[특허]Method for coating substrates

[미국특허] Method for coating substrates 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B05D-005/12
출원번호	US-0883420 (2004-06-30)
등록번호	US7867565 (2010-12-28)
발명자 / 주소	Fyen, Wim Mertens, Paul W.
출원인 / 주소	IMEC
대리인 / 주소	Hulbert & Berghoff LLP
인용정보	피인용 횟수 : 0 인용 특허 : 35

초록 ▼

A method for depositing a coating layer on at least a part of a surface of a substrate is described. The method includes supplying a coating substance to at least part of a surface of a substrate. The substrate is subjected to a relative movement with respect to a source of the coating substance. The surface tension of the coating substance is modified, at least locally, at least part of the time while the at least part of the substrate is subjected to the movement. A thickness of the coating layer is influenced by modifying the surface tension of the coating substance.

대표청구항 ▼

The invention claimed is: 1. A method for depositing a coating layer on at least part of a surface of a substrate comprising the steps of:applying a coating substance to the at least part of the surface of the substrate to form a deposited coating layer, such that the deposited coating layer, the coating substance, and a gas phase intersect at a three-phase region;subjecting the substrate to a relative movement with respect to a source of the coating substance, andat least part of the time while subjecting the substrate to the movement, controlling the thickness of the deposited coating layer by generating a surface tension gradient between (i) a first point of the coating substance at the three-phase region and (ii) a second point of the coating substance by delivering isopropyl alcohol to the coating substance at the three-phase region.

이 특허에 인용된 특허 (35) 인용/피인용 타임라인 분석

Kottman Rickie A. (Dallas TX) Terrill Robert E. (Carrollton TX) Wise Ann E. (Dallas TX), Apparatus and method for edge cleaning.
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Lee Je-cheol,KRX ; Kim Byung-jin,KRX, Apparatus for cleaning semiconductor wafers.
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Rushford, Michael C.; Britten, Jerald A., Apparatus for etching or depositing a desired profile onto a surface.
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Kanke,Shin, Coating apparatus and method having a slide bead coater and liquid drop applicator.
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Moon, Alice G.; Joos, F. Miguel; Pitt, Alan R., Coating method with improved coating uniformity by choice of surfactant composition.
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Tateyama Kiyohisa (Kumamoto JPX) Matsushita Michiaki (Yatsushiro JPX), Device having brush for scrubbing substrate.
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Kuriyama Kazumi (Yamanashi JPX), Fluid supplying and processing device.
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Crowe Lawrence E., Heat exchanger for high power electrical component and package incorporating same.
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Timson ; William J., Manipulation of coating streams with air foils.
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Buker Edward D. ; Conrad Edward W. ; Leas James M., Metal removal cleaning process and apparatus.
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Hess Harald,DEX ; Henssler Joachim,DEX ; Trefz Michael,DEX ; Kohl Bernhard,DEX ; Madrzak Zygmunt,DEX ; Munch Rudolf,DEX, Method and an apparatus for the application of a liquid or pasty medium onto a moving material web.
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Shortes Samuel R. (Plano TX) Millis Edwin Graham (Dallas TX), Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water.
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Bunkofske Raymond James, Method and apparatus for coating a semiconductor wafer.
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Mertens, Paul; Meuris, Marc; Heyns, Marc, Method and apparatus for localized liquid treatment of the surface of a substrate.
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Paul Mertens BE; Marc Meuris BE; Marc Heyns BE, Method and apparatus for localized liquid treatment of the surface of a substrate.
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Mertens, Paul; Meuris, Marc; Heyns, Marc, Method and apparatus for removing a liquid from a surface.
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Paul Mertens BE; Marc Meuris BE; Marc Heyns BE, Method and apparatus for removing a liquid from a surface.
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Mertens, Paul; Meuris, Mark; Heyns, Marc, Method and apparatus for removing a liquid from a surface of a rotating substrate.
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Paul Mertens BE; Mark Meuris BE; Marc Heyns BE, Method and apparatus for removing a liquid from a surface of a rotating substrate.
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Nishizawa Hisao (Shiga JPX) Morita Masaru (Minami JPX) Tanaka Masato (Nagahama JPX), Method and apparatus for surface treating of substrates.
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Kawasaki Shinji,JPX, Method for cleaning a semiconductor wafer.
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Mathuni Josef,DEX, Method for etching damaged zones on an edge of a semiconductor substrate, and etching system.
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Goppert-Berarducci Kim E. ; Higgins Eugene P., Method for predicting coatability.
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Davlin, John T.; Schramm, Douglas S.; Mitson, Lorna M., Method for pretreating a substrate prior to application of a polymeric coat.
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Leenaars Adriaan F. M. (Eindhoven NLX) Huethorst Johanna A. M. (Eindhoven NLX) Marra Johannes (Eindhoven NLX), Method for removing in a centrifuge a liquid from a surface of a substrate.
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Yamasaka Miyako,JPX, Method for washing and drying substrates.
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Kunze-Concewitz Horst,DEX, Method of cleaning surfaces with water and steam.
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Tanaka Masato (Shiga JPX), Method of treating surface of rotating wafer using surface treating gas.
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Thompson Raymon F. ; Owczarz Aleksander, Methods for centrifugally cleaning wafer carriers.
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Britten Jerald A. (Oakley CA), Moving zone Marangoni drying of wet objects using naturally evaporated solvent vapor.
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Shimkunas Alexander R. (Palo Alto CA), Process for making a mask used in x-ray photolithography.
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Whitman, John, Solvent prewet and method to dispense the solvent prewet.
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Williams, Joel Lane; Soudelier, Earl; Marshall, Donald M.; Mafoti, Robson, System and method for two sided sheet treating.
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Kanno Itaru,JPX, Wafer cleaning apparatus.
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Hamada Satomi,JPX ; Maekawa Toshiro,JPX, Washing method and washing apparatus.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Method for coating substrates 원문보기