초록 ▼

A method and system for fabricating an integral electromagnetic radiation shield for an electronic package is disclosed. Various embodiments include exposing a portion of at least one ground contact feature in an electronic package by removing a portion of the electronic package above the at least o

A method and system for fabricating an integral electromagnetic radiation shield for an electronic package is disclosed. Various embodiments include exposing a portion of at least one ground contact feature in an electronic package by removing a portion of the electronic package above the at least one ground contact feature to form at least one trench above the at least one ground contact feature; depositing electromagnetic radiation shield material in the at least one trench to substantially fill the at least one trench with a trench deposit; and depositing additional electromagnetic radiation shield material over a substantial portion of the electronic package, wherein the electromagnetic radiation shield material in the trench and over the substantial portion of the electronic package form an integral electromagnetic radiation shield which is electrically connected to the at least one ground contact feature.

대표청구항 ▼

The invention claimed is: 1. A method comprising:exposing a portion of at least one ground contact feature in an electronic package, the electronic package located on a substrate and having a first portion located above the at least one ground contact feature and a second portion located directly on

The invention claimed is: 1. A method comprising:exposing a portion of at least one ground contact feature in an electronic package, the electronic package located on a substrate and having a first portion located above the at least one ground contact feature and a second portion located directly on the substrate, wherein the exposing comprises removing the first portion of the electronic package form at least one trench above the at least one ground contact feature;depositing electromagnetic radiation shield material in the at least one trench to form a substantially filled the at least one trench; anddepositing additional electromagnetic radiation shield material portion on top of the at least one substantially filled trench and on top of the second portion of the electronic package to form an integral electromagnetic radiation shield which is electrically connected to the at least one ground contact feature.