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Epitaxial deposition of doped semiconductor materials 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/20
출원번호 US-0644673 (2006-12-22)
등록번호 US7863163 (2010-12-20)
발명자 / 주소
  • Bauer, Matthias
출원인 / 주소
  • ASM America, Inc.
대리인 / 주소
    Knobbe Martens Olson & Bear LLP
인용정보 피인용 횟수 : 100  인용 특허 : 83

초록

A method for depositing a carbon doped epitaxial semiconductor layer comprises maintaining a pressure of greater than about 700 torr in a process chamber housing a patterned substrate having exposed single crystal material. The method further comprises providing a flow of a silicon source gas to the

대표청구항

I claim: 1. A method for depositing a carbon doped epitaxial semiconductor layer, the method comprising:maintaining a pressure of greater than about 700 torr in a process chamber housing a patterned substrate having exposed single crystal material and at least a second different exposed material;pro

이 특허에 인용된 특허 (83)

  1. Bohling David A. (Emmaus PA) Muhr Gregory T. (Allentown PA) Bassner Sherri L. (Lansdale PA), Amino replacements for arsine, antimony and phosphine.
  2. Conger Darrell R. (Portland OR) Posa John G. (Lake Oswego OR) Wickenden Dennis K. (Lake Oswego OR), Apparatus for depositing material on a substrate.
  3. Gates Stephen McConnell ; Neumayer Deborah Ann, Atomic layer deposition with nitrate containing precursors.
  4. Fitzgerald, Eugene A., Buried channel strained silicon FET using a supply layer created through ion implantation.
  5. Fitzgerald, Eugene A., Buried channel strained silicon FET using a supply layer created through ion implantation.
  6. Fitzgerald, Eugene A., Buried channel strained silicon FET using a supply layer created through ion implantation.
  7. Murthy,Anand; Glass,Glenn A.; Westmeyer,Andrew N.; Hattendorf,Michael L.; Wank,Jeffrey R., CMOS transistor junction regions formed by a CVD etching and deposition sequence.
  8. Todd, Michael A., CVD syntheses of silicon nitride materials.
  9. Sang-Gi Ko KR, Capacitor and method of fabricating the same.
  10. Whitmarsh Christopher K. (Schenectady NY) Interrante Leonard V. (Schenectady NY), Carbosilane polymer precursors to silicon carbide ceramics.
  11. Edelstein Daniel Charles ; Harper James McKell Edwin ; Hu Chao-Kun ; Simon Andrew H. ; Uzoh Cyprian Emeka, Copper interconnection structure incorporating a metal seed layer.
  12. Dickson Charles R. (Trenton NJ), Deposition feedstock and dopant materials useful in the fabrication of hydrogenated amorphous silicon alloys for photovo.
  13. Todd,Michael A., Deposition of amorphous silicon-containing films.
  14. Todd, Michael A., Deposition over mixed substrates.
  15. Takasu Katsuji,JPX ; Tsuda Hisanori,JPX ; Sano Masafumi,JPX ; Hirai Yutaka,JPX, Device for forming deposited film.
  16. Roger Leung ; Denis Endisch ; Songyuan Xie ; Nigel Hacker ; Yanpei Deng, Dielectric films for narrow gap-fill applications.
  17. Todd, Michael A., Dopant precursors and ion implantation processes.
  18. Lee Ellis,TWX, Dual damascene structure and its manufacturing method.
  19. Stumborg Michael F. ; Santiago Francisco ; Chu Tak Kin ; Boulais Kevin A., Electronic devices with composite atomic barrier film and process for making same.
  20. Stumborg Michael F. ; Santiago Francisco ; Chu Tak Kin ; Boulais Kevin A., Electronic devices with rubidium barrier film and process for making same.
  21. Stumborg Michael F. ; Santiago Francisco ; Chu Tak Kin ; Boulais Kevin A., Electronic devices with strontium barrier film and process for making same.
  22. Brabant,Paul D.; Italiano,Joseph P.; Arena,Chantal J.; Tomasini,Pierre; Raaijmakers,Ivo; Bauer,Matthias, Epitaxial semiconductor deposition methods and structures.
