Protective packaging for an LED module
원문보기
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0200872
(2008-08-28)
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등록번호 |
US-7789242
(2010-09-27)
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우선권정보 |
CN-2008 1 0066154(2008-03-21) |
발명자
/ 주소 |
- Shuai, Chun-Jiang
- Yu, Guang
- Lai, Cheng-Tien
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출원인 / 주소 |
- Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.
- Foxconn Technology Co., Ltd.
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
1 인용 특허 :
1 |
초록
▼
A protective packaging for protecting an LED module from being damaged during transportation, includes a housing containing the LED module therein and a cover slidably fixed in the housing to cover a top opening of the housing. The housing defines a room to receive the LED module therein. A bottom p
A protective packaging for protecting an LED module from being damaged during transportation, includes a housing containing the LED module therein and a cover slidably fixed in the housing to cover a top opening of the housing. The housing defines a room to receive the LED module therein. A bottom portion of the housing is concaved to form a space, in which a thermal interface material bonded on the LED module is accommodated. An end of the housing is closed to abut against an end of the cover, and an opposite end of the housing is partially opened to receive an opposite end of the cover. The protective packaging is made from an antistatic plastic and has a wall thickness larger than 0.5 mm.
대표청구항
▼
What is claimed is: 1. A protective packaging for protecting an LED module therein, comprising: a housing for containing the LED module therein; and a cover movably attached in the housing to cover an opening of the housing, wherein the housing has a wall thickness of at least 0.5 mm; wherein the h
What is claimed is: 1. A protective packaging for protecting an LED module therein, comprising: a housing for containing the LED module therein; and a cover movably attached in the housing to cover an opening of the housing, wherein the housing has a wall thickness of at least 0.5 mm; wherein the housing comprises a bottom plate, a pair of sidewalls extending upwardly from two opposite sides of the bottom plate and a pair of baffle plates extending upwardly from another two opposite sides of the bottom plate, the bottom plate, the pair of sidewalls and the pair of baffle plates together defining a room adapted for receiving the LED module therein; wherein the bottom plate has a portion concaved downwardly to form a space, the space being at a lower part of the room, the space being adapted for receiving a thermal interface material attached to the LED module; wherein the housing further comprises a pair of flanges extending inwardly from tops of the pair of sidewalls, respectively, the cover being in interfering contact with the pair of flanges; and wherein one of the pair of baffle plates is connected to the pair of flanges to seal one end of the housing, an extremity of the cover abutting against the one of the pair of baffle plates. 2. The protective packaging as claimed in claim 1, wherein two opposite surfaces of the bottom plate defining two confronting laterals of the space are arced. 3. The protective packaging as claimed in claim 1, wherein another one of the pair of baffle plates is spaced from the pair of flanges via a slit to partially seal an opposite end of the housing, an opposite extremity of the cover being fittingly received in the slit. 4. The protective packaging as claimed in claim 1, wherein the pair of flanges are oriented perpendicular to the pair of sidewalls and parallel to the cover. 5. The protective packaging as claimed in claim 1, wherein the cover is slidably relative to the housing. 6. The protective packaging as claimed in claim 1, wherein the housing and the cover are made from an antistatic material. 7. An LED package comprising: an LED module having a thermal interface material attached to a bottom thereof; a protective packaging receiving the LED module therein, comprising: a housing defining a room accommodating the LED module therein, the housing has a closed end and a partially opened end opposite to the closed end; and a cover retained in the housing to cover the LED module, the cover having an extremity abutting against the closed end of the housing, and an opposite extremity fitted in the partially opened end of the housing; wherein the room having a narrowed lower space receiving the thermal interface material therein. 8. The LED package as claimed in claim 7, wherein the partially opened end of the housing defines a slit, the slit having a height less than a thickness of the cover to interferingly receive the opposite extremity of the cover therein. 9. The LED package as claimed in claim 7, wherein the cover is rectangular and planar and slidably received in a top of the housing. 10. The LED package as claimed in claim 7, wherein the housing has a pair of flanges extending toward each other above the room, the pair of flanges abutting against a top of the cover to confine the cover to the housing. 11. The LED package as claimed in claim 7, wherein the protective packaging is antistatic. 12. The LED package as claimed in claim 11, wherein the protective packaging is made from antistatic plastic. 13. The LED package as claimed in claim 7, wherein the protective packaging has a wall thickness larger than 0.5 mm. 14. An LED package comprising: a housing defining a room having an upper portion and a lower portion narrower than the upper portion; an LED module including a substrate, at least an LED mounted on a top of the substrate and a thermal interface material attached to a bottom of the substrate, wherein the at least LED and the substrate are received in the upper portion of the room and the thermal interface material is received in the lower portion of the room; and a cover attached to the housing to cover an upper opening of the room. 15. The LED package as claimed in claim 14, wherein the substrate is a printed circuit board. 16. The LED package as claimed in claim 14, wherein the thermal interface material is one of thermal grease and thermal tape. 17. The LED package as claimed in claim 14, wherein the cover is slidably attached to the housing.
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Abe Tsutomu (Isehara JPX), Container for recording head.
이 특허를 인용한 특허 (1)
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Stitzlein, Marc, Container to hold gifts.
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