A pattern inspection apparatus is used for inspecting a pattern, such as semiconductor integrated circuit (LSI), liquid crystal panel, and a photomask by using an image of the pattern to-be-inspected and design data for fabricating the pattern to-be-inspected. The pattern inspection apparatus includ
A pattern inspection apparatus is used for inspecting a pattern, such as semiconductor integrated circuit (LSI), liquid crystal panel, and a photomask by using an image of the pattern to-be-inspected and design data for fabricating the pattern to-be-inspected. The pattern inspection apparatus includes a reference pattern generation device for generating a reference pattern represented by one or more lines from design data, an image generation device for generating the image of the pattern to-be-inspected, a detecting device for detecting an edge of the image of the pattern to-be-inspected, and an inspection device for inspecting the pattern to-be-inspected by comparing the edge of the image of the pattern to-be-inspected with the one or more lines of the reference pattern.
대표청구항▼
What is claimed is: 1. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate sai
What is claimed is: 1. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from said data; (b) storing in said memory detected edges of said image; (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information; and (d) recognizing repeated defects from said defect information of corresponding inspection areas of each of a plurality of semiconductor devices fabricated using said data. 2. The pattern inspection apparatus according to claim 1, wherein said defect information is generated from the entire inspection area in a first of said semiconductor devices, and from at least a part of the inspection area of another of said semiconductor device corresponding to a location and neighborhood of at least one defect identified within said defect information generated for said first semiconductor device. 3. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from at least one of (a) geometrical information of line segments of said data, and (b) relationships between line segments, of said data, that connect or are located closely together, and Boolean operations performed on a first polygon in a layer to-be-inspected of said data and a second polygon in a layer related to said layer; (b) storing in said memory detected edges of said image; and (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information. 4. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from at least one of (a) geometrical information of line segments of said data, and (b) relationships between line segments, of said data, that connect or are located closely together; (b) storing, in said memory, detected edges of said image; and (c) inspecting said pattern to-be-inspected by comparing said detected edge with at least one of said line segment and said curve of said reference pattern to generate defect information, said inspecting identifying an edge in a direction that differs from a direction of said detected edge to determine whether a defect of the defect information is an open or bridge defect. 5. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from said data; (b) storing, in said memory, detected edges of said image; and (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information, said inspecting determining an inspection parameter based upon a result of Boolean operations on (a) a polygon in said data with respect to a process at the time of said inspection and (b) a polygon in said data with respect to a process related to said process at the time of said inspection. 6. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from said data and a correction pattern added to said data; (b) storing, in said memory, detected edges of said image; (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information; and (d) determining a correspondence between said correction pattern and said pattern to-be-inspected to identify patterns that should not be formed. 7. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from said data; (b) storing, in said memory, detected edges of said image; (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information; and (d) determining deformation quantities that are separated into global pattern deformation quantities and local pattern deformation quantities. 8. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from said data; (b) storing, in said memory, detected edges of said image; (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information; and (d) determining a divided inspection area to be inspected; wherein said divided inspection area is inspected to obtain a first inspection result at a first time, and said divided inspection area is inspected to obtain a second inspection result during inspection at a later time, and then a time-dependence variation of said image generation device is corrected by using said first inspection result and said second inspection result. 9. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from said data; (b) storing, in said memory, detected edges of said image; (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information; and (d) determining defect-classes of said defect information based upon one of (a) geometrical information of said reference pattern, (b) information of said data, and (c) information of data related to said data. 10. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from said data; (b) storing, in said memory, detected edges of said image; (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information; and (d) registering said image identified as defective by said inspecting, wherein the maximum number of defect images to be registered for each of a plurality of determined defect-classes is determined, and said image is registered if the number of registered defect images is less than the maximum number of defect images to be registered for a determined defect-class of said image, and wherein whether said image should be registered is determined if the number of the registered defect images is equal to the maximum number of defect images to be registered for said determined defect-class of said image. 11. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from said data; (b) storing, in said memory, detected edges of said image; (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information; and (d) registering said image identified as defect by said inspecting, wherein the maximum number of defects to-be-reinspected for each of a plurality of determined defect-classes is determined, and defects to-be-reinspected are selected using said maximum number of defects to-be-reinspected. 12. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from said data; (b) storing, in said memory, detected edges of said image; and (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information; wherein defects detected by said inspecting are grouped according to a feature of said reference pattern corresponding to said defect and its neighborhood. 13. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from said data; (b) storing, in said memory, detected edges of said image; and (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information; wherein a line segment that requires signal intensity correction is extracted from said reference pattern, and, at least one of (a) a position of said line segment and (b) an allowable deformation quantity of said line segment, is corrected based on a quantity of said signal intensity correction; wherein said line segments that require signal intensity correction are two line segments that face each other closest together with a distance between said two line segments being shorter than a first predetermined distance or being longer than a second predetermined distance. 14. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from said data; (b) storing, in said memory, detected edges of said image; and (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information; wherein one of said reference patterns, located at a boundary of periodical patterns, is recognized as a unique pattern, and is shifted by one period, said shifted unique pattern, in the case where there is no reference pattern in the neighborhood of said shifted unique pattern, is recognized as a negative pattern, and matching is performed by said inspecting based upon at least one of (a) said unique pattern and (b) said negative pattern. 15. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from said data; (b) storing, in said memory, detected edges of said image; and (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information; wherein said detected edge is matched with said line segment or said curve of said reference pattern by comparing a statistic calculated from part of said image of said pattern to-be-inspected corresponding to the inside of said reference pattern and a statistic calculated from part of said image of said pattern to-be-inspected corresponding to the outside of said reference pattern. 16. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from said data; (b) storing, in said memory, detected edges of said image; and (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information; wherein inspection parameters of said inspecting are selected according to part of said pattern to-be-inspected which is affected by the preceding process and part of said pattern to-be-inspected which is not affected by the preceding process. 17. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from said data; (b) storing, in said memory, detected edges of said image; (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information; and (d) outputting a result of said inspection of said pattern to-be-inspected; wherein as said result of said inspection, information of said data is attached, and correspondence of one of said data, said data to which correction patterns are added, patterns obtained from simulation using said data, another information related to said data, and said result of said inspection is established by using said information of said data. 18. A method of inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection method comprising: generating, within a pattern inspection apparatus, a reference pattern, from said data, represented by one or both of (a) one or more line segments, and (b) one or more curves; generating, under control of said pattern inspection apparatus, said image of said pattern to-be-inspected; detecting, within said pattern inspection apparatus, an edge of said image of said pattern to-be-inspected; inspecting, within said pattern inspection apparatus, said pattern to-be-inspected by comparing said detected edge of said image with said line segment or said curve of said reference pattern; and coating carbon on said pattern to-be-inspected prior to said step of scanning; wherein said step of generating said image comprises scanning a charged particle beam on said carbon-coated pattern to-be-inspected to generate said image of said pattern to-be-inspected. 19. The method according to claim 18, wherein the thickness of carbon film on said pattern to-be-inspected is in the range of 5 nm to 20 nm. 20. A method of inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection method comprising: generating, within a pattern inspection apparatus, a reference pattern, from said data, represented by one or both of (a) one or more line segments, and (b) one or more curves; generating, under control of said pattern inspection apparatus, said image of said pattern to-be-inspected; detecting, within said pattern inspection apparatus, an edge of said image of said pattern to-be-inspected; and inspecting, within said pattern inspection apparatus, said pattern to-be-inspected by comparing said detected edge of said image with said line segment or said curve of said reference pattern; wherein said step of generating said image comprising scanning a charged particle beam on a wider area than an area at a time to be acquired of a specimen containing said pattern to-be-inspected to generate said image of said pattern to-be-inspected, said method further comprising the steps of: obtaining inspection results from a plurality of semiconductor devices fabricated based on said same data; and obtaining a merged inspection result by merging said inspection results. 21. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; a reference pattern generation unit, realized by a program, for generating, from said data, a reference pattern represented by one or both of (i) one or more line segments, and (ii) one or more curves; and an inspection unit, realized by at least one program, for (i) detecting an edge of said image, and (ii) inspecting said pattern to-be-inspected by comparing said detected edge with at least one of said line segment and said curve of said reference pattern to generate defect information; wherein said image generation device sets a scanning condition for a charged particle beam by using said reference pattern, and said image generation device scans said pattern to-be-inspected with said charged particle beam to generate said image of said pattern to-be-inspected; wherein said image generation device sets a scanning direction, which is one of said scanning conditions, for said charged particle beam based upon said reference pattern; wherein said image generation device sets said scanning direction for said charged particle beam, such that said scanning direction becomes substantially perpendicular to-lines of said pattern to-be-inspected; wherein said scanning direction is in the horizontal direction in a region where vertical lines of said pattern to-be-inspected exist, said scanning direction is in the vertical direction in a region where horizontal lines of said pattern to-be-inspected exist, and said scanning direction is in one of 45 degree direction, −45 degree direction, −135 degree direction, which is the opposite direction of said 45 degree direction, and 135 degree direction, which is the opposite direction of said −45 degree direction, in a region where horizontal and vertical lines of said pattern to-be-inspected exist. 22. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; a reference pattern generation unit, realized by a program, for generating, from said data, a reference pattern represented by one or both of (i) one or more line segments, and (ii) one or more curves; and an inspection unit, realized by at least one program, for (i) detecting an edge of said image, and (ii) inspecting said pattern to-be-inspected by comparing said detected edge with at least one of said line segment and said curve of said reference pattern to generate defect information; wherein said image generation device sets a scanning condition for a charged particle beam by using said reference pattern, and said image generation device scans said pattern to-be-inspected with said charged particle beam to generate said image of said pattern to-be-inspected; wherein said image generation device sets a scanning direction, which is one of said scanning conditions, for said charged particle beam based upon said reference pattern; wherein said image generation device sets said scanning direction for said charged particle beam, such that said scanning direction becomes substantially perpendicular to-lines of said pattern to-be-inspected; wherein said image generation device scans said pattern to-be-inspected with said charged particle beam to generate a plurality of said images of said pattern to-be-inspected by setting a plurality of said scanning directions, and said inspection unit detects said edge of said image of said pattern to-be-inspected from one of said plurality of said images of said pattern to-be-inspected which has been generated in one of said plurality of said scanning directions which becomes more perpendicular to said edge of said image of said pattern to-be-inspected. 23. The pattern inspection apparatus according to claim 22, wherein said image generation device scans said pattern to-be-inspected with said charged particle beam to generate two images of said pattern to-be-inspected by setting the horizontal scanning direction and the vertical scanning direction, and said inspection unit detects said edge of said image of said pattern to-be-inspected, which corresponds to a horizontal line of said reference pattern, from said image of said pattern to-be-inspected, which has been generated in the vertical scanning direction, and said inspection unit detects said edge of said image of said pattern to-be-inspected, which corresponds to a vertical line of said reference pattern from said image of said pattern to-be-inspected, which has been generated in the horizontal scanning direction. 24. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; and a memory storing a plurality of machine readable instructions that when executed perform the steps of: (a) storing in said memory a reference pattern representing one or both of (i) one or more line segments, and (ii) one or more curves, said reference pattern generated from said data; (b) storing, in said memory, detected edges of said image; and (c) inspecting said pattern to-be-inspected by comparing said detected edge to at least one of said line segment and said curve of said reference pattern to generate defect information; wherein a rotated image is generated by replacing positions of pixels of said image of said pattern to-be-inspected. 25. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; a reference pattern generation unit, realized by a program, for generating, from said data, a reference pattern represented by one or both of (i) one or more line segments, and (ii) one or more curves; and an inspection unit, realized by at least one program, for (i) detecting an edge of said image, and (ii) inspecting said pattern to-be-inspected by comparing said detected edge with at least one of said line segment and said curve of said reference pattern to generate defect information; wherein said image generation device scans an area of said pattern to-be-inspected with a charged particle beam by imparting a vertical amplitude to a scanning direction for said charged particle beam to generate said image of said pattern to-be-inspected. 26. