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특허 상세정보

Chamber sealing valve

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) G01P-021/00   
미국특허분류(USC) 073/001.17
출원번호 UP-0180733 (2008-07-28)
등록번호 US-7836748 (2011-01-22)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Buckley, Maschoff & Talwalkar LLC
인용정보 피인용 횟수 : 0  인용 특허 : 19
초록

According to some embodiments, a test fluid may be provided into a chamber associated with a cooling system for an electronic integrated circuit. Moreover, a valve may be partially inserted into an opening of the chamber to seal the chamber. The valve may include a first sealing portion to seal the chamber at the opening when the valve shaft is inserted the first distance. The valve may then be inserted an intermediate distance, between the first distance and a second distance, to unseal the chamber. Note that the valve may include a second sealing porti...

대표
청구항

What is claimed is: 1. A method, comprising: providing a test fluid into a chamber associated with a cooling system for an electronic integrated circuit; partially inserting a valve a first distance into an opening of the chamber to seal the opening of the chamber, the opening having a width, wherein said valve defines an axis along which the valve is inserted into the opening, and further wherein said valve includes a first sealing portion to seal the opening of the chamber when the valve is inserted the first distance; continuing to insert the valve a...

이 특허에 인용된 특허 (19)

  1. Fox Leslie R. (Boxborough MA). Apparatus for packaging and cooling integrated circuit chips. USP1993025184211.
  2. Jaeger Robert A. (3822 Cloverhill Ct. Brandon FL 33511). Balanced piston fluid valve. USP1994055309934.
  3. Labonte Roger E. (110 Crater Crescent Sudbury ; Ontario CAX P3E 5Y6 ). Drain valve assembly. USP1996125579815.
  4. deCler, Charles Peter; Johnson, Robert K.. Fluid coupling with disposable connector body. USP2005116962275.
  5. Hutchison ; Robert V. ; Gregg ; Peter P. ; MacBride ; James J.. Heat pipe cooling for semiconductor device packaging system. USP1978084104700.
  6. Paterson Robert W. (Seneca SC). Integrated circuit cooling device having internal cooling conduit. USP1996065529115.
  7. Fields ; Ernest E. ; Reineck ; Lester W.. Liquid tank cap having a vent. USP1978094113138.
  8. Collins David R. (Eau Claire WI) Franz Perry D. (Elk Mound WI) Taylor Pamela W. (Eau Claire WI). Method and apparatus for cooling an integrated circuit chip during testing. USP1991014982153.
  9. Wall Charles B. ; Peeples Johnston W. ; Craps Terry ; DiGiacomo Robert. Method and apparatus for cooling an integrated circuit device. USP2000046054676.
  10. Kinast Leonard L. (39239 Polo Club Dr. ; Apt. 105 Farmington Hills MI 48124). Method of securing a cap assembly to a radiator. USP1994015279025.
  11. Burdick Douglas (Downers Grove IL) Pliml Frank V. (Arlington Heights IL) Hartley Michael W. (Elmhurst IL). Oil drain valve assembly. USP1992035096158.
  12. Lockwood ; Jr. Hanford N. (2222 Alameda de las Pulgas San Mateo CA 94403). Pressure-responsive shut-off valve. USP1983094402340.
  13. Burgess Carlton M. (Lockport NY). Radiator drain assembly. USP1980034193575.
  14. Akamatsu Shinya (Tokyo JPX) Mine Shinji (Tokyo JPX) Seguchi Hideki (Tokyo JPX). Structure for cooling an integrated circuit. USP1995055420753.
  15. Burward-Hoy Trevor (Cupertino CA). Sub-ambient temperature electronic package. USP1997065637921.
  16. Cardella Mark A.. Temperature control system for electronic devices. USP2001026184504.
  17. Stricklin Douglas K. (Brea CA) Savage Chester (Irvine CA). Two-part coupling structure having cooperating parts effecting fluid flow upon connection and mutual resealing upon disc. USP1997035609195.
  18. Teets J. Michael (Hobe Sound FL) Wiita Bruce E. (North Palm Beach FL) Witta Gregory D. (Palm Beach Gardens FL). Valve means with fluid retraction means. USP1995065427144.
  19. Blomquist James E. (Cedarburg WI) Simon Barry S. (Wauwatosa WI). Vent for portable gas tank or the like. USP1990034905863.