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A heat dissipation structure includes an electronic device, and a cooling device mounted to the electronic device. The electronic device includes a housing, and a heat generating element mounted in the housing. The housing defines an opening. The cooling device comprises a shell abutting against the

A heat dissipation structure includes an electronic device, and a cooling device mounted to the electronic device. The electronic device includes a housing, and a heat generating element mounted in the housing. The housing defines an opening. The cooling device comprises a shell abutting against the heat generating element through the opening, a number of fins extending from the shell, a fan mounted to the shell, an air intake, and an air outlet. The air intake and the air outlet are located outside the housing.

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What is claimed is: 1. A heat dissipation structure comprising: an electronic device comprising a housing, and a printed circuit board mounted in the housing, wherein the printed circuit board comprises a heat generating element, the housing defines an opening; a cooling device mounted to the housi

What is claimed is: 1. A heat dissipation structure comprising: an electronic device comprising a housing, and a printed circuit board mounted in the housing, wherein the printed circuit board comprises a heat generating element, the housing defines an opening; a cooling device mounted to the housing, wherein the cooling device comprises a shell abutting against the heat generating element through the opening, a plurality of fins extending from the shell, a fan mounted to the shell, an air intake, and an air outlet, wherein the air intake and the air outlet are located outside the housing; wherein the shell comprises a top board, a bottom board opposite to the top board, and a side board connected between the top board and the bottom board, wherein the bottom board abuts against the heat generating element; and the heat dissipation structure further comprising at least one valve defined in the side board, wherein the at least one valve is located inside the housing. 2. The heat dissipation structure of claim 1, wherein the air intake is defined in the top board, the air outlet is defined in the side board. 3. The heat dissipation structure of claim 2, wherein the shell is generally short cylinder-shaped, the air intake is defined in a centre of the top board, the air outlet is defined circularly in the side board. 4. The heat dissipation structure of claim 3, wherein the fan is received in the shell under the air intake, the plurality of fins extends perpendicularly from the bottom board in the shell and encircling the fan. 5. The heat dissipation structure of claim 4, wherein the fan is an eddy current fan. 6. The heat dissipation structure of claim 1, wherein the air intake and the air outlet are defined in the top board. 7. The heat dissipation structure of claim 6, wherein the top board is generally tapered, the air intake and the air outlet are oppositely defined in the top board. 8. The heat dissipation structure of claim 7, wherein the fan is received in the shell under the air intake, the plurality of fins extends perpendicularly from the bottom board to the air outlet. 9. A heat dissipation structure comprising: an electronic device comprising a housing, and a heat generating element mounted in the housing, wherein the housing defines an opening; and a cooling device to cool the heat generating element, wherein the cooling device comprises a shell absorbing heat generated from the heat generating element through the opening, a fan mounted to the shell, an air intake, and an air outlet, wherein the air intake and the air outlet are located outside the housing; wherein the shell comprises a generally tapered top board, a bottom board, and an annular sideboard connected between the top board and the bottom board. 10. A heat dissipation structure comprising: an electronic device comprising a housing, and a heat generating element mounted in the housing; and a cooling device mounted to the electronic device, wherein the cooling device comprises a shell abutting against the heat generating element, a plurality of fins extending from the shell, a fan mounted to the shell, an air intake, and an air outlet, wherein the air intake and the air outlet are located outside the housing; wherein when the fan is operated, cool air directly enters into the cooling device through the air intake, and after taking heat from the fins, directly exits to the outside of the housing through the air outlet; wherein a depressed portion is formed in the housing, an opening is defined in a bottom wall of the depressed portion for matching the cooling device, to allow the shell to abut against the heat generating element. 11. The heat dissipation structure of claim 10, wherein a sidewall of the depressed portion is angled relative to the bottom wall. 12. The heat dissipation structure of claim 10, wherein the shell is generally short cylinder-shaped, and comprises a top board, a bottom board opposite to the top board, and a side board connected between the top board and the bottom board. 13. The heat dissipation structure of claim 12, wherein the air intake is defined in a centre of the top board, and the air outlet is defined in the side board. 14. The heat dissipation structure of claim 13, wherein the fan is received in the shell under the air intake, the plurality of fins extends perpendicularly from the bottom board in the shell and radially extends from encircling the fan to the air outlet. 15. The heat dissipation structure of claim 9, wherein the fan is mounted in the air intake. 16. The heat dissipation structure of claim 9, wherein the air intake and the air outlet are oppositely defined in the top board. 17. The heat dissipation structure of claim 9, wherein a plurality of fins extends from an inner side of the bottom board to the air outlet.