초록 ▼

A data storage device enclosure for housing one or more data storage devices is disclosed. The enclosure has housed therein a plurality of modules, at least one of the modules being a power supply module and at least one of the modules being an electronics module. Each module has a first dimension o

A data storage device enclosure for housing one or more data storage devices is disclosed. The enclosure has housed therein a plurality of modules, at least one of the modules being a power supply module and at least one of the modules being an electronics module. Each module has a first dimension of substantially n*w and a second dimension of substantially m*h, where n and m are integers that may be different for each module, wherein w=(the width of the enclosure WE/an integer between 1 and 6 inclusive) and h=(the height of the enclosure HE/an integer), w, h, WE and HE each being measured in the same plane. The first dimension of said electronics module is twice the first dimension of said power supply module.

대표청구항 ▼

The invention claimed is: 1. A data storage device enclosure for housing one or more data storage devices, the enclosure having housed therein a plurality of modules, at least one of the modules being a power supply module and at least one of the modules being an electronics module, wherein each mo

The invention claimed is: 1. A data storage device enclosure for housing one or more data storage devices, the enclosure having housed therein a plurality of modules, at least one of the modules being a power supply module and at least one of the modules being an electronics module, wherein each module has a first dimension of substantially n*w and a second dimension of substantially m*h, where n and m are integers that may be different for each module, wherein w=(the width of the enclosure WE/an integer between 1 and 6 inclusive) and h=(the height of the enclosure HE/ an integer), w, h, WE and HE each being measured in the same plane, wherein the first dimension of said electronics module is twice the first dimension of said power supply module. 2. An enclosure according to claim 1, wherein the power supply module is positioned adjacent the electronics module and is arranged to draw cooling air through the electronics module. 3. An enclosure according to claim 1, the enclosure having a midplane, wherein the at least one power supply module comprises: a box-like housing having opposed first and second end faces and four side faces, the first end face having a connector for connecting to the midplane such that the second end face is accessible externally of the enclosure when positioned in the enclosure; a first air inlet provided in the first end face; a second air inlet provided in a side face; an air outlet provided in the second end face; and, a fan positioned adjacent the air outlet arranged so as to draw in air through the first and second air inlets, through the housing, and to vent the air through the air outlet. 4. An enclosure according to claim 1, wherein the enclosure has a height of 2 U and width of WE and comprises: a first bay and a second bay each having a width of WE/4 and a height of 2 U for receiving respective first and second power supply units, the power supply bays being at either side of the enclosure; and, a first bay and a second bay each having a width of WE/2 and a height of U for receiving respective first and second electronics modules, the electronics module bays being positioned one on top of the other and between the power supply bays. 5. An enclosure according to claim 1, wherein the enclosure has a height of 3 U and width of WE and comprises: a first bay and a second bay each having a width of WE/4 and a height of 2 U for receiving respective first and second power supply units, the power supply bays being at either side of the enclosure; and, a first bay and a second bay each having a width of WE/2 and a height of U for receiving respective first and second electronics modules, the electronics module bays being positioned one on top of the other and between the power supply bays so as to be within an envelope having a width of WE and a height of 2 U. 6. An enclosure according to claim 1, wherein the enclosure has a height of 4 U and width of WE and comprises: a first bank and a second bank of bays, each bank having a height of 2 U and a width of WE positioned one on top of the other, each bank having a first bay and a second bay each having a width of WE/4 and a height of 2 U for receiving respective first and second of said power supply units, the power supply bays being at either side of the enclosure; and, a first bay and a second bay each having a width of WE/2 and a height of U for receiving respective first and second of said electronics modules, the electronics module bays being positioned one on top of the other and between the power supply bays. 7. An enclosure according to claim 4, wherein the first and second power supply bays are arranged such that the position and orientation of the first power supply module is a 180 degrees rotation of the position and orientation of the second power supply module about an axis perpendicular to said plane of measurement. 