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[미국특허] Electrical contactor, especially wafer level contactor, using fluid pressure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-004/60
출원번호 US-0783379 (2010-05-19)
등록번호 US7967621 (2011-06-15)
발명자 / 주소
  • Eldridge, Benjamin N.
출원인 / 주소
  • FormFactor, Inc.
대리인 / 주소
    Kirton & McConkie
인용정보 피인용 횟수 : 4  인용 특허 : 102

초록 ▼

An electrical interconnect assembly and methods for making an electrical interconnect assembly. In one embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact elements and a fluid containing structure which is coupled to the flexible wiring layer. Th

대표청구항 ▼

What is claimed is: 1. An interconnect assembly comprising:a wiring layer having first contact elements;a flexible layer configured to hold a device under test such that second contact elements of said device under test are disposed adjacent to but spaced apart from said first contact elements; anda

이 특허에 인용된 특허 (102) 인용/피인용 타임라인 분석

  1. D\Souza Daniel B. (Santa Clara County CA), Active probe card.
    상세보기
  2. Cherry Robert S. (Redondo Beach CA), Active probe card for high resolution/low noise wafer level testing.
    상세보기
  3. Driller Hubert (Schmitten DEX) Mang Paul (Schmitten DEX), Adapter arrangement for electrically connecting flat wire carriers.
    상세보기
  4. Littlebury Hugh W. (Chandler AZ) Simmons Marion I. (Tempe AZ), Apparatus and method for burning in integrated circuit wafers.
    상세보기
  5. Dean Anthony James (Congleton EN), Apparatus for testing printed circuit boards.
    상세보기
  6. Yojima Masayuki,JPX ; Tsujide Tohru,JPX ; Nakaizumi Kazuo,JPX, Apparatus for testing semiconductor wafer.
    상세보기
  7. Grabbe Dimitry G. (Middletown PA), Area array connector.
    상세보기
  8. Pedder David John,GBX, Bare die testing.
    상세보기
  9. Ohkubo Masao (Tokyo JPX) Yoshimitsu Yasuro (Tokyo JPX), Complex probe card for testing a semiconductor wafer.
    상세보기
  10. Okubo Masao (Tokyo JPX) Yoshimitsu Yasuro (Tokyo JPX), Complex probe card for testing a semiconductor wafer.
    상세보기
  11. Kwon Oh-Kyong (Richardson TX) Malhi Satwinder (Garland TX) Hashimoto Masahi (Garland TX), Compliant contact pad.
    상세보기
  12. Benjamin N. Eldridge ; Igor Y. Khandros ; David V. Pedersen ; Ralph G. Whitten, Concurrent design and subsequent partitioning of product and test die.
    상세보기
  13. Cutchaw John M. (Scottsdale AZ), Connector for integrated circuit packages.
    상세보기
  14. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L. ; Dozier Thomas H. ; Smith William D., Contact carriers (tiles) for populating larger substrates with spring contacts.
    상세보기
  15. Junichi Hagihara JP; Shinji Iino JP, Contactor and production method for contractor.
    상세보기
  16. Golla Naidu G. (Austin TX), Debug apparatus for an automated semiconductor testing system.
    상세보기
  17. Nolan Steven ; Bartilson Bradley W. ; Kunkel Ronald, Demateable, compliant, area array interconnect.
    상세보기
  18. Crowley Richard N. (Aloha OR), Driven guard probe card.
    상세보기
  19. Kister January, Dual contact probe assembly for testing integrated circuits.
    상세보기
  20. Benjamin N. Eldridge, Electrical contactor especially wafer level contactor using fluid pressure.
    상세보기
  21. Eldridge,Benjamin N., Electrical contactor, especially wafer level contactor, using fluid pressure.
    상세보기
  22. Eldridge,Benjamin N., Electrical contactor, especially wafer level contactor, using fluid pressure.
    상세보기
  23. Loranger J. Albert ; Chung Wotaek, Electrical socket with floating guide plate.
    상세보기
  24. Mendenhall David W. (Greenville RI) Goff Jay T. (Cranston RI), Flex dot wafer probe.
    상세보기
  25. Khandros Igor Y. ; Mathieu Gaetan L., Flexible contact structure with an electrically conductive shell.
    상세보기
  26. Leedy Glenn J. (1061 E. Mountain Dr. Santa Barbara CA 93108), Flexible tester surface for testing integrated circuits.
    상세보기
  27. Knight Alan D. (Newark Valley NY) Petrozello James R. (Endicott NY), Fluid pressure actuated electrical connector.
    상세보기
  28. Grabbe Dimitry G. (Middletown PA), High density connector for an IC chip carrier.
    상세보기
