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[미국특허] Microelectronic contact structures 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-012/00
출원번호 UP-0511057 (2009-07-28)
등록번호 US-7798822 (2010-10-11)
발명자 / 주소
  • Eldridge, Benjamin N.
  • Grube, Gary W.
  • Khandros, Igor Y.
  • Mathieu, Gaetan L.
출원인 / 주소
  • FormFactor, Inc.
대리인 / 주소
    Durraston, N. Kenneth
인용정보 피인용 횟수 : 3  인용 특허 : 80

초록

Microelectronic contact structures are fabricated by separately forming, then joining together, various components thereof. Each contact structure has three components: a “post” component, a “beam” component, and a “tip” component. The resulting contact stru

대표청구항

What is claimed is: 1. An electronic device comprising: a wiring substrate comprising a surface and a plurality of electrically conductive terminals on the surface; a plurality of electrically conductive spring contact elements each mechanically and electrically coupled to one of the terminals, eac

이 특허에 인용된 특허 (80) 인용/피인용 타임라인 분석

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  15. Kister,January, Freely deflecting knee probe with controlled scrub motion.
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  29. Kim Sang Y. (Kyoungki-do KRX), Method for fabricating low resistance contacts of semiconductor device.
  30. Smith Donald Leonard ; Alimonda Andrew Sebastian, Method for forming a spring contact.
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  33. Yanof Arnold W. (Tempe AZ) Dauksher William (Mesa AZ), Method for manufacturing a probe.
  34. Farnworth Warren M. (Nampa ID) Grief Malcolm (Boise ID) Sandhu Gurtej S. (Boise ID), Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor cir.
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  36. Mathieu Gaetan L. ; Eldridge Benjamin N. ; Grube Gary W., Method of making and using lithographic contact springs.
  37. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Method of making lithographic contact elements.
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  39. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of mounting resilient contact structures to semiconductor devices.
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  41. Gaetan L. Mathieu ; Benjamin N. Eldridge ; Gary W. Grube, Methods for making spring interconnect structures.
  42. Karavakis Konstantine ; Fjelstad Joseph, Methods of making semiconductor assemblies with reinforced peripheral regions.
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  45. DiStefano Thomas H. ; Smith John W., Microelectronic assemblies with multiple leads.
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  48. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structures, and methods of making same.
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  51. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Microelectronic spring contact element and electronic component having a plurality of spring contact elements.
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  54. Sugihara Osamu (Nagasaka JPX), Microprobe provided circuit substrate and method for producing the same.
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  60. Smith Donald L. (Palo Alto CA) Alimonda Andrew S. (Los Altos CA), Photolithographically patterned spring contact.
  61. Smith Donald Leonard ; Alimonda Andrew Sebastian, Photolithographically patterned spring contact.
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  64. Ko Jun S. (Seoul KRX), Probe structure for testing a semiconductor chip and a press member for same.
  65. Hattori, Atsuo; Sawada, Shuichi; Sugiura, Masahiro; Terada, Yoshiki, Probe unit having resilient metal leads.
  66. Kiyoshi Takekoshi JP, Probing card.
  67. Tada Tetsuo (Hyogo JPX) Takagi Ryoichi (Hyogo JPX) Kohara Masanobu (Hyogo JPX), Probing plate for wafer testing.
  68. Araki Toru (Tokyo JPX), Semiconductor acceleration detecting device.
  69. DiStefano Thomas H. (Bronxville NY) Grube Gary W. (Monroe NY) Khandros Igor Y. (Peekskill NY) Mathiew Gatan (Carmel NY), Semiconductor connection components and methods with releasable lead support.
  70. Yanof Arnold W. (Tempe AZ) Dauksher William (Mesa AZ), Semiconductor structure and method of manufacture.
  71. Ruf Alexander (Mainz DEX) Abraham Michael (Mainz DEX) Lacher Manfred (Mainz DEX) Zetterer Thomas (Schwabenheim DEX) Dietrich Thomas R. (Frankfurt DEX), Sensor head for use in atomic force microscopy and method for its production.
  72. Slocum Alexander H. ; Ziegenhagen ; II R. Scott ; Richard Robert A., Small contactor for test probes, chip packaging and the like.
  73. Faraci Anthony B. ; Zaccardi James B. ; DiStefano Thomas H. ; Smith John W., Socket for engaging bump leads on a microelectronic device and methods therefor.
  74. White William J. (Chelmsford MA) Ortolf James M. (Acton MA), Spring finger interconnect for IC chip carrier.
  75. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W.; Larder, Richard A., Spring interconnect structures.
  76. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W.; Larder, Richard A., Spring interconnect structures.
  77. Mathieu,Gaetan L.; Eldridge,Benjamin N.; Grube,Gary W.; Larder,Richard A., Spring interconnect structures.
  78. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA) Ringler Daniel R. (Elizabethville PA), Surface mount electrical connector.
  79. Bishop Thomas Alan (7444 Dallas Dr. Austin TX 78729) Nolan Ernest Ricky (1204 Robin Trail Round Rock TX 78681), Tab tape-based bare chip test and burn-in carrier.
  80. Abys Joseph A. (Warren NJ) Kadija Igor V. (Ridgewood NJ) Maisano ; Jr. Joseph J. (Denville NJ) Nakahara Shohei (North Plainfield NJ), Thermal annealing of palladium alloys.

이 특허를 인용한 특허 (3) 인용/피인용 타임라인 분석

  1. Yokoo, Kazumasa, Connection device and timepiece.
  2. Despont, Michel; Duerig, Urs T.; Grogg, Daniel; Knoll, Armin W.; Koren, Elad, Electromechanical switching device with 2D layered material surfaces.
  3. Fan, Li; Armstrong, Michael J.; Gritters, John K., Process of positioning groups of contact structures.

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