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A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias

A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias profile across a processing area, thereby controlling processing rates between two or more conductive portions of the substrate.

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What is claimed is: 1. An apparatus for electrochemically processing a substrate, comprising: a pad support; a removable polishing pad assembly disposed on the pad support, the pad assembly comprising: a first counter electrode embedded in an insulator; at least a second counter electrode embedded

What is claimed is: 1. An apparatus for electrochemically processing a substrate, comprising: a pad support; a removable polishing pad assembly disposed on the pad support, the pad assembly comprising: a first counter electrode embedded in an insulator; at least a second counter electrode embedded in the insulator and disposed laterally adjacent to the first counter electrode, the first and second counter electrodes having a concentric planar orientation; and a conductive polishing surface that is adapted to process the substrate, the polishing surface having a plurality of apertures exposing the first counter electrode and the second counter electrode, wherein the first and second counter electrodes are independently electrically biasable relative to the conductive surface. 2. The apparatus of claim 1, wherein a portion of the insulator is disposed between the first counter electrode and the second counter electrode. 3. The apparatus of claim 1, wherein the first counter electrode belongs to a first set of counter electrodes and the second counter electrode belongs to a second set of counter electrodes, wherein the first set is electrically biasable independently from the second set of counter electrodes. 4. The apparatus of claim 3, wherein the first set of counter electrodes is disposed radially inward of the second set of counter electrodes. 5. The apparatus of claim 4, further comprising a third set of counter electrodes disposed radially outward of the second set of counter electrodes. 6. The apparatus of claim 1, wherein the first and the second counter electrodes are part of a plurality of counter electrodes arranged in a polar array. 7. The apparatus of claim 6, wherein the polar array of counter electrodes further comprises: at least a third counter electrode that is radially aligned and electrically biasable independently from the first counter electrode. 8. The apparatus of claim 1 further comprising a local polishing rate indicator adapted to detect a metric indicative of differences in polishing rate across the substrate. 9. The apparatus of claim 8, wherein the local polishing rate indicator further comprises: a plurality of sensors, each sensor coupled to a respective one of the counter electrodes. 10. The apparatus of claim 9, wherein at least one of the sensors is adapted to detect electrical current passing between the first counter electrode and the substrate. 11. The apparatus of claim 1, wherein the first counter electrode and the second counter electrode are removably disposed on the pad support. 12. The apparatus of claim 1, wherein the conductive polishing surface is configured to provide a uniform potential to the surface of the substrate. 13. An apparatus for electrochemically processing a substrate, comprising: a counter electrode assembly having a plurality of concentrically arranged counter electrodes embedded in an insulator and disposed on a pad support, at least one of the plurality of counter electrodes independently electrically biasable relative to a second one of the counter electrodes; a conductive polishing pad disposed on top of the plurality of counter electrodes, the conductive polishing pad having a first side adapted to polish the substrate and a second side facing the plurality of counter electrodes, where in the conductive polishing pad has a diameter substantially equal to that of the counter electrode assembly, the plurality of counter electrodes of the counter electrode assembly and the conductive pad forming a replaceable unitary replaceable assembly; a housing adapted to support the substrate therein; and an electrolyte delivery system adapted to provide an electrolyte adapted to provide a plurality of independently controlled electrical paths between the substrate and the plurality of counter electrodes through the conductive pad. 14. The apparatus of claim 13 further comprising a local polishing rate indicator adapted to detect a metric indicative of differences in polishing rate across the substrate. 15. The apparatus of claim 14, wherein the local polishing rate indicator further comprises: a plurality of sensors, each sensor coupled to a respective one of the plurality of counter electrodes. 16. The apparatus of claim 15, wherein at least one of the sensors is adapted to detect electrical current between the counter electrode coupled to the sensor and the substrate. 17. The apparatus of claim 15 further comprising: a multiple output power source, each of the plurality of counter electrodes coupled individually to one of the outputs. 18. The apparatus of claim 13, wherein the conductive polishing surface is configured to provide a uniform potential to the surface of the substrate. 19. An apparatus for electrochemically processing a substrate, comprising: a pad support; a counter electrode assembly having a plurality of independently biasable concentric counter electrodes embedded in an insulator and disposed on the pad support; a polishing pad disposed on the counter electrode assembly opposite the pad support, the polishing pad having a diameter greater than a diameter of at least one of the counter electrodes, the polishing pad having a first side adapted to polish the substrate and a second side facing the at least one counter electrode; a plurality of conductive members on the first side of the polishing pad, wherein the at least one counter electrode, polishing pad and conductive members form a unitary replaceable assembly; and a plurality of independently controllable electrical paths laterally arranged and disposed between the conductive members and the counter electrodes. 20. The apparatus of claim 19, wherein each of the plurality of electrical pathways further comprises a respective one of the counter electrodes. 21. The apparatus of claim 20, wherein each of the plurality of electrical pathways is configured to control a local polishing rate and disposed between the respective counter electrode and the plurality of conductive members. 22. The apparatus of claim 21, wherein each of the electrodes is configured to control the local polishing rate by adjusting the a current flux to the substrate and is independently biasable. 23. An apparatus for electrochemically processing a substrate, comprising: a pad support; at least a first counter electrode embedded in an insulator and disposed on the pad support; a conductive polishing pad disposed on the first counter electrode and having a first side adapted to process the substrate and a second side facing the first counter electrode, the polishing pad having a plurality of apertures; and a plurality of independently biasable electrodes disposed between the counter electrode and the conductive polishing pad, the plurality of electrodes exposed to the first side of the polishing pad through the apertures, wherein the first counter electrode, the conductive polishing pad and the plurality of electrodes form a unitary replaceable assembly. 24. The apparatus of claim 23 further comprising: at least a second counter electrode; and a local polishing rate indicator adapted to detect a metric indicative of differences in polishing rate. 25. The apparatus of claim 24, wherein the local polishing rate indicator further comprises: a first sensor coupled to the first counter electrode; and a second sensor coupled to the second counter electrode. 26. The apparatus of claim 25, wherein the first sensor is adapted to detect at least one of electrical current or voltage potential between the first counter electrode and the substrate. 27. The apparatus of claim 23, wherein a portion of the insulator is disposed between the plurality of independently biasable electrodes. 28. The apparatus of claim 23 further comprising: a first power source coupled between the polishing pad and the first counter electrode; and a second power source coupled to the plurality of independently biasable electrodes. 29. The apparatus of claim 28, wherein the second power source has a plurality of outputs for independently biasing each of the plurality of independently biasable electrodes. 30. The apparatus of claim 29 further comprising: a plurality of sensors, each sensor adapted to detect at least one of a current or a voltage potential between the counter electrode and ground. 31. An apparatus for electrochemically processing a substrate comprising: a conductive polishing surface adapted to support the substrate in a position contacting a surface of the substrate with an electrolyte, the conductive polishing surface and substrate in contact therewith forming a first node; at least one counter electrode embedded in an insulator and disposed approximate the polishing surface; a plurality of concentrically arranged and independently biasable electrodes disposed between the polishing surface and the at least one counter electrode, the polishing surface, the counter electrode and the plurality of electrodes forming a unitary, replaceable pad assembly; and a plurality of independently biasable electric circuits formed across the electrolyte and having a common node defined at the first node, wherein each of the plurality of electrodes is adapted to independently adjust a first local rate of the electrochemical processing relative to a second local rate of electrochemical processing proximate an adjacent electrode of the plurality of electrodes. 32. The apparatus of claim 31, further comprising a plurality of counter electrodes, each counter electrode is independently biasable.