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An ignition coil includes a coil portion and an igniter. The coil portion has a primary coil, a secondary coil, and a coil case. The primary coil and the secondary coil are disposed in the coil case. The igniter is disposed on one end side of the coil portion. The igniter includes a metallic frame c

An ignition coil includes a coil portion and an igniter. The coil portion has a primary coil, a secondary coil, and a coil case. The primary coil and the secondary coil are disposed in the coil case. The igniter is disposed on one end side of the coil portion. The igniter includes a metallic frame connected to a voltage source at a constant potential, and a semiconductor integrated chip disposed on the metallic frame. The semiconductor integrated chip has a control circuit for controlling a switching element. The control circuit is formed by a dielectric isolation method. A surface of the semiconductor integrated chip on a silicon substrate-side is opposed to the metallic frame.

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What is claimed is: 1. An ignition coil comprising: a coil portion having a primary coil, a secondary coil, and a coil case, wherein the primary coil and the secondary coil are disposed in the coil case; and an igniter disposed on one end side of the coil portion, wherein: the igniter includes a me

What is claimed is: 1. An ignition coil comprising: a coil portion having a primary coil, a secondary coil, and a coil case, wherein the primary coil and the secondary coil are disposed in the coil case; and an igniter disposed on one end side of the coil portion, wherein: the igniter includes a metallic frame connected to a voltage source at a constant potential, and a semiconductor integrated chip disposed on the metallic frame; the semiconductor integrated chip has a control circuit for controlling a switching element; the control circuit is formed by a dielectric isolation method; and a surface of the semiconductor integrated chip on a silicon substrate-side is opposed to the metallic frame. 2. The ignition coil according to claim 1, wherein: the semiconductor integrated chip is deposed on an inside surface of the metallic frame, and the inside surface faces the coil portion. 3. The ignition coil according to claim 1, wherein the metallic frame and the semiconductor integrated chip are mold-formed using a dielectric resin. 4. An ignition coil comprising: a coil portion having a primary coil, a secondary coil, and a coil case, wherein the primary coil and the secondary coil are disposed in the coil case; and an igniter disposed on one end side of the coil portion, wherein: the igniter includes a metallic frame connected to a voltage source at a constant potential, and a semiconductor integrated chip disposed on the metallic frame; the semiconductor integrated chip has a control circuit for controlling a switching element; the control circuit is formed by a junction isolation method; a surface of the semiconductor integrated chip on a silicon substrate-side is opposed to the metallic frame; the semiconductor integrated chip is disposed on an outside surface of the metallic frame; and the outside surface faces an opposite side of the coil portion. 5. The ignition coil according to claim 4, wherein the metallic frame and the semiconductor integrated chip are mold-formed using a dielectric resin.