  23. Wang Chein-Cheng,TWX ; Chang Shih-Chanh,TWX, Fabricating method of glue layer and barrier layer.
  24. Michael A. Todd, Fluorine-containing materials and processes.
  25. Fitzgerald, Eugene A.; Hammond, Richard; Currie, Matthew, Gate technology for strained surface channel and strained buried channel MOSFET devices.
  26. Li Yaun-Min ; Bennett Murray S. ; Yang Liyou, Increasing stabilized performance of amorphous silicon based devices produced by highly hydrogen diluted lower temperatu.
  27. Changming Jin ; Kelly J. Taylor ; Wei William Lee, Integrated circuit dielectric and method.
  28. Hoinkis Mark D., Integrated circuits with copper metallization for interconnections.
  29. Pomarede,Christophe F.; Givens,Michael E.; Shero,Eric J.; Todd,Michael A., Integration of high k gate dielectric.
  30. Naoki Komai JP; Shingo Kadomura JP; Mitsuru Taguchi JP; Akira Yoshio JP; Takaaki Miyamoto JP, Interconnection structure and fabrication process therefor.
  31. Huang Richard J. (Milpitas CA) Cheung Robin W. (Cupertino CA) Rakkhit Rajat (Milpitas CA) Lee Raymond T. (Sunnyvale CA), Landing pad technology doubled up as a local interconnect and borderless contact for deep sub-half micrometer IC applica.
  32. Nguyen Tue ; Hsu Sheng Teng, Low resistance contact between integrated circuit metal levels and method for same.
  33. Urabe Koji,JPX, Manufacturing method for contact hole.
  34. Lindert,Nick; Brask,Justin K.; Westmeyer,Andrew, Metal gate transistors with epitaxial source and drain regions.
  35. Iacoponi John A. ; Paton Eric N., Metalorganic decomposition deposition of thin conductive films on integrated circuits using reducing ambient.
  36. Posa John G. (Lake Oswego OR), Method and apparatus for producing a constant flow, constant pressure chemical vapor deposition.
  37. Suntola Tuomo,FIX ; Lindfors Sven,FIX ; Soininen Pekka,FIX, Method and equipment for growing thin films.
  38. Alessandra Satta BE; Karen Maex BE; Kai-Erik Elers FI; Ville Antero Saanila FI; Pekka Juha Soininen FI; Suvi P. Haukka FI, Method for bottomless deposition of barrier layers in integrated circuit metallization schemes.
  39. Kelly Michael A. (121 Erica Way Portola Valley CA 94028), Method for chemical vapor deposition under a single reactor vessel divided into separate reaction chambers each with its.
  40. Tien-I Bao TW; Syun-Ming Jang TW, Method for forming damascene structure employing bi-layer carbon doped silicon nitride/carbon doped silicon oxide etch stop layer.
  41. Kim Yeong-kwan,KRX ; Lee Sang-in,KRX ; Park Chang-soo,KRX ; Kim Young-sun,KRX, Method for forming dielectric film of capacitor having different thicknesses partly.
  42. Logsdon James H. (Kokomo IN) Staller Steven E. (Kokomo IN) De Roo David W. (Carmel IN) Neudeck Gerold W. (West Lafayette IN), Method for forming thin silicon membrane or beam.
  43. Kim Yeong-kwan,KRX ; Lee Sang-in,KRX ; Park Chang-soo,KRX ; Lee Sang-min,KRX, Method for manufacturing thin film using atomic layer deposition.
  44. Suntola Tuomo S. (Espoo FIX) Pakkala Arto J. (Espoo FIX) Lindfors Sven G. (Espoo FIX), Method for performing growth of compound thin films.
  45. Suntola Tuomo (Riihikallio 02610 Espoo 61 SF) Antson Jorma (Urheilutie 22 ; 01350 Vantaa 35 SF), Method for producing compound thin films.
  46. Schafer Herbert,DEX ; Franosch Martin,DEX ; Stengl Reinhard,DEX ; Reisinger Hans,DEX ; Ilg Matthias, Method for the fabrication of a doped silicon layer.
  47. Kang Sang-Bom,KRX ; Lee Sang-In,KRX, Method of and apparatus for forming a metal interconnection in the contact hole of a semiconductor device.
  48. Comita Paul B. ; Forstner Hali J. L. ; Ranganathan Rekha, Method of cleaning CVD cold-wall chamber and exhaust lines.
  49. Sergey D. Lopatin ; Carl Galewski ; Takeshi T. N. Nogami JP, Method of copper interconnect formation using atomic layer copper deposition.
