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Multichannel cooling system with magnetohydrodynamic pump 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0399209 (2006-04-06)
등록번호 US7870893 (2011-01-03)
발명자 / 주소
  • Ouyang, Chien
  • Gross, Kenneth C.
출원인 / 주소
  • Oracle America, Inc.
대리인 / 주소
    Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C.
인용정보 피인용 횟수 : 8  인용 특허 : 42

초록

A cooling device includes a base having cells. A pipe is coupled to the base for each of the cells. The pipes include passages that carry fluid toward the cell and away from the cell. A magnetohydrodynamic pump system coupled to the pipe circulates an electrically conductive cooling fluid within the

대표청구항

What is claimed is: 1. A cooling device, comprising:a base configured to couple with an electronic device, the base comprising at least one cell;at least one pipe coupled to the base, the at least one pipe comprising a first passage in fluid communication with the at least one cell and a second pas

이 특허에 인용된 특허 (42)

  1. Novotny, Shlomo; Dunn, John; Vogel, Marlin, Active temperature gradient reducer.
  2. Law, Jonathan Michael; Harley, Nigel Henry, Active thermal management of semiconductor devices.
  3. Erturk, Hakan; Sauciuc, Ioan; Unrein, Edgar J., Apparatus and method for cooling integrated circuit devices.
  4. Chu Richard C. (Poughkeepsie NY) Goth Gary F. (Pleasant Valley NY) Messina Gaetano P. (Hopewell Junction NY) Moran Kevin P. (Wappingers Falls NY) Zumbrunnen Michael L. (Poughkeepsie NY), Cooling by use of multiple parallel convective surfaces.
  5. Conte Alfred S. (Hollister CA), Cooling multi-chip modules using embedded heat pipes.
  6. Ghoshal, Uttam; Miner, Andrew Carl, Cooling of electronics by electrically conducting fluids.
  7. Ghoshal, Uttam; Miner, Andrew Carl, Cooling of high power density devices by electrically conducting fluids.
  8. Cardella Mark A., Cooling system and method of cooling electronic devices.
  9. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Dehumidified cooling assembly for IC chip modules.
  10. Gross, Kenny C.; Wargo, Peter L., Detecting thermal anomalies in computer systems based on correlations between instrumentation signals.
  11. Shaam P. Sundhar, Direct current mini air conditioning system.
  12. Yoshikawa Norio (Minamimachi JPX) Hotta Tadaaki (Kyoto JPX), Discrete time control apparatus.
  13. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  14. Dautartas, Mindaugas F.; Freund, Joseph M.; Przybylek, George J., Flexible semiconductor device support with integrated thermoelectric cooler and method for making same.
  15. Macris, Chris, Heat dissipating IC devices.
  16. Bhatia,Rakesh, Integrated circuit cooling apparatus and method.
  17. Pomerene, Andrew T. S.; McIntyre, Thomas J., Integrated circuit device having a built-in thermoelectric cooling mechanism.
  18. Pomerene, Andrew T. S.; McIntyre, Thomas J., Integrated circuit device having a built-in thermoelectric cooling mechanism.
  19. Mansuria Mohanlal S. (Coral Springs FL) Mosley Joseph M. (Boca Raton FL) Musa Richard D. (Boca Raton FL) Shutler William F. (Wappingers Falls NY) Tuozzolo Vito J. (Boca Raton FL), Integrated thermoelectric cooling.
  20. Kitano,Makoto; Naganawa,Takashi; Yoshitomi,Yuji; Minamitani,Rintaro; Ohashi,Shigeo; Ashiwake,Noriyuki; Kondo,Yoshihiro; Nakagawa,Tsuyoshi, Liquid cooling system and personal computer using thereof.
  21. Bhatia Rakesh ; Padilla Robert D. ; Hermerding ; II James G., Method and apparatus for cooling integrated circuits using a thermoelectric module.
  22. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
  23. Gross,Kenny C.; Votta, Jr.,Larry G., Method and apparatus for monitoring and recording computer system performance parameters.
  24. Gross,Kenneth C.; Rosa,Eugenio J. Schuster, Method and apparatus for validating sensor operability in a computer system.
  25. Kimura Yuichi,JPX ; Yamamoto Masaaki,JPX ; Tanaka Suemi,JPX, Method for manufacturing cooling unit comprising heat pipes and cooling unit.
  26. Zeighami,Roy; Belady,Christian L., Method of cooling semiconductor die using microchannel thermosyphon.
  27. Tonkovich,Anna Lee; Roberts,Gary; Fitzgerald,Sean P.; Werner,Timothy M.; Schmidt,Matthew B.; Luzenski,Robert J.; Chadwell,G. Bradley; Mathias,James A.; Gupta,Abhishek; Kuhlmann,David J.; Yuschak,Thom, Microchannel apparatus, methods of making microchannel apparatus, and processes of conducting unit operations.
  28. Walpole James N. (Concord MA) Missaggia Leo J. (Milford MA), Microchannel heat sink with alternating flow directions.
  29. Uttam Shyamalindu Ghoshal, Mixed thermoelectric cooling apparatus and method.
  30. Mundinger David C. ; Worland D. Philip, Modular microchannel heat exchanger.
  31. Jacques Laliberte CA, Modular thermoelectric unit and cooling system using same.
  32. Bhatia Rakesh, Package with integrated thermoelectric module for cooling of integrated circuits.
  33. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Spot cooling evaporator cooling system for integrated circuit chip modules.
  34. Treusch,Hans Georg; Srinivasan,Raman, Stepped manifold array of microchannel heat sinks.
  35. Williams,Emrys J.; Gross,Kenneth C., Symbiotic interrupt/polling approach for monitoring physical sensors.
  36. McLean Thomas (Los Angeles County) Moore Gregory S. (Los Angeles County CA), Temperature controlled laser diode package.
  37. Tousson Eliahou, Temperature self-regulated integrated circuits and devices.
  38. Ouyang,Chien, Thermoelectric cooling device arrays.
  39. Iwata Yuji,JPX ; Sasa Noriyasu,JPX, Thermoelectric cooling module and method for manufacturing the same.
  40. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Thermoelectric-enhanced heat spreader for heat generating component of an electronic device.
  41. Prasher, Ravi; Mahajan, Ravi, Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink.
  42. Hara Shinichi (Yokohama JPX) Sakamoto Eiji (Sagamihara JPX) Ebinuma Ryuichi (Machida JPX), Wafer holding device in an exposure apparatus.

이 특허를 인용한 특허 (8)

  1. Ouyang, Chien, Enhanced heat pipe cooling with MHD fluid flow.
  2. Canney, Brian A.; Karrat, Wally; Lehman, Bret W.; Molloy, Christopher L., Free cooling solution for a containerized data center.
  3. Mowry, Anthony C.; Farber, David G.; Austin, Michael J.; Moore, John E., Heat management using power management information.
  4. Ouyang, Chien; Gross, Kenny C.; Heydari, Ali, Integrated circuit chip cooling using magnetohydrodynamics and recycled power.
  5. Glew, Andrew F.; Hyde, Roderick A.; Kare, Jordin T.; Wood, Jr., Lowell L., Microchannel heat transfer with liquid metals.
  6. Brunschwiler, Thomas; Kursun, Eren; Maier, Gary W, Optimizing heat transfer in 3-D chip-stacks.
  7. Ghadiri Moghaddam, Davood; LePoudre, Philip Paul; Gerber, Manfred, Systems and methods for managing conditions in enclosed space.
  8. Ahuja, Sandeep; Sauciuc, Ioan; Smith, Susan F., Transient thermal management systems for semiconductor devices.
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