8. An enclosure according to claim 7, the enclosure having a midplane, wherein the plurality of modules includes at least two power supply modules each comprising: a box-like housing having opposed first and second end faces and four side faces, the first end face having a connector for connecting to the midplane such that the second end face is accessible externally of the enclosure when positioned in the enclosure; a first air inlet provided in the first end face; a second air inlet provided in a side face; an air outlet provided in the second end face; and, a fan positioned adjacent the air outlet arranged so as to draw in air through the first and second air inlets, through the housing, and to vent the air through the air outlet; wherein each power supply module is positioned and orientated so that each of said respective second air inlets faces inwards towards its adjacent electronics module, so that each of said respective fans draws air through its adjacent electronics module bay in use. 9. An enclosure and a plurality of modules according to claim 4, wherein the first and second electronics module bays are arranged such that the position and orientation of the first electronics module is a 180 degrees rotation of the position and orientation of the second electronics module about an axis perpendicular to said plane of measurement. 10. An enclosure according to claim 1, wherein the enclosure has a height of 4 U and width of WE and comprises: a first bay, a second bay, a third bay and a fourth bay each having a width of 2 U and a height of WE/4 for receiving respective first, second, third and fourth power supply units, the power supply bays being adjacent each other so as to be within an envelope having a width of 8 U and a height of WE/4; and, a first bay and a second bay each having a width WE/2 and a height of U for receiving respective first and second electronics modules, the electronics module bays being positioned adjacent each other so as to be within an envelope having a width of WE and a height of U. 11. An enclosure according to claim 1, wherein the enclosure has a plurality of adjacent bays having the same width and height that are capable of receiving a corresponding number of individual modules or a single module having a correspondingly greater value of n or m. 12. An enclosure according to claim 1, comprising at least one cooling module, wherein the enclosure can accept the cooling module in place of at least one power supply module. 13. An enclosure according to claim 1, wherein w is between about 102.5 mm and about 109.5 mm. 14. An enclosure according to claim 1, wherein h is between about 36 mm and about 42 mm. 15. A data storage device enclosure for housing one or more data storage devices, the enclosure having housed therein a plurality of modules, at least one of the modules being a power supply module and at least one of the modules being an electronics module, wherein each module has a first dimension of substantially n*w and a second dimension of substantially m*h, where n and m are integers that may be different for each module, wherein w=(the width of the enclosure WE/an integer between 1 and 6 inclusive) and h=(the height of the enclosure HE/an integer), w, h, WE and HE each being measured in the same plane, wherein the power supply module is positioned adjacent the electronics module and is arranged to draw cooling air through the electronics module. 16. An enclosure according to claim 15, wherein the first dimension of said electronics module is twice the first dimension of said power supply module. 17. An enclosure according to claim 15, the enclosure having a midplane, wherein the at least one power supply module comprises: a box-like housing having opposed first and second end faces and four side faces, the first end face having a connector for connecting to the midplane such that the second end face is accessible externally of the enclosure when positioned in the enclosure; a first air inlet provided in the first end face; a second air inlet provided in a side face; an air outlet provided in the second end face; and, a fan positioned adjacent the air outlet arranged so as to draw in air through the first and second air inlets, through the housing, and to vent the air through the air outlet. 18. An enclosure according to claim 15, wherein the enclosure has a height of 2 U and width of WE and comprises: a first bay and a second bay each having a width of WE/4 and a height of 2 U for receiving respective first and second power supply units, the power supply bays being at either side of the enclosure; and, a first bay and a second bay each having a width of WE/2 and a height of U for receiving respective first and second electronics modules, the electronics module bays being positioned one on top of the other and between the power supply bays. 19. An enclosure according to claim 15, wherein the enclosure has a height of 3 U and width of WE and comprises: a first bay and a second bay each having a width of WE/4 and a height of 2 U for receiving respective first and second power supply units, the power supply bays being at either side of the enclosure; and, a first bay and a second bay each having a width of WE/2 and a height of U for receiving respective first and second electronics modules, the electronics module bays being positioned one on top of the other and between the power supply bays so as to be within an envelope having a width of WE and a height of 2 U. 20. An enclosure according to claim 15, wherein the enclosure has a height of 4U and width of WE and comprises: a first bank and a second bank of bays, each bank having a height of 2 U and a width of WE positioned one on top of the other, each bank having a first bay and a second bay each having a width of WE/4 and a height of 2 U for receiving respective first and second of said power supply units, the power supply bays being at either side of the enclosure; and, a first bay and a second bay each having a width of WE/2 and a height of U for receiving respective first and second of said electronics modules, the electronics module bays being positioned one on top of the other and between the power supply bays. 21. An enclosure according to claim 18, wherein the first and second power supply bays are arranged such that the position and orientation of the first power supply module is a 180 degrees rotation of the position and orientation of the second power supply module about an axis perpendicular to said plane of measurement. 