  29. Grabbe Dimitry G. (Middletown PA), High density electrical connector system.
    상세보기
  30. Parrish Frank, High density printed circuit board.
    상세보기
  31. Bross Arthur (Poughkeepsie NY) Walsh Thomas J. (Poughkeepsie NY), High density probe.
    상세보기
  32. Whann Welton B. (San Diego CA) Elizondo Paul M. (Escondido CA), High density probe card.
    상세보기
  33. Subramanian Eswar (Phoenix AZ), High density probe card for testing electrical circuits.
    상세보기
  34. Ardezzone Frank J. (Santa Clara CA), High density probe-head with isolated and shielded transmission lines.
    상세보기
  35. Kwon On-Kyong (Plano TX) Hashimoto Masashi (Garland TX) Malhi Satwinder (Garland TX), High performance test head and method of making.
    상세보기
  36. Martel Anthony Paul ; McQuade Francis T., Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment.
    상세보기
  37. Perry Charles H. (Poughkeepsie NY) Bauer Tibor L. (Hopewell Junction NY) Long David C. (Wappingers Falls NY) Pickering Bruce C. (Wappingers Falls NY) Vittori Pierre C. (Cold Spring NY), Interface card for a probe card assembly.
    상세보기
  38. Bargain Raymond (Sartrouville FRX) Riverie Jean (Limours FRX) Ollivier Jean-Francois (Versailles FRX), Intermediate connector for use between a printed circuit card and a substrate for electronic circuits.
    상세보기
  39. Lee Shaw Wei (10410 Miller Ave. Cupertino CA 95014), Known good die test apparatus and method.
    상세보기
  40. Patrick A. Coico ; Benjamin V. Fasano, Land grid array alignment and engagement design.
    상세보기
  41. Dennis Richard Kay (Etters PA) Hadden Edward Leal (Mechanicsburg PA), Leadless package retaining frame.
    상세보기
  42. Schwindt Randy J., Low-current probe card with reduced triboelectric current generating cables.
    상세보기
  43. Amemiya Hiroshi,JPX, Low-temperature wafer testing method and prober.
    상세보기
  44. Leedy Glenn J. (Santa Barbara CA), Making and testing an integrated circuit using high density probe points.
    상세보기
  45. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Making discrete power connections to a space transformer of a probe card assembly.
    상세보기
  46. Kasukabe Susumu (Yokohama JPX) Takagi Ryuichi (Tokyo JPX), Manufacturing method of a probe head for semiconductor LSI inspection apparatus.
    상세보기
  47. Crumly William R. (Anaheim CA), Membrane connector with stretch induced micro scrub.
    상세보기
  48. Gleason K. Reed ; Smith Kenneth R. ; Bayne Mike, Membrane probing system with local contact scrub.
    상세보기
  49. Roemer Robert W. ; Williams Eddie V., Method and apparatus for securing an electronic package to a circuit board.
    상세보기
  50. Belmont Andre,FRX ; Reynaud Vincent,FRX ; Daniau William,FRX, Method for making cards with multiple contact tips for testing semiconductor chips.
    상세보기
  51. DeHaven Robert Keith (Austin TX) Wenzel James F. (Austin TX), Method for manufacturing a stimulus wafer for use in a wafer-to-wafer testing system to test integrated circuits located.
    상세보기
  52. Lum Thomas F. (Austin TX) Wenzel James F. (Austin TX), Method for probing a semiconductor wafer.
    상세보기
  53. Malhi Satwinder (Garland TX) Kwon Oh-Kyong (Richardson TX), Method of forming an apparatus for burn in testing of integrated circuit chip.
    상세보기
  54. Leedy Glenn J. (1061 E. Mountain Dr. Santa Barbara CA 93108), Method of making a flexible tester surface for testing integrated circuits.
    상세보기
  55. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Method of making microelectronic spring contact elements.
    상세보기
  56. Khandros Igor Y., Method of making raised contacts on electronic components.
    상세보기
  57. Khandros Igor Y. (Peekskil NY), Method of manufacturing electrical contacts, using a sacrificial member.
    상세보기
  58. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
    상세보기
  59. Watanabe Takashi,JPX ; Yoshida Minako,JPX, Method of producing micro contact structure and contact probe using same.
    상세보기
  60. Leedy Glenn J. (Santa Barbara CA), Method of repairing an integrated circuit structure.
    상세보기
  61. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of testing semiconductor.
    상세보기
  62. Palagonia Anthony Michael ; Pikna Paul Joseph ; Maddix John Thomas, Micro probe assembly and method of fabrication.
