IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0912030
(2006-04-18)
|
등록번호 |
US-7846239
(2011-01-31)
|
우선권정보 |
JP-2005-121362(2005-04-19) |
국제출원번호 |
PCT/JP2006/308498
(2006-04-18)
|
§371/§102 date |
20080401
(20080401)
|
국제공개번호 |
WO06/112534
(2006-10-26)
|
발명자
/ 주소 |
- Yamawaki, Masakatsu
- Murota, Toru
- Kitaguchi, Shinya
|
출원인 / 주소 |
- Nippon Shokubai Co., Ltd.
- Shinwa Controles Co., Ltd.
- Taisei Corporation
|
대리인 / 주소 |
Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
|
인용정보 |
피인용 횟수 :
2 인용 특허 :
5 |
초록
▼
An automatic selector valve including a box body having an internal space portion, framed partition plates separating the space portion into four rooms, each framed partition plate having an opening portion, plate-shaped turnable valve bodies opening or closing the opening portions of the framed par
An automatic selector valve including a box body having an internal space portion, framed partition plates separating the space portion into four rooms, each framed partition plate having an opening portion, plate-shaped turnable valve bodies opening or closing the opening portions of the framed partition plates, an inflow port letting a gas flow in, an inflow/outflow port letting a gas flow in and flow out alternately, an outflow port letting a gas flow out through, and an inflow/outflow port letting a gas flow in and flow out alternately with the port, the ports provided in the separated four rooms, and a driving mechanism turning the plate-shaped turnable valve bodies about a rotation shaft.
대표청구항
▼
The invention claimed is: 1. An automatic four-port selector valve comprising: a casing having an internal space portion; framed partition plates for separating said space portion into first, second, third, and fourth rooms, each framed partition plate having an opening portion; plate-shaped turnab
The invention claimed is: 1. An automatic four-port selector valve comprising: a casing having an internal space portion; framed partition plates for separating said space portion into first, second, third, and fourth rooms, each framed partition plate having an opening portion; plate-shaped turnable valve bodies for opening or closing the opening portions of said framed partition plates; an inflow port for always letting a gas flow in through it in any instance, a first inflow/outflow port for letting a gas flow in and flow out through it alternately, an outflow port for always letting a gas flow out through it in any instance, and a second inflow/outflow port for letting a gas flow in and flow out through it alternately with said first inflow/outflow port, the ports being provided in said separated four rooms; and a driving means for turning said plate-shaped turnable valve bodies about a rotation shaft, wherein said opening portions include means for independently changing opening ratios (%) thereof, and the opening ratio changing means are movable vertically or horizontally along an inner wall surface of said first or third rooms when said plate-shaped turnable valve bodies are arranged or positioned in said second or fourth rooms or along an inner wall surface of second and/or fourth room when said plate-shaped turnable valve bodies are arranged or positioned in said first or third rooms, and said means are thereby capable of changing the opening ratios (%) of said opening portions. 2. The automatic four-port selector valve of claim 1, wherein said means for changing opening ratios are constituted of movable plates and actuators and said movable plates synchronize with turning of said plate-shaped turnable valve bodies in operation. 3. An automatic four-port selector valve comprising: a casing having an internal space portion; framed partition plates for separating said space portion into first, second, third, and fourth rooms, each framed partition plate having an opening portion; plate-shaped turnable valve bodies for opening or closing the opening portions of said framed partition plates; an inflow port for always letting a gas flow in through it in any instance, a first inflow/outflow port for letting a gas flow in and flow out through it alternately, an outflow port for always letting a gas flow out through it in any instance, and a second inflow/outflow port for letting a gas flow in and flow out through it alternately with said first inflow/outflow port, the ports being provided in said separated four rooms; and a driving means for turning said plate-shaped turnable valve bodies about a rotation shaft, wherein at least one of said inflow port or said outflow port includes a pressure sensor. 