  50. Jing-Cheng Lin TW; Shau-Lin Shue TW; Chen-Hua Yu TW, Method of fabricating barrier adhesion to low-k dielectric layers in a copper damascene process.
  51. Liu Chung-Shi,TWX ; Yu Chen-Hua,TWX, Method of forming a smooth copper seed layer for a copper damascene structure.
  52. Kang Sang-bom,KRX ; Lim Hyun-seok,KRX ; Chae Yung-sook,KRX ; Jeon In-sang,KRX ; Choi Gil-heyun,KRX, Method of forming metal layer using atomic layer deposition and semiconductor device having the metal layer as barrier metal layer or upper or lower electrode of capacitor.
  53. Zhao Bin ; Vasudev Prahalad K. ; Horwath Ronald S. ; Seidel Thomas E. ; Zeitzoff Peter M., Method of making a dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer.
  54. Raaijmakers, Ivo; Haukka, Suvi P.; Saanila, Ville A.; Soininen, Pekka J.; Elers, Kai-Erik; Granneman, Ernst H. A., Method of making conformal lining layers for damascene metallization.
  55. Woo Seock Cheong KR; Hai Won Kim KR, Method of optimizing process of selective epitaxial growth.
  56. Golecki Ilan (Parsippany NJ), Method of producing stoichiometric, epitaxial, monocrystalline films of silicon carbide at temperatures below 900 degree.
  57. Thakur Randhir P. S. ; Breiner Lyle D., Method to form hemi-spherical grain (HSG) silicon.
  58. Wang Fei ; Lyons Christopher F. ; Nguyen Khanh B. ; Bell Scott A. ; Levinson Harry J. ; Yang Chih Yuh, Method using a thin resist mask for dual damascene stop layer etch.
  59. Lochtefeld,Anthony J.; Langdo,Thomas A.; Hammond,Richard; Currie,Matthew T.; Braithwaite,Glyn; Fitzgerald,Eugene A., Methods of forming strained-semiconductor-on-insulator finFET device structures.
  60. Vincent, Jean Louise; O'Neill, Mark Leonard; Withers, Jr., Howard Paul; Beck, Scott Edward; Vrtis, Raymond Nicholas, Organosilicon precursors for interlayer dielectric films with low dielectric constants.
  61. Varhue Walter J., Plasma enhanced CVD process for rapidly growing semiconductor films.
  62. Cheung David ; Yau Wai-Fan ; Mandal Robert P. ; Jeng Shin-Puu ; Liu Kuo-Wei ; Lu Yung-Cheng ; Barnes Michael ; Willecke Ralf B. ; Moghadam Farhad ; Ishikawa Tetsuya ; Poon Tze Wing, Plasma processes for depositing low dielectric constant films.
  63. Rafferty Kevin ; Rowe Bruce, Plural layered metal repair tape.
  64. Gossmann Hans-Joachim Ludwig ; Rafferty Conor Stefan, Process for controlling dopant diffusion in a semiconductor layer and semiconductor device formed thereby.
  65. Todd, Michael A., Process for deposition of semiconductor films.
  66. Todd, Michael A.; Hawkins, Mark, Process for deposition of semiconductor films.
  67. Stumborg Michael F. ; Santiago Francisco ; Chu Tak Kin ; Boulais Kevin A., Process for making a semiconductor device with barrier film formation using a metal halide and products thereof.
  68. Siebert Wolfgang,DEX ; Mayer Erwin-Peter,DEX, Process for the production of an epitaxially coated semiconductor wafer.
  69. Speier John L. (Midland MI), Process for the recovery of hydrogen chloride and monomeric alkoxysilanes from mixtures of chloride-containing silicon c.
  70. Ivo Raaijmakers NL; Pekka T. Soininen FI; Ernst H. A. Granneman NL; Suvi P. Haukka FI, Protective layers prior to alternating layer deposition.
  71. Sneh Ofer, Radical-assisted sequential CVD.
  72. Twu Jih-Churng,TWX ; Jang Syun-Ming,TWX ; Yu Chen-Hua,TWX, Reduction of surface defects on amorphous silicon grown by a low-temperature, high pressure LPCVD process.
  73. Miyamoto Takaaki,JPX, Semiconductor device contains refractory metal or metal silicide with less than 1% weight of halogen atom.
