초록 ▼

A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position

A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.

대표청구항 ▼

We claim: 1. An assembly for testing electronic devices comprising: a probe substrate having test probes; a wiring substrate secured to the probe substrate; an interposer disposed between the probe substrate and the wiring substrate and comprising resilient springs extending from opposing sides and

We claim: 1. An assembly for testing electronic devices comprising: a probe substrate having test probes; a wiring substrate secured to the probe substrate; an interposer disposed between the probe substrate and the wiring substrate and comprising resilient springs extending from opposing sides and configured to electrically connect first terminals on the wiring substrate and second terminals on the probe substrate; and biasing means for biasing in a direction that is generally parallel with planes in which the first terminals and the second terminals are disposed the interposer against a plurality of constraints, wherein while the interposer is biased against the constraints by the biasing means, the resilient springs of the interposer align with the first terminals on the wiring substrate and the second terminals on the probe substrate. 2. The assembly of claim 1, wherein: the interposer comprises docking features; and the biasing means biases the docking features of the interposer against the constraints. 3. The assembly of claim 1, wherein the biasing means comprises a spring. 4. The assembly of claim 1, wherein the biasing means comprises the resilient springs, the resilient springs being configured to apply a lateral force to the interposer upon application of a second force approximately perpendicular to the lateral force compressing the resilient springs. 5. The assembly of claim 1, wherein the probes are configured to contact electronic devices to be tested, and the wiring substrate comprises an electrical interface to a plurality of channels to a tester configured to control testing of the electronic devices. 6. A self-aligning removable probe head assembly for testing electronic devices comprising: a probe substrate having test probes and terminals disposed generally in a first plane and electrically connected to the test probes; an interposer substantially constrained in a second plane that is generally parallel to the first plane by at least three constraints; and a biasing mechanism configured to apply a force to the interposer in the second plane that urges the interposer toward at least one of the constraints thereby moving the interposer from an unaligned position in which contact structures extending from the interposer are out of alignment with the terminals of the probe substrate to an aligned position in which the contact structures extending from the interposer are in alignment with the terminals of the probe substrate. 7. The probe head assembly of claim 6, wherein the interposer comprises docking features configured to contact the at least three constraints. 8. The probe head assembly of claim 6, wherein the probe substrate and the interposer are electrically connected by the contact structures extending from the interposer, the contact structures comprising resilient contact springs. 9. The probe head assembly of claim 8, wherein the biasing mechanism comprises ones of the contact springs, which are configured to impart the force upon compression of the contact springs. 10. The probe head assembly of claim 9, wherein attachment mechanisms by which the probe head assembly is attached to a wiring substrate comprise the constraints. 11. The assembly of claim 1, wherein the constraints are stationary with respect to the interposer in response to the biasing by the biasing means. 12. The assembly of claim 1, wherein the biasing by the biasing means does not move the constraints. 13. The assembly of claim 1, wherein the biasing means passively biases the interposer against a plurality of constraints. 14. The assembly of claim 1, wherein the constraints constrain the interposer at three and only three constraint locations. 15. The assembly of claim 1, wherein: there are three and only three constraints, a first of the three constraints constrains the interposer along a first degree of translation in an interposer plane that is generally parallel with the planes in which the first terminals and the second terminals are disposed, a second of the three constraints constrains the interposer along a second degree of translation in the interposer plane, the second degree of translation being different than the first degree of translation, and a third of the three constraints constrains the interposer in a degree of rotation in the interposer plane. 16. The probe head assembly of claim 6, wherein the constraints are stationary with respect to the interposer in response to the biasing by the biasing mechanism. 17. The probe head assembly of claim 6, wherein the force applied by the biasing mechanism does not move the constraints. 18. The probe head assembly of claim 6, wherein the biasing mechanism is configured to passively apply the force to the interposer. 19. The probe head assembly of claim 6, wherein the constraints constrain the interposer at three and only three constraint locations. 20. The probe head assembly of claim 6, wherein: there are three and only three constraints, a first of the three constraints constrains the interposer along a first degree of translation in the second plane, a second of the three constraints constrains the interposer along a second degree of translation in the second plane, the second degree of translation being different than the first degree of translation, and a third of the three constraints constrains the interposer in a degree of rotation in the second plane.