[미국특허]
Electroplating an yttrium-containing coating on a chamber component
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C25D-005/10
C25D-005/50
C25D-003/54
출원번호
UP-0766723
(2007-06-21)
등록번호
US-7833401
(2011-01-16)
발명자
/ 주소
Han, Nianci
Xu, Li
Shih, Hong
Zhang, Yang
Lu, Danny
Sun, Jennifer Y.
출원인 / 주소
Applied Materials, Inc.
대리인 / 주소
Janah, Ashok K.
인용정보
피인용 횟수 :
3인용 특허 :
87
초록▼
A method of forming a component capable of being exposed to a plasma in a process chamber comprises forming a structure comprising a surface and electroplating yttrium, and optionally aluminum or zirconium, onto the surface. Thereafter, the electroplated layer can be annealed to oxide the yttrium an
A method of forming a component capable of being exposed to a plasma in a process chamber comprises forming a structure comprising a surface and electroplating yttrium, and optionally aluminum or zirconium, onto the surface. Thereafter, the electroplated layer can be annealed to oxide the yttrium and other electroplated species.
대표청구항▼
What is claimed is: 1. A method of forming a process chamber component capable of being exposed to a plasma in a process chamber, the method comprising: (a) forming a component structure comprising a surface; (b) electroplating yttrium-containing species onto the surface of the component structure
What is claimed is: 1. A method of forming a process chamber component capable of being exposed to a plasma in a process chamber, the method comprising: (a) forming a component structure comprising a surface; (b) electroplating yttrium-containing species onto the surface of the component structure to form a coating, the coating having a surface; and (c) annealing the coating in an oxygen containing atmosphere to form a coating comprising yttrium oxide with a greater concentration of oxidized yttrium species near the surface of the coating than near the surface of the underlying component structure. 2. A method according to claim 1 comprising electroplating the yttrium-containing species by: (i) immersing the surface of the component structure in an electroplating bath comprising a solution of yttrium species; (ii) connecting the component structure to a negative terminal of a voltage source; and (iii) connecting an anode immersed in the electroplating bath to a positive terminal of the voltage source, the anode comprising an inert material or a material to be electroplated onto the component structure. 3. A method according to claim 2 comprising immersing the surface of the component structure in an electroplating bath comprising a solution of one or more of yttrium bromide, yttrium chloride, yttrium fluoride, yttrium nitrate, yttrium perchlorate, yttrium carbonate, yttrium sulfate, yttrium hydroxide, yttrium iodide and yttrium acetate. 4. A method according to claim 2 comprising maintaining a concentration of yttrium-containing species in the solution of from about 0.1 mM to about 50 M. 5. A method according to claim 2 comprising maintaining a bias voltage across the positive and negative terminals that is sufficiently high to provide a current density of from about 0.1 A/dm2 to about 100 A/dm2 in the solution. 6. A method according to claim 2 comprising electroplating the yttrium-containing species to form a coating having a thickness of from about 12 micrometers to about 203 micrometers. 7. A method according to claim 1 comprising electroplating yttrium-containing species comprising elemental yttrium, and annealing the elemental yttrium to form yttrium oxide in an oxygen containing atmosphere comprising of one or more of O2, O3 and H2O. 8. A method according to claim 7 comprising annealing the elemental yttrium to a temperature of at least about 600° C. 9. A method according to claim 1 wherein (b) comprises immersing the surface in an electroplating bath comprising yttrium-containing species and a second species, the electroplating bath being maintained at electroplating conditions, and varying the electroplating conditions to form a coating having a thickness with a concentration gradient of yttrium therethrough. 10. A method according to claim 1 further comprising depositing aluminum-containing species or zirconium-containing species onto the surface of the component structure. 11. A method according to claim 10 comprising depositing the aluminum-containing species by electroplating in an electroplating bath comprising one or more of aluminum chloride, aluminum bromide, aluminum fluoride, and aluminum hydroxide. 12. A method according to claim 10 comprising depositing the zirconium-containing species by electroplating in an electroplating bath comprising one or more of zirconium nitrate, zirconium silicate, zirconium sulfate and zirconium citrate. 13. A method according to claim 10 comprising depositing the zirconium-containing species by physical vapor deposition, plasma spraying, or chemical vapor deposition. 14. A method according to claim 1 comprising electroplating a plurality of layers comprising elemental yttrium, aluminum or zirconium onto the surface, and annealing the layers to form yttrium oxide, aluminum oxide or zirconium oxide. 15. A method according to claim 14 comprising forming partially stabilized zirconia (PSZ) or tetragonal zirconia. 16. A method according to claim 14 comprises forming yttrium aluminum garnet. 17. A method according to claim 1 wherein (a) comprises forming a component structure comprising a metal or an alloy. 18. A method according to claim 1 comprising annealing the coating in an oxygen containing atmosphere such that the concentration of the yttrium-containing species decreases from the surface of the coating to the surface of the component structure. 19. A method of forming a plasma resistant component capable of being exposed to a plasma in a process chamber, the method comprising: (a) forming a structure comprising a surface; (b) electroplating onto the surface, a plurality of first layers comprising aluminum, zirconium, or both; (c) electroplating onto the surface, a plurality of second layers comprising yttrium; and (d) annealing the first and second layers in an oxygen containing atmosphere to form a coating comprising (i) oxidized yttrium, (ii) oxidized aluminum, oxidized zirconium, or both, and (iii) a greater concentration of oxidized yttrium species near a surface of the coating than near the surface of the structure. 20. A method of forming a plasma resistant component capable of being exposed to a plasma in a process chamber, the method comprising: (a) forming an electroplated coating on a surface of a structure, the electroplated coating comprising elemental yttrium, elemental aluminum, and elemental zirconium; and (b) annealing the electroplated coating in an oxygen containing atmosphere to form an oxidized coating comprising oxidized yttrium, oxidized aluminum, and oxidized zirconium, such that the oxidized coating comprises a greater concentration of oxidized yttrium species near a surface of the oxidized coating than near the surface of the structure.
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