  74. Mee-Young Yoon KR; Sang-In Lee KR; Hyun-Seok Lim KR, Semiconductor device fabrication method using an interface control layer to improve a metal interconnection layer.
  75. Tsuchimoto Junichi (Hyogo JPX), Semiconductor device with arsenic doped silicon thin film interconnections or electrodes.
  76. Ping Er-Xang ; Thakur Randhir P. S., Semiconductor processing method of providing a doped polysilicon layer.
  77. Murthy, Anand S.; Doyle, Brian S.; Roberds, Brian E., Semiconductor transistor having a backfilled channel material.
  78. Sherman Arthur, Sequential chemical vapor deposition.
  79. Hidetoshi Odaka JP; Yuka Kanamori JP; Hiroshi Ito JP; Hideharu Jyono JP; Hiroshi Iwakiri JP; Fumio Kawakubo JP, Silane-functionalized polyether composition.
  80. Rathore Hazara S. ; Dalal Hormazdyar M. ; McLaughlin Paul S. ; Nguyen Du B. ; Smith Richard G. ; Swinton Alexander J. ; Wachnik Richard A., Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity.
  81. Todd, Michael A.; Raaijmakers, Ivo, Thin films and method of making them.
  82. Gadgil Prasad N. ; Seidel Thomas E., Vertically-stacked process reactor and cluster tool system for atomic layer deposition.
  83. Izumi Hirohiko (Sagamihara JPX), .

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  7. Clark, Lawrence T.; McGregor, Michael S.; Rogenmoser, Robert; Kidd, David A.; Kuo, Augustine, Body bias circuits and methods.
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  9. Bakhishev, Teymur; Wang, Lingquan; Zhao, Dalong; Ranade, Pushkar; Thompson, Scott E., Buried channel deeply depleted channel transistor.
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  12. Hoffmann, Thomas; Ranade, Pushkar; Thompson, Scott E., CMOS gate stack structures and processes.
  13. Hoffmann, Thomas; Thompson, Scott E.; Ranade, Pushkar, CMOS gate stack structures and processes.
  14. Thompson, Scott E.; Hoffmann, Thomas; Scudder, Lance; Sridharan, U. C.; Zhao, Dalong; Ranade, Pushkar; Duane, Michael; Gregory, Paul E., CMOS structures and processes based on selective thinning.
  15. Thompson, Scott E.; Hoffmann, Thomas; Scudder, Lance; Sridharan, Urupattur C.; Zhao, Dalong; Ranade, Pushkar; Duane, Michael; Gregory, Paul, CMOS structures and processes based on selective thinning.
  16. Clark, Lawrence T.; McWilliams, Bruce; Rogenmoser, Robert, Circuit devices and methods having adjustable transistor body bias.
  17. Lee, Sang-Soo; Boling, Edward J.; Kuo, Augustine; Rogenmoser, Robert, Circuits and devices for generating bi-directional body bias voltages, and methods therefor.
  18. Clark, Lawrence T; Roy, Richard S, Circuits and methods for measuring circuit elements in an integrated circuit device.
  19. Hoffmann, Thomas; Shifren, Lucian; Thompson, Scott E.; Ranade, Pushkar; Wang, Jing; Gregory, Paul E.; Sonkusale, Sachin R.; Scudder, Lance; Zhao, Dalong; Bakhishev, Teymur; Liu, Yujie; Wang, Lingquan; Zhang, Weimin; Pradhan, Sameer; Duane, Michael; Kim, Sung Hwan, Deeply depleted MOS transistors having a screening layer and methods thereof.
  20. Thompson, Scott E.; Clark, Lawrence T., Digital circuits having improved transistors, and methods therefor.
  21. Thompson, Scott E.; Clark, Lawrence T., Digital circuits having improved transistors, and methods therefor.
  22. Thompson, Scott E.; Clark, Lawrence T., Digital circuits having improved transistors, and methods therefor.
  23. Thompson, Scott E.; Clark, Lawrence T., Digital circuits having improved transistors, and methods therefor.
  24. Thompson, Scott E.; Clark, Lawrence T., Digital circuits having improved transistors, and methods therefor.
  25. Thompson, Scott E.; Clark, Lawrence T., Digital circuits having improved transistors, and methods therefor.
  26. Clark, Lawrence T.; Shifren, Lucian; Roy, Richard S., Dynamic random access memory (DRAM) with low variation transistor peripheral circuits.
