IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0491361
(2006-07-21)
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등록번호 |
US-7803450
(2010-10-21)
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발명자
/ 주소 |
- Gregg, Joseph V.
- Kohler, Wesley Allen
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출원인 / 주소 |
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
0 인용 특허 :
41 |
초록
▼
UHMWPE panels of large width may be prepared by a continuous ram extrusion process by employing a slit die which preferably narrows from both sides in a direction transverse to the machine direction, and/or which employs a plurality of transversely positioned cooling zones located on the top and the
UHMWPE panels of large width may be prepared by a continuous ram extrusion process by employing a slit die which preferably narrows from both sides in a direction transverse to the machine direction, and/or which employs a plurality of transversely positioned cooling zones located on the top and the bottom of the die, proximate the exit thereof. The panel exits the die at a temperature lower than the crystalline melt temperature.
대표청구항
▼
What is claimed is: 1. A ram extruded UHMWPE panel having a width of 0.6 m or greater, a thickness variation of less than 1.27 mm (3σ), and smooth, glossy top and bottom surfaces, both top and bottom surfaces having a plurality of substantially parallel, visually observable shot marks with an
What is claimed is: 1. A ram extruded UHMWPE panel having a width of 0.6 m or greater, a thickness variation of less than 1.27 mm (3σ), and smooth, glossy top and bottom surfaces, both top and bottom surfaces having a plurality of substantially parallel, visually observable shot marks with an average height of about 70 μm or less. 2. The panel of claim 1, having no sawn edges. 3. The panel of claim 1, wherein said thickness variation is 0.8 mm or less. 4. The panel of claim 1, wherein the average height of the shot marks is less than 25 μm. 5. The panel of claim 3, wherein the maximum average height of the shot marks is less than 25 μm. 6. The panel of claim 1, wherein an average thickness of the panel is between 4 mm and 2 cm. 7. The panel of claim 1, which has a width of from 1.0 m to 3.0 m. 8. The panel of claim 1, which has an average 60° specular gloss of 35 or greater when measured in accordance with ASTM D2457. 9. The panel of claim 1, produced by a ram extrusion process, comprising: providing a slit die which has a substantially rectangular cross-section under ram extrusion operating pressure, the die having a top portion and a bottom portion and an inlet face and an exit face, and having at least three independently controllable cooling zones in each of the top portion and bottom portion, said cooling zones located proximate the exit face of the die, and positioned across the width of the die; incrementally introducing UHMWPE resin particles into the die under pressure from a ram; heating the UHMWPE particles to a temperature above the crystalline melt temperature of UHMWPE to form a substantially continuous molten thermoplastic; cooling the UHMWPE to a temperature below the crystalline melt temperature while within the die and while maintaining contact with the walls of the die; and obtaining a solidified UHMWPE panel product which has exited the die. 10. The panel of claim 9, wherein the panel is cooled to a temperature in the range of 40° C. to 100° C. prior to exiting the die. 11. The panel of claim 9, wherein said die, when not under ram extrusion pressure, has a cross-section wherein the height of the slit at positions transverse to the machine direction, exceed 0.030 above or below the average height of the slit. 12. The panel of claim 1, said panel having a thickness variation of 0.76 mm or less (3σ), a 60° specular gloss measured by ASTM D-2457 of 35 or more, and shot marks having an average height of less than 25 μm. 13. The panel of claim 12, which has a width of 1.0 m to 3.0 m, and an average thickness of 4 mm to 7 cm. 14. The panel of claim 12, which has a width of 1.0 m to 3.0 m, and an average thickness of 4 mm to 4 cm. 15. The panel of claim 14, wherein a central flat portion of the panel comprises 90% or more of the area of the panel. 16. The panel of claim 1, wherein said ram extrusion causes said panel to be characterized by the presence of shot marks having an average height of from 10-15 μm, a 60° specular gloss of 35 or more when measured by ASTM D-2457, a thickness variation of 0.76 mm total, a global flatness of less than 2.5 mm±0.6 mm (3σ), and a width greater than 1 m. 17. The panel of claim 9, wherein said ram extrusion causes said panel to be characterized by the presence of shot marks having an average height of from 10-15 μm, a 60° specular gloss of 35 or more when measured by ASTM D-2457, a thickness variation of 0.76 mm total, a global flatness of less than 2.5 mm±0.6 mm (3σ), and a width greater than 1 m. 18. The panel of claim 9, wherein the temperature of the panel upon exit from the die is below 121° C. 19. The panel of claim 9, wherein the temperature of the panel upon exit from the die is below 110° C. 20. The panel of claim 9, wherein the temperature of the panel upon exit from the die is between 40° C. and 100° C. 21. The panel of claim 1, which has a specular gloss as measured by ASTM D2457-03 of 35 or greater. 22. The panel of claim 1, wherein the shot marks have an average height of from 10 μm to less than 25 μm. 23. The panel of claim 1, wherein the shot marks have an average height of from 5 μm to 10 μm.
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