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High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed conne

High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

대표청구항 ▼

What is claimed is: 1. An electrical connector system for mounting a substrate, the system comprising:a plurality of electrical contact assemblies, each electrical contact assembly comprising:a plurality of electrical contacts, each electrical contact defining a length direction, the electrical cont

What is claimed is: 1. An electrical connector system for mounting a substrate, the system comprising:a plurality of electrical contact assemblies, each electrical contact assembly comprising:a plurality of electrical contacts, each electrical contact defining a length direction, the electrical contacts of the plurality of electrical contacts arranged in a substantially parallel relationship to one another; anda plurality of insulated sections positioned along the length direction of the plurality of electrical contacts to hold the plurality of electrical contacts in the substantially parallel relationship, wherein the insulated sections of the plurality of insulated sections are spaced apart from one another along the length of the plurality of electrical contacts;wherein the spacing between the plurality of insulated sections permits each electrical contact assembly to be bent between insulated sections in a desired configuration;a plurality of housing segments comprising a plurality of electrical contact channels, each electrical contact channel comprising a conductive surface and adapted to receive at least a pair of electrical contacts of an electrical contact assembly; anda matrix of rows and columns of electrical contacts of the plurality of electrical contact assemblies, the matrix at least at a mating end of the electrical connector, the rows of electrical contacts lying substantially parallel to a plane of the substrate;wherein a housing segment of the plurality of housing segments and associated electrical contact assemblies of the plurality of electrical assemblies form a row of the matrix of electrical contacts at the mating end of the connector;wherein multiple housing segments are shaped to form the matrix of electrical contacts when assembled adjacent to one another; andwherein the electrical contact channels of the plurality of contact channels electrically isolate pairs of electrical contacts from other pairs of electrical contacts in the matrix.