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; a reference pattern generation unit, realized by a program, for generating, from said data, a reference pattern represented by one or both of (i) one or more line segments, and (ii) one or more curves; and an inspection unit, realized by at least one program, for (i) detecting an edge of said image, and (ii) inspecting said pattern to-be-inspected by comparing said detected edge with at least one of said line segment and said curve of said reference pattern to generate defect information; wherein said image generation device scans a part, which is used for detecting said edges of said image of said pattern to-be-inspected, with said charged particle beam to generate said image of said pattern to-be-inspected, and said image generation device does not scan the remainder of said part, which is used for detecting said edges of said image of said pattern to-be-inspected. 27. The pattern inspection apparatus according to claim 26, wherein said image generation device does not scan the remainder part of said part, which is used for detecting said edges of said image of said pattern to-be-inspected, so that a deformation of said image of said pattern to-be-inspected due to the electrification phenomenon of a specimen, on which said pattern to-be-inspected exists, is reduced. 28. A pattern inspection apparatus for inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection apparatus comprising: an image generation device configured to generate said image of said pattern to-be-inspected; a reference pattern generation unit, realized by a program, for generating, from said data, a reference pattern represented by one or both of (i) one or more line segments, and (ii) one or more curves; and an inspection unit, realized by at least one program, for (i) detecting an edge of said image, and (ii) inspecting said pattern to-be-inspected by comparing said detected edge with at least one of said line segment and said curve of said reference pattern to generate defect information; wherein said image generation device scans an area of said pattern to-be-inspected to generate a hexagonal image of said pattern to-be-inspected, and scans an area, which is adjacent to said area of said pattern to-be-inspected, to generate a next hexagonal image repeatedly, such that successive images of said pattern to-be-inspected are generated. 29. A method of inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection method comprising: generating, within a pattern inspection apparatus, a reference pattern, from said data, represented by one or both of (a) one or more line segments, and (b) one or more curves; generating, under control of said pattern inspection apparatus, said image of said pattern to-be-inspected; detecting, within said pattern inspection apparatus, an edge of said image of said pattern to-be-inspected; inspecting, within said pattern inspection apparatus, said pattern to-be-inspected by comparing said detected edge of said image with said line segment or said curve of said reference pattern; and recognizing repeated defects from defect information obtained from the same inspection area with respect to a plurality of semiconductor devices fabricated based on the same data. 30. A method of inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection method comprising: generating, within a pattern inspection apparatus, a reference pattern, from said data, represented by one or both of (a) one or more line segments, and (b) one or more curves; generating, under control of said pattern inspection apparatus, said image of said pattern to-be-inspected; detecting, within said pattern inspection apparatus, an edge of said image of said pattern to-be-inspected; inspecting, within said pattern inspection apparatus, said pattern to-be-inspected by comparing said detected edge of said image with said line segment or said curve of said reference pattern; and determining defect-classes based on defect information obtained using at least one of geometrical information of said reference pattern, information of said data, and information of data related to said data. 31. A method of inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection method comprising: generating, within a pattern inspection apparatus, a reference pattern, from said data, represented by one or both of (a) one or more line segments, and (b) one or more curves; generating, under control of said pattern inspection apparatus, said image of said pattern to-be-inspected; detecting, within said pattern inspection apparatus, an edge of said image of said pattern to-be-inspected; and inspecting, within said pattern inspection apparatus, said pattern to-be-inspected by comparing said detected edge of said image with said line segment or said curve of said reference pattern; wherein defects detected by said inspecting are grouped based on a feature of said reference pattern corresponding to said defect and its neighborhood. 32. A method of inspecting a pattern to-be-inspected by using an image of said pattern to-be-inspected and data for fabricating said pattern to-be-inspected, said pattern inspection method comprising: generating, within a pattern inspection apparatus, a reference pattern, from said data, represented by one or both of (a) one or more line segments, and (b) one or more curves; generating, under control of said pattern inspection apparatus, said image of said pattern to-be-inspected; detecting, within said pattern inspection apparatus, an edge of said image of said pattern to-be-inspected; inspecting, within said pattern inspection apparatus, said pattern to-be-inspected by comparing said detected edge of said image with said line segment or said curve of said reference pattern; and outputting a result of said inspection of said pattern to-be-inspected; wherein as said result of said inspection, information of said data is attached, and correspondence between one of said data, said data to which correction patterns are added, patterns obtained from simulation using said data, another information related to said data, and said result of said inspection is established by using said information of said data.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (35)
Fan Zhigang (Webster NY), Anti-counterfeit pattern detector and method.
