IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0678523
(2007-02-23)
|
등록번호 |
US-7851812
(2011-02-10)
|
우선권정보 |
DE-10 2006 008 793(2006-02-24) |
발명자
/ 주소 |
- Behringer, Martin Rudolf
- Feltges, Harald
- Hoefer, Thomas
- Moellmer, Frank
|
출원인 / 주소 |
- Osram Opto Semiconductors GmbH
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
2 인용 특허 :
13 |
초록
An electronic device according to the invention includes a housing, a recess containing an optoelectronic component, and a film including a polyimide, which is over the recess covering the optoelectronic component.
대표청구항
▼
What is claimed is: 1. An electronic device, comprising: a housing having a recess containing an optoelectronic component; and a film including a polyimide applied over the recess to define a cavity in which the component is located and to at least partially enclose the optoelectronic component bet
What is claimed is: 1. An electronic device, comprising: a housing having a recess containing an optoelectronic component; and a film including a polyimide applied over the recess to define a cavity in which the component is located and to at least partially enclose the optoelectronic component between the film and the housing, wherein the film including the polyimide is a piece of a strip of film and the housing is made of a synthetic material. 2. The device according to claim 1, wherein an adhesive layer attaches the film to the housing. 3. The device according to claim 1, wherein the film includes at least a first layer including the polyimide and a second layer, wherein the second layer is an adhesive layer and is attached to the housing. 4. The device according to claim 3, wherein the adhesive layer is a silicone adhesive. 5. The device according to claim 1, wherein the polyimide is a poly-(diphenyloxide-pyromellithimide). 6. The device according to claim 1, wherein the film has a thickness of about 70 micrometers. 7. The device according to claim 1, wherein the film is configured to be on the housing while the device is operated. 8. The device according to claim 1, wherein the film is located in a radiation path of the optoelectronic component. 9. The device according to claim 1, wherein the film is transparent to radiation. 10. The device according to claim 9, wherein the film is transparent to radiation having a wavelength between about 500 nm to 900 nm. 11. The device according to claim 10, wherein the transparency of the film is temperature-independent between about −40° C. and 100° C. 12. The device according to claim 1, wherein the film has antistatic properties. 13. The device according to claim 1, wherein the optoelectronic component is a radiation-detecting optoelectronic component or a radiation-emitting optoelectronic component. 14. The device according to claim 13, wherein the optoelectronic component is a radiation-detecting optoelectronic component and the radiation-detecting optoelectronic component is a photo diode, a photo transistor or a photo IC. 15. The device according to claim 13, wherein the radiation-emitting electronic component is a radiation-emitting semiconductor diode or semiconductor laser diode. 16. The device according to claim 15, wherein the radiation-emitting electronic component is a semiconductor laser diode, wherein the semiconductor laser diode is a vertical-cavity surface-emitting laser (VCSEL) diode. 17. The device according to claim 1, wherein the housing is surface-mountable. 18. A process for encapsulating an electronic device, comprising: supplying an electronic component with a housing having a recess containing an optoelectronic component; and applying a film including polyimide over the recess so that the optoelectronic component is at least partially enclosed in a cavity defined by the film, wherein the film including the polyimide is a piece of a strip of film and the housing is made of a synthetic material. 19. The process according to claim 18, further comprising: before applying the film, supplying the strip of film containing the polyimide; and removing the piece from the strip of film by cutting or stamping. 20. The process according to claim 18, wherein applying the film comprises: obtaining the film with a vacuum pipette; and locating the film over the recess while holding the film with the vacuum pipette. 21. The process according to claim 18, further comprising attaching the housing to a substrate after the film has been applied. 22. The process according to claim 21, wherein the substrate includes a circuit board. 23. The process according to previous claim 21, wherein the housing is applied to the substrate by reflow-soldering. 24. The process according to claim 18, further comprising removing the film from the housing before operating the optoelectronic component. 25. The device according to claim 2, wherein the housing has a surface surrounding the recess and the adhesive layer is applied to the surface. 26. The device according to claim 2, wherein the adhesive layer allows gases to flow into or out of the cavity. 27. The device according to claim 1, wherein the component is not in direct mechanical contact with the film. 28. The device according to claim 1, wherein the recess has at least sections of reflective areas. 29. The device according to claim 1, wherein the cavity is not hermetically sealed. 30. The device according to claim 1, wherein the film is birefringent. 31. An electronic device, comprising: a housing having a recess containing an optoelectronic component; and a film including a polyimide over the recess at least partially enclosing the optoelectronic component between the film and the housing, wherein the polyimide is a poly-(diphenyloxide-pyromellithimide). 32. An electronic device, comprising: a housing having a recess containing an optoelectronic component; and a film including a polyimide applied over the recess to define a cavity in which the component is located and to at least partially enclose the optoelectronic component between the film and the housing, wherein the film is birefringent. 33. An electronic device, comprising: a housing having a recess containing a vertical-cavity surface-emitting laser (VCSEL) diode; and a film including a polyimide applied over the recess to define a cavity in which the diode is located and to at least partially enclose the diode between the film and the housing, wherein the film including polyimide is a piece of a strip of film. 34. An electronic device, comprising: a housing having a recess containing an optoelectronic component; and a film including a polyimide applied over the recess to define a cavity in which the component is located and to at least partially enclose the optoelectronic component between the film and the housing, wherein the film including the polyimide is a piece of a strip of film and the housing is made of a synthetic material and the recess has at least sections of reflective areas.
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