초록 ▼

In one embodiment, an apparatus includes a phase change material, a plurality of particles intermixed with the phase change material, and a conductive structure encapsulating the phase change material. The conductive structure includes a cavity including a cone shape. In one embodiment, a method inc

In one embodiment, an apparatus includes a phase change material, a plurality of particles intermixed with the phase change material, and a conductive structure encapsulating the phase change material. The conductive structure includes a cavity including a cone shape. In one embodiment, a method includes forming a conductive structure having a cavity, injecting a phase change material into the cavity, injecting a plurality of spheres into the cavity, and sealing the cavity.

대표청구항 ▼

What is claimed is: 1. An apparatus comprising:a phase change material;a plurality of particles intermixed with the phase change material; anda thermally conductive body encapsulating the phase change material within a cavity, the cavity formed from a pair of substantially identical, symmetrical hal

What is claimed is: 1. An apparatus comprising:a phase change material;a plurality of particles intermixed with the phase change material; anda thermally conductive body encapsulating the phase change material within a cavity, the cavity formed from a pair of substantially identical, symmetrical halves of the conductive body coupled together, the cavity including first and second cavity surfaces, the first cavity surface being disposed along an upper side of the cavity and including a cone shape and the second cavity surface being disposed along a lower side of the cavity and including a sloping surface, the first cavity surface being oppositely disposed from the second cavity surface, each of the first and second cavity surfaces being configured to enhance formation of convection currents within the cavity during operation of an integrated circuit die, the conductive body including an upper finned first external surface and a lower second external surface configured to thermally couple the conductive body to a surface of the integrated circuit die.