  27. Shifren, Lucian; Ranade, Pushkar, Electronic device with controlled threshold voltage.
  28. Shifren, Lucian; Ranade, Pushkar, Electronic device with controlled threshold voltage.
  29. Thompson, Scott E.; Thummalapally, Damodar R., Electronic devices and systems, and methods for making and using same.
  30. Thompson, Scott E.; Thummalapally, Damodar R., Electronic devices and systems, and methods for making and using the same.
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  32. Liao, Chin-I; Chen, Chun-Yu, Epitaxial structure and process thereof for non-planar transistor.
  33. Hokazono, Akira, FinFET comprising a punch-through stopper.
  34. Bauer, Matthias; Gossmann, Hans-Joachim Ludwig; Colombeau, Benjamin, Forming non-line-of-sight source drain extension in an nMOS finFET using n-doped selective epitaxial growth.
  35. Thompson, Scott E.; Shifren, Lucian; Ranade, Pushkar; Liu, Yujie; Kim, Sung Hwan; Wang, Lingquan; Zhao, Dalong; Bakhishev, Teymur; Hoffmann, Thomas; Pradhan, Sameer; Duane, Michael, High uniformity screen and epitaxial layers for CMOS devices.
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  38. Clark, Lawrence T.; Thompson, Scott E.; Roy, Richard S.; Rogenmoser, Robert; Thummalapally, Damodar R., Integrated circuit devices and methods.
  39. Clark, Lawrence T.; Thompson, Scott E.; Roy, Richard S.; Rogenmoser, Robert; Thummalapally, Damodar R., Integrated circuit devices and methods.
  40. Clark, Lawrence T.; Thompson, Scott E.; Roy, Richard S.; Rogenmoser, Robert; Thummalapally, Damodar R., Integrated circuit devices and methods.
  41. Clark, Lawrence T.; Kidd, David A.; Chen, Chao-Wu, Integrated circuit process and bias monitors and related methods.
  42. Clark, Lawrence T.; Kidd, David A.; Chen, Chao-Wu, Integrated circuit process and bias monitors and related methods.
  43. Zhao, Dalong; Ranade, Pushkar; McWilliams, Bruce, Integrated circuits having a plurality of high-K metal gate FETs with various combinations of channel foundation structure and gate stack structure and methods of making same.
  44. Zhao, Dalong; Ranade, Pushkar; McWilliams, Bruce, Integrated circuits having a plurality of high-K metal gate FETs with various combinations of channel foundation structure and gate stack structure and methods of making same.
  45. Shifren, Lucian; Ranade, Pushkar; Thompson, Scott E.; Sonkusale, Sachin R.; Zhang, Weimin, Low power semiconductor transistor structure and method of fabrication thereof.
  46. Shifren, Lucian; Ranade, Pushkar; Thompson, Scott E.; Sonkusale, Sachin R.; Zhang, Weimin, Low power semiconductor transistor structure and method of fabrication thereof.
  47. Shifren, Lucian; Ranade, Pushkar; Thompson, Scott E.; Sonkusale, Sachrin R.; Zhang, Weimin, Low power semiconductor transistor structure and method of fabrication thereof.
  48. Brabant, Paul D.; Chung, Keith; He, Hong; Sadana, Devendra K.; Shinriki, Manabu, Low temperature epitaxy of a semiconductor alloy including silicon and germanium employing a high order silane precursor.
  49. Clark, Lawrence T.; Leshner, Samuel, Memory circuits and methods of making and designing the same.
  50. Bakhishev, Teymur; Pradhan, Sameer; Hoffmann, Thomas; Sonkusale, Sachin R., Method for fabricating a transistor device with a tuned dopant profile.
  51. Bakhishev, Teymur; Pradhan, Sameer; Hoffmann, Thomas; Sonkusale, Sachin R., Method for fabricating a transistor device with a tuned dopant profile.
  52. Bakhishev, Teymur; Pradhan, Sameer; Hoffmann, Thomas; Sonkusale, Sachin R., Method for fabricating a transistor device with a tuned dopant profile.
