Electroplating on roll-to-roll flexible solar cell substrates
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C25D-017/00
출원번호
UP-0566200
(2006-12-01)
등록번호
US-7799182
(2010-10-11)
발명자
/ 주소
Lopatin, Sergey
Eaglesham, David
Gay, Charles
출원인 / 주소
Applied Materials, Inc.
대리인 / 주소
Patterson & Sheridan, LLP
인용정보
피인용 횟수 :
7인용 특허 :
39
초록▼
Embodiments of the invention contemplate the formation of a low cost flexible solar cell using a novel electroplating method and apparatus to form a metal contact structure. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes t
Embodiments of the invention contemplate the formation of a low cost flexible solar cell using a novel electroplating method and apparatus to form a metal contact structure. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. Solar cell substrates that may benefit from the invention include flexible substrates may have an active region that contains organic material, single crystal silicon, multi-crystalline silicon, polycrystalline silicon, germanium, and gallium arsenide, cadmium telluride, cadmium sulfide, copper indium gallium selenide, copper indium selenide, gallilium indium phosphide, as well as heterojunction cells that are used to convert sunlight to electrical power. The flexible substrates may have a flexible base that is adapted to support the active region of the solar cell device.
대표청구항▼
What is claimed is: 1. An apparatus for forming a metal layer on a flexible solar cell substrate, comprising: a first processing chamber comprising: an electrode that is in electrical communication with a power supply; a flexible substrate assembly comprising: a support that is adapted to retain a
What is claimed is: 1. An apparatus for forming a metal layer on a flexible solar cell substrate, comprising: a first processing chamber comprising: an electrode that is in electrical communication with a power supply; a flexible substrate assembly comprising: a support that is adapted to retain a portion of a flexible substrate; and an actuator that is connected to the support and is adapted to position a metallized surface of the flexible substrate in a desired position proximate to the electrode; a contact that is in communication with the power supply; and a thrust plate that is adapted to urge the metallized surface of the flexible substrate against the contact; and a second processing chamber comprising: an actuator that is configured to urge a region of an interconnect roll against a region of the metallized surface, wherein the region of interconnect roll comprises a conductive metal layer; and a thrust plate containing at least one heating element that is configured to deliver energy to the regions of the interconnect roll and the metallized surface. 2. The apparatus of claim 1, further comprising a masking plate having a body, a first surface, a second surface and a plurality of apertures that extend through the body between the first surface and the second surface, wherein the thrust plate is further adapted to urge the metallized surface against the first surface of the masking plate, wherein a plurality of electrical contacts are disposed on the first surface and are electrically coupled to a power supply. 3. The apparatus of claim 2, further comprising a pump that is adapted to deliver an electrolyte to space formed between a portion of the metallized surface exposed by the apertures and the electrode. 4. The apparatus of claim 2, wherein the masking plate comprises: a first region that is adjacent to the first surface, and comprises a polymeric material; and a second region that comprises a material selected from a group consisting of glass, plastic and ceramic. 5. The apparatus of claim 2, wherein the sum of the cross-sectional areas of the apertures at the first surface is between about 0.5% and about 95% of the surface area of the portion of the masking plate that that contacts the metallized layer. 6. The apparatus of claim 2, wherein the sum of the cross-sectional areas of the apertures at the first surface is less than about 30% of the surface area of the portion of the masking plate that that contacts the metallized layer. 7. The apparatus of claim 1, further comprising: a first fluid source that is adapted to deliver a copper ion containing electrolyte to the metallized surface and the electrode; and a second fluid source that is adapted to deliver a metal ion containing electrolyte to the metallized surface and the electrode, wherein the metal ion is selected from a group consisting of silver, nickel, zinc, or tin. 8. The apparatus of claim 1, further comprising: a third processing chamber positioned distance along the flexible substrate from the position proximate to the electrode, and configured to form at least a portion of the metallized surface on a portion of the flexible substrate, wherein the third processing chamber is configured to form the portion of the metallized surface using a process selected from the group consisting of an electroless deposition process, a physical vapor deposition process, a chemical vapor deposition process and an evaporation process. 9. The apparatus of claim 8, further comprising: a fourth processing chamber disposed a distance along the flexible substrate from the position proximate to the electrode, wherein the fourth processing chamber comprises a heat source that is adapted to deliver energy to a portion of the formed metal layer. 10. The apparatus of claim 1, wherein the first processing chamber further comprises a flexible masking substrate assembly that comprises: a mask support that is adapted to retain a portion of a flexible masking substrate that has a plurality of apertures formed therein; and an actuator that is configured to move the flexible masking substrate relative to the metallized surface of the flexible substrate.
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이 특허에 인용된 특허 (39)
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Kapur Vijay K. (Northridge CA) Choudary Uppala V. (Chatsworth CA) Chu Alan K. P. (Granada Hills CA), Process of forming a compound semiconductive material.
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