Koshishiba Hiroya (Yokohama JPX) Fushimi Satoru (Yokohama JPX) Nakagawa Yasuo (Chigasaki JPX) Nakahata Kozo (Chigasaki JPX), Apparatus and method of pattern detection based on a scanning transmission electron microscope.
Duvdevani,Sharon; Gilat Bernshtein,Tally; Klingbell,Eyal; Mayo,Meir; Rippa,Shmuel; Smilansky,Zeev, Apparatus and methods for the inspection of objects.
Duvdevani,Sharon; Gilat Bernshtein,Tally; Klingbell,Eyal; Mayo,Meir; Rippa,Shmuel; Smilansky,Zeev, Apparatus and methods for the inspection of objects.
Duvdevani,Sharon; Gilat Bernshtein,Tally; Klingbell,Eyal; Mayo,Meir; Rippa,Shmuel; Smilansky,Zeev, Apparatus and methods for the inspection of objects.
Emery David G. (San Jose CA) Saidin Zain K. (Sunnyvale CA) Wihl Mark J. (Tracy CA) Fu Tao-Yi (Fremont CA) Zywno Marek (San Jose CA) Kvamme Damon F. (Ann Arbor MI) Fein Michael E. (Mountain View CA), Automated photomask inspection apparatus and method.
Specht Donald F. (Los Altos CA) Wihl Tim S. (San Jose CA) Young Scott A. (Scotts Valley CA) Hager ; Jr. James J. (San Jose CA) Lutzker Matthew B. (Menlo Park CA), Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-sys.
Hisashi Shiba JP, Automatic visual inspection apparatus automatic visual inspection method and recording medium having recorded an automatic visual inspection program.
Takagi Yuji,JPX ; Doi Hideaki,JPX ; Ono Makoto,JPX, Method and system for manufacturing semiconductor devices, and method and system for inspecting semiconductor devices.
Takagi, Yuji; Doi, Hideaki; Ono, Makoto, Method and system for manufacturing semiconductor devices, and method and system for inspecting semiconductor devices.
Knippelmeyer, Rainer; Kienzle, Oliver; Kemen, Thomas; Mueller, Heiko; Uhlemann, Stephan; Haider, Maximilian; Casares, Antonio; Rogers, Steven, Particle-optical systems and arrangements and particle-optical components for such systems and arrangements.
Knippelmeyer, Rainer; Kienzle, Oliver; Kemen, Thomas; Mueller, Heiko; Uhlemann, Stephan; Haider, Maximilian; Casares, Antonio; Rogers, Steven, Particle-optical systems and arrangements and particle-optical components for such systems and arrangements.
Knippelmeyer, Rainer; Kienzle, Oliver; Kemen, Thomas; Mueller, Heiko; Uhlemann, Stephan; Haider, Maximillian; Casares, Antonio; Rogers, Steven, Particle-optical systems and arrangements and particle-optical components for such systems and arrangements.
Kim, Eokbong; Choi, Jin sung; Kim, Mun Ja; Son, Kijung, Pattern inspection methods and methods of fabricating reticles using the same via directing charged particle beams through discharge layers.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.