  53. Thompson, Scott E.; Shifren, Lucian; Ranade, Pushkar; Liu, Yujie; Kim, Sung Hwan; Wang, Lingquan; Zhao, Dalong; Bakhishev, Teymur; Hoffmann, Thomas; Pradhan, Sameer; Duane, Michael, Method for fabricating a transistor with reduced junction leakage current.
  54. Shifren, Lucian; Ranade, Pushkar; Hoffmann, Thomas; Thompson, Scott E., Method for fabricating multiple transistor devices on a substrate with varying threshold voltages.
  55. Moriya, Atsushi; Nakaiso, Naoharu; Orihashi, Yugo; Murakami, Kotaro, Method of forming silicon layer in manufacturing semiconductor device and recording medium.
  56. Moriya, Atsushi; Nakaiso, Naoharu; Orihashi, Yugo; Murakami, Kotaro, Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium.
  57. Moriya, Atsushi; Nakaiso, Naoharu; Orihashi, Yugo; Murakami, Kotaro, Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium.
  58. Moriya, Atsushi; Nakaiso, Naoharu; Orihashi, Yugo; Murakami, Kotaro, Method of manufacturing semiconductor device, substrate processing apparatus, gas supply system, and recording medium.
  59. Thompson, Scott E.; Ranade, Pushkar; Scudder, Lance; Stager, Charles, Monitoring and measurement of thin film layers.
  60. Hoffmann, Thomas; Ranade, Pushkar; Shifren, Lucian; Thompson, Scott E., Multiple transistor types formed in a common epitaxial layer by differential out-diffusion from a doped underlayer.
  61. Hoffmann, Thomas; Ranade, Pushkar; Shifren, Lucian; Thompson, Scott E., Multiple transistor types formed in a common epitaxial layer by differential out-diffusion from a doped underlayer.
  62. Hoffmann, Thomas; Ranade, Pushkar; Shifren, Lucian; Thompson, Scott E., Multiple transistor types formed in a common epitaxial layer by differential out-diffusion from a doped underlayer.
  63. Kuo, Augustine, Operational amplifier input offset correction with transistor threshold voltage adjustment.
  64. Clark, Lawrence T.; Thompson, Scott E.; Roy, Richard S.; Leshner, Samuel, Porting a circuit design from a first semiconductor process to a second semiconductor process.
  65. Clark, Lawrence T.; Thompson, Scott E.; Roy, Richard S.; Leshner, Samuel, Porting a circuit design from a first semiconductor process to a second semiconductor process.
  66. Clark, Lawrence T.; Thompson, Scott E.; Roy, Richard S.; Leshner, Samuel, Porting a circuit design from a first semiconductor process to a second semiconductor process.
  67. Boling, Edward J., Power up body bias circuits and methods.
  68. Thompson, Scott E.; Shifren, Lucian; Ranade, Pushkar; Scudder, Lance; Zhao, Dalong; Bakhisher, Teymur; Pradhan, Sameer, Process for manufacture of integrated circuits with different channel doping transistor architectures and devices therefrom.
  69. Shifren, Lucian; Thompson, Scott E.; Gregory, Paul E., Process for manufacturing an improved analog transistor.
  70. Scudder, Lance S.; Ranade, Pushkar; Stager, Charles; Sridharan, Urupattur C.; Zhao, Dalong, Reducing or eliminating pre-amorphization in transistor manufacture.
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  72. Scudder, Lance; Ranade, Pushkar; Stager, Charles; Sridharan, Urupattur C.; Zhao, Dalong, Reducing or eliminating pre-amorphization in transistor manufacture.
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  77. Shifren, Lucian; Ranade, Pushkar; Sonkusale, Sachin R., Semiconductor structure and method of fabrication thereof with mixed metal types.
  78. Shifren, Lucian; Ranade, Pushkar; Sonkusale, Sachin R., Semiconductor structure and method of fabrication thereof with mixed metal types.
  79. Gregory, Paul E.; Ranade, Pushkar; Shifren, Lucian, Semiconductor structure with improved channel stack and method for fabrication thereof.
  80. Gregory, Paul E.; Shifren, Lucian; Ranade, Pushkar, Semiconductor structure with improved channel stack and method for fabrication thereof.
  81. Zhao, Dalong; Bakhishev, Teymur; Scudder, Lance; Gregory, Paul E.; Duane, Michael; Sridharan, U. C.; Ranade, Pushkar; Shifren, Lucian; Hoffmann, Thomas, Semiconductor structure with multiple transistors having various threshold voltages.