22. An enclosure according to claim 21, the enclosure having a midplane, wherein the plurality of modules includes at least two power supply modules each comprising: a box-like housing having opposed first and second end faces and four side faces, the first end face having a connector for connecting to the midplane such that the second end face is accessible externally of the enclosure when positioned in the enclosure; a first air inlet provided in the first end face; a second air inlet provided in a side face; an air outlet provided in the second end face; and, a fan positioned adjacent the air outlet arranged so as to draw in air through the first and second air inlets, through the housing, and to vent the air through the air outlet; wherein each power supply module is positioned and orientated so that each of said respective second air inlets faces inwards towards its adjacent electronics module, so that each of said respective fans draws air through its adjacent electronics module bay in use. 23. An enclosure and a plurality of modules according to claim 18, wherein the first and second electronics module bays are arranged such that the position and orientation of the first electronics module is a 180 degrees rotation of the position and orientation of the second electronics module about an axis perpendicular to said plane of measurement. 24. An enclosure according to claim 15, wherein the enclosure has a height of 4 U and width of WE and comprises: a first bay, a second bay, a third bay and a fourth bay each having a width of 2 U and a height of WE/4 for receiving respective first, second, third and fourth power supply units, the power supply bays being adjacent each other so as to be within an envelope having a width of 8 U and a height of WE/4; and, a first bay and a second bay each having a width WE/2 and a height of U for receiving respective first and second electronics modules, the electronics module bays being positioned adjacent each other so as to be within an envelope having a width of WE and a height of U. 25. An enclosure according to claim 15, wherein the enclosure has a plurality of adjacent bays having the same width and height that are capable of receiving a corresponding number of individual modules or a single module having a correspondingly greater value of n or m. 26. An enclosure according to claim 15, comprising at least one cooling module, wherein the enclosure can accept the cooling module in place of at least one power supply module. 27. An enclosure according to claim 15, wherein w is between about 102.5 mm and about 109.5 mm. 28. An enclosure according to claim 15, wherein h is between about 36 mm and about 42 mm. 29. A midplane for a data storage device enclosure, the midplane comprising: a circuit board having a front surface and a rear surface; a plurality of connectors on the front surface for connecting to respective data storage devices; a first power supply module connector and a first electronics module connector on the rear surface, the first power supply module connector and the first electronics module connector being generally elongate and having their long axes aligned in the direction of the width of the midplane; and, a second power supply module connector and a second electronics module connector on the rear surface, the second power supply module connector and the second electronics module connector being generally elongate and having their long axes aligned in the direction of the width of the midplane; the position and orientation of the second power supply module connector being a 180 degree rotation of the position and orientation of the first power supply module connector about an axis perpendicular to the plane of the circuit board; and, the position and orientation of the second electronics module connector being a 180 degree rotation of the position and orientation of the first electronics module connector about an axis perpendicular to the plane of the circuit board; wherein said connectors on the rear surface do not overlap with any of the connectors on the front surface. 30. In combination, a midplane according to claim 29 and a first electronics module and a second electronics module connected to the first electronics module connector and the second electronics module connector respectively, the first electronics module having a circuit board and the second electronics module having a circuit board, wherein the circuit boards of the first and second electronics modules are separated in order to create a plenum for cooling air between them. 31. In combination, a midplane according to claim 29 and a first electronics module and a second electronics module connected to the first electronics module connector and the second electronics module connector respectively and a first power supply module and a second power supply module connected to the first power supply connector and the second power supply connector respectively, wherein each power supply is arranged to draw cooling air therethrough via a respective air inlet in its housing, the respective air inlets each being orientated towards the electronics modules. 