|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||428/408; 423/447.1; 165/185|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 11 인용 특허 : 17|
A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source.
What is claimed is: 1. A thermal dissipation and shielding system for an electronic device, comprising: an electronic device comprising an external surface and device components including a first component which comprises a heat source; a thermal solution comprising two major surfaces, the thermal solution positioned such that one of its major surfaces is in operative contact with the first component such that it is interposed between the first component and an external surface of the electronic device, wherein the thermal solution comprises at least on...