhesive resin applied to the target member and releasing the mold from the adhesive resin, said processing apparatus comprising: a first driver configured to hold the mold; a second driver configured to connect to the first driver via a spring; and a controller configured to control the second driver so that an absolute value of a second load changing rate is smaller than an absolute value of a first load changing rate, wherein the first load changing rate is a changing rate of a load generated between the mold and the adhesive resin when the second driver starts moving in a release direction releasing the mold from the adhesive resin, the first driver stops, and the mold contacts the adhesive resin, and wherein the second load changing rate is a changing rate of a load generated between the mold and the adhesive resin when the second driver continues moving in the release direction, the first driver starts moving in the release direction, and the mold separates from the adhesive resin. 2. A processing apparatus according to claim 1, wherein the spring is a load sensor, and wherein the controller is configured to control the second driver based on an output of the load sensor. 3. A processing apparatus according to claim 1, wherein the controller is configured to control the second driver based on an elapsed time period from when a release step releasing the mold from the adhesive resin starts. 4. A processing apparatus configured to transfer a pattern of a mold onto a target member by pressing the mold against an adhesive resin applied to the target member and releasing the mold from the adhesive resin, said processing apparatus comprising: a first driver configured to hold the mold; a second driver configured to connect to the first driver via a spring; and a controller configured to control the second driver so that a second speed is smaller than a first speed, wherein the first speed is a speed of the second driver with respect to the target member when the second driver starts moving in a release direction releasing the mold from the adhesive resin, the first driver stops, and the mold contacts the adhesive resin, and wherein the second speed is a speed of the second driver with respect to the target member when the second driver continues moving in the release direction, the first driver starts moving in the release direction, and the mold separates from the adhesive resin. 5. A processing apparatus according to claim 4, wherein the controller is configured to control the second driver so that a third speed is larger than the second speed, and wherein the third speed is a speed of the second driver with respect to the target member when both the second driver and the first driver continue moving in the release direction and the mold does not contact the adhesive resin. 6. A processing apparatus according to claim 4, wherein the spring is a load sensor, and wherein the controller is configured to control the second driver based on an output of the load sensor. 7. A processing apparatus according to claim 4, wherein the controller is configured to control the second driver based on an elapsed time period from when a release step releasing the mold from the adhesive resin starts. 8. A processing apparatus configured to transfer a pattern of a mold onto a target member by pressing the mold against an adhesive resin applied to the target member and releasing the mold from the adhesive resin, said processing apparatus comprising: a stage configured to hold the mold; and a drive controller configured to control a drive of the stage so that an absolute value of a changing rate of a load generated between the mold and the adhesive resin at an instant of separation when the mold separates from the adhesive resin is smaller than an absolute value of a changing rate of a load generated between the mold and the adhesive resin when a release step releasing the mold from the adhesive resin starts. 9. A processing apparatus according to claim 8, wherein the drive controller is configured to control the drive of the stage so that a speed of the mold with respect to the target member when the release step ends is larger than a speed of the mold with respect to the target member at the instant of separation. 10. A processing apparatus configured to transfer a pattern of a mold onto a target member by pressing the mold against an adhesive resin applied to the target member and releasing the mold from the adhesive resin, said processing apparatus comprising: a stage configured to hold the mold; and a drive controller configured to control a drive of the stage so that a speed of the mold with respect to the target member when a release step releasing the mold from the adhesive resin ends is larger than a speed of the mold with respect to the target member at an instant of separation when the mold separates from the adhesive resin.