32. A method of manufacturing a midplane for a data storage device enclosure, the midplane comprising: a circuit board having a front surface and a rear surface; a plurality of connectors on the front surface for connecting to respective data storage devices; a first power supply module connector and a first electronics module connector on the rear surface, the first power supply module connector and the first electronics module connector being generally elongate and having their long axes aligned in the direction of the width of the midplane; and, a second power supply module connector and a second electronics module connector on the rear surface, the second power supply module connector and the second electronics module connector being generally elongate and having their long axes aligned in the direction of the width of the midplane; the position and orientation of the second power supply module connector being a 180 degree rotation of the position and orientation of the first power supply module connector about an axis perpendicular to the plane of the circuit board; and, the position and orientation of the second electronics module connector being a 180 degree rotation of the position and orientation of the first electronics module connector about an axis perpendicular to the plane of the circuit board; wherein said connectors on the rear surface do not overlap with any of the connectors on the front surface, the method comprising manufacturing the circuit board as a non-laminated piece. 33. A plurality of modules for being housed in a data storage device enclosure, at least one of the modules being a power supply module and at least one of the modules being an electronics module, wherein each module has a width of substantially n*w and a height of substantially m*h, where n and m are integers that may be different for each module, wherein w is between about 102.5 mm and about 109.5 mm and h is between about 36 mm and about 42 mm. 34. A plurality of data storage device enclosures, each enclosure comprising: at least one power supply bay for accepting a power supply module, each power supply bay of each enclosure having a first dimension of substantially n*w and a second dimension of substantially m*h, where n and m are integers, which may be different for the different power supply bays and for the different enclosures, such that power supply modules are interchangeable between said enclosures; and, at least one electronics module bay for accepting an electronics module, each electronics module bay of each enclosure having a first dimension of substantially n*w and a second dimension of substantially in m*h, where n and m are integers, which may be different for the different electronics module bays and for the different enclosures, such that electronics modules are interchangeable between said enclosures, wherein w is between about 104.5 mm and about 110.5 mm and h is between about 38 mm and about 43 mm, wherein at least one of the number of bays or layout of bays is different for each enclosure. 35. A plurality of enclosures according to claim 34, wherein at least one enclosure has a height of 2 U and a width of WE and comprises: a first bay and a second bay each having a width of WE/4 and a height of 2 U for receiving respective first and second power supply units, the power supply bays being at either side of the enclosure; and, a first bay and a second bay each having a width of WE/2 and a height of U for receiving respective first and second electronics modules, the electronics module bays being positioned one on top of the other and between the power supply bays. 36. A plurality of enclosures according to claim 34, wherein at least one enclosure has a height of 3 U and width of WE and comprises: a first bay and a second bay each having a width of WE/4 and a height of 2 U for receiving respective first and second power supply units, the power supply bays being at either side of the enclosure; and, a first bay and a second bay each having a width of WE/2 and a height of U for receiving respective first and second electronics modules, the electronics module bays being positioned one on top of the other and between the power supply bays so as to be within an envelope having a width of WE and a height of 2 U. 37. A plurality of enclosures according claim 34, wherein at least one enclosure has a height of 4 U and width WE and comprises a first bank and a second bank of bays, each bank having a height of 2 U and a width of WE positioned one on top of the other, each bank having: a first bay and a second bay each having a width of W/4 and a height of 2 U for receiving respective first and second power supply units, the power supply bays being at either side of the enclosure; and, a first bay and a second bay each having a width of WE/2 and a height of U for receiving respective first and second electronics modules, the electronics module bays being positioned one on top of the other and between the power supply bays. 38. A plurality of enclosures according to claim 34, wherein at least one enclosure has a height of 4 U and width WE and comprises: a first bay, a second bay, a third bay and a fourth bay each having a width of 2 U and a height of WE/4 for receiving respective first, second, third and fourth power supply units, the power supply bays being adjacent each other so as to be within an envelope having a width of 8 U and a height of WE/4; and, a first bay and a second bay each having a width WE/2 and a height of U for receiving respective first and second electronics modules, the electronics module bays being positioned adjacent each other so as to be within an envelope having a width of WE and a height of U.