IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0043442
(2005-01-26)
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등록번호 |
US-7827930
(2010-11-25)
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발명자
/ 주소 |
- Lubomirsky, Dmitry
- Shanmugasundram, Arulkumar
- Ellwanger, Russell
- Pancham, Ian A.
- Cheboli, Ramakrishna
- Weidman, Timothy W.
|
출원인 / 주소 |
|
대리인 / 주소 |
Patterson & Sheridan, LLP
|
인용정보 |
피인용 횟수 :
11 인용 특허 :
132 |
초록
▼
An electroless deposition system is provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled
An electroless deposition system is provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate a surface of a substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate transfer shuttle positioned to transfer substrates between the first and second processing stations. The system also includes a substrate transfer robot positioned on the mainframe and configured to access an interior of the processing enclosure. The system also includes a substrate a fluid delivery system that is configured to deliver a processing fluid by use of a spraying process to a substrate mounted in the processing enclosure.
대표청구항
▼
The invention claimed is: 1. A processing chamber having a processing region adapted to process a substrate, comprising: a platen assembly positioned in the processing region, the platen assembly comprising: a base member having a fluid aperture formed therethrough; a fluid diffusion member sealabl
The invention claimed is: 1. A processing chamber having a processing region adapted to process a substrate, comprising: a platen assembly positioned in the processing region, the platen assembly comprising: a base member having a fluid aperture formed therethrough; a fluid diffusion member sealably positioned on the base member and having an upstream side and a downstream side, wherein the fluid diffusion member has a plurality of fluid passages in fluid communication between the upstream side and the downstream side; and a fluid volume formed between the base member and the upstream side of the fluid diffusion member; and a rotatable substrate support assembly positioned in a processing region and having a substrate supporting surface, wherein the rotatable substrate support is adapted to rotate relative to the platen assembly. 2. The processing chamber of claim 1, further comprising: a fluid source that is adapted to deliver an electroless processing solution to a surface of a substrate positioned on the substrate support; and a fluid heater in thermal communication with the electroless processing solution delivered from the fluid source. 3. The processing chamber of claim 2, further comprising a fluid degassing unit that is in fluid communication with the fluid source. 4. The processing chamber of claim 2, wherein the fluid heater is a microwave heater that is adapted to heat the processing fluid delivered from the fluid source. 5. The processing chamber of claim 2, wherein the processing chamber further comprises one or more nozzles in fluid communication with the fluid source and the surface of the substrate positioned on the rotatable substrate support. 6. The processing chamber of claim 5, further comprising an arm assembly that is positioned above the fluid diffusion member and is adapted to position the one or more nozzles in a desired position above a surface of a substrate positioned on the rotatable substrate support. 7. The processing chamber of claim 1, wherein the rotatable substrate support assembly comprises a plurality of substrate engaging fingers. 8. The processing chamber of claim 1, further comprising: a lift assembly in communication with the rotatable substrate support assembly, wherein the lift assembly is adapted to position the substrate supporting surface of the rotatable substrate support assembly relative to the fluid diffusion member. 9. The processing chamber of claim 1, further comprising: a temperature controlled fluid source that is in fluid communication with the fluid aperture, the fluid volume and a substrate that is positioned on the substrate receiving surface. 10. The processing chamber of claim 1, wherein the plurality of fluid passages are pores formed in a porous ceramic material or a porous plastic material. 11. The processing chamber of claim 10, wherein the pore size in the porous ceramic material or the porous plastic material is between about 0.1 micrometers to about 500 micrometers. 12. The processing chamber of claim 1, further comprising a baffle positioned in the fluid volume, wherein the baffle is adapted to restrict the communication of a fluid delivered from the fluid aperture to the plurality of fluid passages. 13. The processing chamber of claim 1, wherein the platen assembly further comprises a heating element in thermal communication with a fluid positioned in the fluid volume. 14. The processing chamber of claim 13, wherein the heater is a resistive heating element embedded in the base member. 15. The processing chamber of claim 1, wherein the platen assembly further comprises a fluid heating element that is in fluid communication with the fluid volume. 16. The processing chamber of claim 1, wherein the processing chamber further comprises: one or more walls enclosing the processing region of the processing chamber; a bowl member positioned below the substrate receiving surface and further comprising: an interleaving wall connected to a wall that encloses the processing region of the processing chamber; a bowl mounted in the processing region that comprises: a base wall; and a first wall and a second wall that protrude above the base wall; wherein the first wall and the second wall are substantially parallel to the interleaving wall and the interleaving wall is positioned between the first wall and the second wall; and a fluid disposed in the region between the first wall and the second wall and is in contact with the interleaving wall. 17. The processing chamber of claim 1, further comprising: one or more walls enclosing the processing region of the processing chamber; and a gas source adapted to deliver a processing gas to the processing region. 18. A processing chamber adapted to process a substrate, comprising: one or more walls forming an enclosed processing region of the processing chamber; a platen assembly positioned in the enclosed processing region, the platen assembly comprising: a base member having a fluid aperture formed therethrough; a fluid diffusion member sealably positioned on the base member and having an upstream side and a downstream side, wherein the fluid diffusion member has a plurality of fluid passages in fluid communication between the upstream side and the downstream side; and a fluid volume formed between the base member and the upstream side of the fluid diffusion member; a rotatable substrate support assembly positioned in the enclosed processing region and having a substrate receiving surface, wherein the rotatable substrate support is adapted to rotate a substrate positioned on the substrate receiving surface relative to the platen assembly; and a lift assembly in communication with the rotatable substrate support assembly, wherein the lift assembly is adapted to position a substrate positioned on the substrate receiving surface relative to the diffusion member. 19. The processing chamber of claim 18, further comprising: a fluid source positioned outside the enclosed processing region; and a porous plate sealably positioned on one of the one or more walls that is adapted to allow a fluid delivered from the fluid source to pass therethrough and into the enclosed processing region. 20. A processing chamber adapted to process a substrate, comprising: one or more walls forming an enclosed processing region of the processing chamber; a platen assembly positioned in the enclosed processing region, the platen assembly comprising: a base member having a fluid aperture formed there through; a fluid diffusion member sealably positioned on the base member and having an upstream side and a downstream side, wherein the fluid diffusion member has a plurality of fluid passages in fluid communication between the upstream side and the downstream side; and a fluid volume formed between the base member and the upstream side of the fluid diffusion member; a rotatable substrate support assembly positioned in the enclosed processing region and having a substrate supporting surface that is substantially parallel to the downstream side of the fluid diffusion member, wherein the rotatable substrate support is adapted to rotate relative to the platen assembly; two or more fluid catch rings positioned in the processing chamber, wherein the fluid catch rings are vertically disposed in the processing chamber and at least one fluid catch ring is positioned radially outwards from the platen assembly and the rotatable substrate support during processing; and a lift assembly in communication with the rotatable substrate support assembly, wherein the lift assembly is adapted to position a substrate positioned on the substrate receiving surface relative to the diffusion member. 21. The processing chamber of claim 20, wherein the lift assembly is adapted to position the substrate supporting surface relative to the two or more catch cups mounted in the processing chamber so that fluid dispensed on the substrate can be separately collected in each of the two or more catch cups.
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