  82. Zhao, Dalong; Bakhishev, Teymur; Scudder, Lance; Gregory, Paul E.; Duane, Michael; Sridharan, U. C.; Ranade, Pushkar; Shifren, Lucian; Hoffmann, Thomas, Semiconductor structure with multiple transistors having various threshold voltages.
  83. Zhao, Dalong; Bakhishev, Teymur; Scudder, Lance; Gregory, Paul E.; Duane, Michael; Sridharan, U. C.; Ranade, Pushkar; Shifren, Lucian; Hoffmann, Thomas, Semiconductor structure with multiple transistors having various threshold voltages.
  84. Zhao, Dalong; Bakhishev, Teymur; Scudder, Lance; Gregory, Paul E.; Duane, Michael; Sridharan, U. C.; Ranade, Pushkar; Shifren, Lucian; Hoffmann, Thomas, Semiconductor structure with multiple transistors having various threshold voltages.
  85. Wang, Lingquan; Bakhishev, Teymur; Zhao, Dalong; Ranade, Pushkar; Pradhan, Sameer; Hoffmann, Thomas; Shifren, Lucian; Scudder, Lance, Semiconductor structure with reduced junction leakage and method of fabrication thereof.
  86. Wang, Lingquan; Bakhishev, Teymur; Zhao, Dalong; Ranade, Pushkar; Pradhan, Sameer; Hoffmann, Thomas; Shifren, Lucian; Scudder, Lance, Semiconductor structure with reduced junction leakage and method of fabrication thereof.
  87. Scudder, Lance; Ranade, Pushkar; Stager, Charles; Shifren, Lucian; Zhao, Dalong; Sridharan, U.C.; Duane, Michael, Semiconductor structure with substitutional boron and method for fabrication thereof.
  88. Kidd, David A.; Boling, Edward J.; Agrawal, Vineet; Leshner, Samuel; Kuo, Augustine; Lee, Sang-Soo; Chen, Chao-Wu, Slew based process and bias monitors and related methods.
  89. Kidd, David A.; Boling, Edward J.; Agrawal, Vineet; Leshner, Samuel; Kuo, Augustine; Lee, Sang-Soo; Chen, Chao-Wu, Slew based process and bias monitors and related methods.
  90. Ranade, Pushkar; Shifren, Lucian; Sonkusale, Sachin R., Source/drain extension control for advanced transistors.
  91. Ranade, Pushkar; Shifren, Lucian; Sonkusale, Sachin R., Source/drain extension control for advanced transistors.
  92. Ranade, Pushkar; Shifren, Lucian; Sonkusale, Sachin R., Source/drain extension control for advanced transistors.
  93. Ranade, Pushkar; Shifren, Lucian; Sonkusale, Sachin R., Source/drain extension control for advanced transistors.
  94. Moriya, Atsushi; Nakaiso, Naoharu; Orihashi, Yugo; Murakami, Kotaro, Substrate processing apparatus, apparatus for manufacturing semiconductor device, and gas supply system.
  95. Kidd, David A., Tipless transistors, short-tip transistors, and methods and circuits therefor.
  96. Clark, Lawrence T.; Leshner, Samuel, Tools and methods for yield-aware semiconductor manufacturing process target generation.
  97. Thompson, Scott E.; Shifren, Lucian; Ranade, Pushkar; Liu, Yujie; Kim, Sung Hwan; Wang, Lingquan; Zhao, Dalong; Bakhishev, Teymur; Hoffmann, Thomas; Pradhan, Sameer; Duane, Michael, Transistor having reduced junction leakage and methods of forming thereof.
  98. Arghavani, Reza; Ranade, Pushkar; Shifren, Lucian; Thompson, Scott E.; de Villeneuve, Catherine, Transistor with threshold voltage set notch and method of fabrication thereof.
  99. Arghavani, Reza; Ranade, Pushkar; Shifren, Lucian; Thompson, Scott E.; de Villeneuve, Catherine, Transistor with threshold voltage set notch and method of fabrication thereof.
  100. Arghavani, Reza; Ranade, Pushkar; Shifren, Lucian; Thompson, Scott E.; de Villeneuve, Catherine, Transistor with threshold voltage set notch and method of fabrication thereof.
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