[특허]Method of producing an electronic component with flexible bonding

Method of producing an electronic component with flexible bonding 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-021/44 H01L-021/48 H01L-021/50 H01L-021/31 H01L-021/469
출원번호	UP-0124515 (2005-05-06)
등록번호	US-7820482 (2010-11-15)
우선권정보	DE-199 27 750(1999-06-17)
발명자 / 주소	Hedler, Harry Haimerl, Alfred
출원인 / 주소	Qimonda AG
대리인 / 주소	Edell, Shapiro & Finnan, LLC
인용정보	피인용 횟수 : 0 인용 특허 : 43

초록 ▼

A method for producing an electronic component with an electronic circuit and electrical contacts, disposed at least on a first surface of the electronic component, for the electrical bonding of the electronic circuit includes at least one flexible elevation of an insulating material disposed on the first surface, at least one electrical contact disposed on the flexible elevation, and a conduction path disposed on the surface or in the interior of the flexible elevation between the electrical contact and the electronic circuit.

대표청구항 ▼

We claim: 1. A method of producing an electronic component, the method comprising: providing an electronic component including: an electronic circuit with a first surface; and electrical contacts at least on the first surface for electrical bonding of the electronic circuit; applying at least one elevation on the first surface of the electronic circuit, the elevation having an elevation surface and a contact zone, the elevation being of an elastic material that cannot be metalized and having sufficient flexibility to absorb stresses occurring in the contact zone as a result of at least one of the group consisting of thermal loading and mechanical loading; partially covering the elevation and the first surface with a semi-elastic layer, leaving a side face of the elevation free of the semi-elastic layer; providing at least one of the electrical contacts on the semi-elastic layer partially covering the elevation; and providing a conduction path on the semi-elastic layer on an elevation surface between the at least one of the electrical contacts and the electronic circuit. 2. The method according to claim 1, further comprising: roughening the elevation surface after the elevation has been applied, at least in a region of the later-produced conduction path, wherein the roughened surface provides an improved adhesion between the elevation surface and at least the conduction path. 3. The method according to claim 1, wherein the elevation is formed by one of the group consisting of: a pressure process, injection molding, and injection-compression molding. 4. The method according to claim 2, further comprising depositing nuclei on the elevation surface after the elevation surface has been roughened and before a conducting material has been applied to form the conduction path on the elevation surface. 5. The method according to claim 4, wherein the nuclei is palladium. 6. The method according to claim 2, further comprising forming the conduction path by depositing a conducting material on the roughened elevation surface. 7. The method according to claim 2, wherein the elevation surface is roughened using a laser.

이 특허에 인용된 특허 (43)

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