4. A batch type temperature swing adsorption apparatus having two lines of adsorbent units, wherein the two lines of adsorbent units include two automatic four-port selector valves, as a first valve and a second valve in combination, said valve comprising: a casing having an internal space portion; framed partition plates for separating said space portion into first, second, third, and fourth rooms, each framed partition plate having an opening portion; plate-shaped turnable valve bodies for opening or closing the opening portions of said framed partition plates; an inflow port for always letting a gas flow in through it in any instance, a first inflow/outflow port for letting a gas flow in and flow out through it alternately, an outflow port for always letting a gas flow out through it in any instance, and a second inflow/outflow port for letting a gas flow in and flow out through it alternately with said first inflow/outflow port, the ports being provided in said separated four rooms; and a driving means for turning said plate-shaped turnable valve bodies about a rotation shaft, and each of the two lines of adsorbent units includes regeneration means for regenerating adsorption capability of said adsorbent unit, measuring/adjusting means each for a static pressure of treatment gas, a static pressure of supply gas, a static pressure of regeneration gas, and a static pressure of exhaust gas, measuring/adjusting means for a flow rate of the regeneration gas and/or a flow rate of the treatment gas, and a switching controller for controlling the switching of adsorption operation and regeneration operation with said first valve and said second valve. 5. The batch type temperature swing adsorption apparatus of claim 4, wherein each of said adsorbent units comprises units that are formed of an adsorbent for adsorbing molecular contaminants or an adsorbent for adsorbing water, said units being arranged in series. 6. The batch type temperature swing adsorption apparatus of claim 4, wherein measurement signals from pressure sensors of said first valve and said second valve are input to said switching controller. 7. The batch type temperature swing adsorption apparatus of claim 4, wherein said regeneration means has a regenerating blower capable of adjusting a flow rate of the regeneration gas in the range that is 0.05 to 1.2 times the flow rate of the treatment gas. 8. The batch type temperature swing adsorption apparatus of claim 4, wherein that the flow rate of the treatment gas and the flow rate of the regeneration gas are adjusted to ensure that they come to be equal to each other, and further the static pressure of the treatment gas and the static pressure of the regeneration gas are adjusted to ensure that they come to be equal to each other, before the switching of the adsorption/regeneration modes, and then the switching of adsorption/regeneration modes are made. 9. The batch type temperature swing adsorption apparatus of claim 4, wherein a pressure difference of the flow of the treatment gas flowing in a flow passage from the first valve inflow port to the second valve outflow port, and a pressure difference of the flow of the regeneration gas flowing from the inflow port of the second valve to the outflow port of the first valve are adjusted before said switching of the adsorption/regeneration modes to ensure that they come to be equal to each other. 10. The batch type temperature swing adsorption apparatus of claim 4, which is an air cleaning apparatus, a dry air supply apparatus, a clean temperature-controlled/humidity-controlled air supply apparatus, a cleaning nitrogen gas supply apparatus, a dry nitrogen gas supply apparatus, or a clean temperature-controlled/humidity-controlled nitrogen gas supply apparatus. 11. A method of supplying a clean electronic-parts manufacturing plant or clean semiconductor device manufacturing plant or facilities having a constitution including at least one of a clean room, a clean booth, a clean bench, apparatuses for manufacturing electronic parts, including a semiconductor device manufacturing apparatus, a liquid crystal display manufacturing apparatus, an organic EL display manufacturing apparatus, a clean tunnel, a clean oven, a storage warehouse for protection of process substrates, a stocker, a transfer unit as an accessory to a manufacturing apparatus, a loader/unloader, an enclosure, an inspection apparatus and an auxiliary machine, with clean air, dry air, clean temperature-controlled/humidity-controlled air, a cleaning nitrogen gas, a dry nitrogen gas, or a clean temperature-controlled/humidity-controlled nitrogen gas by the apparatuses recited in claim 10. 12. A clean electronic-part manufacturing plant or clean semiconductor device manufacturing plant or facilities having a constitution including at least one of a clean room, a clean booth, a clean bench, apparatuses for manufacturing electronic parts, including a semiconductor device manufacturing apparatus, a liquid crystal display manufacturing apparatus, an organic EL display manufacturing apparatus, a clean tunnel, a clean oven, a storage warehouse for protection of process substrates, a stocker, a transfer unit as an accessory to a manufacturing apparatus, a loader/unloader, an enclosure, an inspection apparatus and an auxiliary machine, the clean electronic-parts manufacturing plant or clean semiconductor device manufacturing plant or facilities having at least one of the air cleaning apparatus, the dry air supply apparatus, the clean temperature-controlled/humidity-controlled air supply apparatus, the cleaning nitrogen gas supply apparatus, the dry nitrogen gas supply apparatus and the clean temperature-controlled/humidity-controlled nitrogen gas supply apparatus recited in claim 10.
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