    상세보기
  63. Maddix John Thomas ; Palagonia Anthony Michael ; Pikna Paul Joseph ; Vallett David Paul, Micro probe ring assembly and method of fabrication.
    상세보기
  64. Gilleo Kenneth B. ; Karavakis Konstantine, Microelectronic component mounting with deformable shell terminals.
    상세보기
  65. Swapp Mavin (Mesa AZ), Micromachined semiconductor probe card.
    상세보기
  66. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Mounting spring elements on semiconductor devices.
    상세보기
  67. Evans Arthur (Broofield Center CT), Multi-level test probe assembly for IC chips.
    상세보기
  68. Driller Hubert (Schmitten DEX) Mang Paul (Schmitten DEX), Printed circuit board testing device with foil adapter.
    상세보기
  69. Yamaguchi Masao (Tokyo JPX), Probe apparatus.
    상세보기
  70. Soejima Koji,JPX ; Senba Naoji,JPX, Probe card and method of forming a probe card.
    상세보기
  71. Hembree David R. ; Farnworth Warren M. ; Akram Salman ; Wood Alan G. ; Doherty C. Patrick ; Krivy Andrew J., Probe card and testing method for semiconductor wafers.
    상세보기
  72. Higgins H. Dan (323 E. Redfield Chandler AZ 85225), Probe card apparatus.
    상세보기
  73. Carlin Scott J. (Austin TX) Roberts ; Jr. Samuel (Austin TX), Probe card apparatus having a heating element and process for using the same.
    상세보기
  74. Higgins H. Dan ; Pandey Rajiv ; Armendariz Norman J. ; Bates R. Dennis, Probe card assembly for high density integrated circuits.
    상세보기
  75. Trenary Dale T. (San Jose CA), Probe card for integrated circuit chip.
    상세보기
  76. Okubo Masao (Nishinomiya JPX) Murakami Nobuyuki (Amagasaki JPX) Katahira Kouji (Kikuchi-gun JPX) Iwata Hiroshi (Otokuni-gun JPX) Okubo Kazumasa (Naka-gun JPX), Probe card for maintaining the position of a probe in high temperature application.
    상세보기
  77. Benjamin N. Eldridge ; Gary W. Grube ; Gaetan L. Mathieu, Probe card for probing wafers with raised contact elements.
    상세보기
  78. Hembree David R. ; Farnworth Warren M. ; Akram Salman ; Wood Alan G. ; Doherty C. Patrick ; Krivy Andrew J., Probe card for semiconductor wafers and method and system for testing wafers.
    상세보기
  79. Monnet Ren (Seyssinet-Pariset FRX) Perrin Maurice (Saint Etienne de Crossey FRX), Probe card for testing integrated circuit chips.
    상세보기
  80. Yoon Jong-Chil,KRX ; Kim Jeung-Dae,KRX ; Kim Young-Syup,KRX, Probe card for testing semiconductor devices.
    상세보기
  81. Nakata Yoshiro,JPX, Probe card for wafer-level measurement, multilayer ceramic wiring board, and fabricating methods therefor.
    상세보기
  82. Doherty C. Patrick ; deVarona Jorge L. ; Akram Salman, Probe card having on-board multiplex circuitry for expanding tester resources.
    상세보기
  83. Okubo Kazumasa (Kanagawa JPX) Okubo Masao (Nishinomiya JPX) Yoshimitsu Yasuro (Takatsuki JPX) Sugaya Kiyoshi (Amagasaki JPX), Probe card in which contact pressure and relative position of each probe end are correctly maintained.
    상세보기
  84. Mizuta Masaharu,JPX, Probe card with vertical needle for enabling improved wafer testing and method of manufacturing the same.
    상세보기
  85. Theodore A. Khoury ; Mark R. Jones ; R. Keith Lee, Probe contactor and production method thereof.
    상세보기
  86. Sano Kunio (Nakakoma-gun JPX), Probe device.
    상세보기
  87. Kiyoshi Takekoshi JP, Probing card.
    상세보기
  88. Atkins Glen G. (Boise ID) Cohen Michael S. (Boise ID) Mauritz Karl H. (Eagle ID) Shaffer James M. (Boise ID), Repairable wafer scale integration system.
    상세보기
  89. Otsuka Kanji (Higashiyamato JPX) Kato Masao (Hadano JPX) Kumagai Takashi (Isehara JPX) Usami Mitsuo (Ohme JPX) Kuroda Shigeo (Ohme JPX) Sahara Kunizo (Nishitama JPX) Yamada Takeo (Koganei JPX) Miyamo, Semiconductor device having leads for mounting to a surface of a printed circuit board.
    상세보기
  90. Isaac George L. ; Miller Donald C. ; Ziegenhagen ; II Rodney Scott, Semiconductor test socket and contacts.
    상세보기
  91. Berar Andrei, Semiconductor tester system including test head supported by wafer prober frame.
    상세보기
  92. Thompson Patrick F. ; Williams William M. ; Lindsey Scott E. ; Vasquez Barbara, Semiconductor wafer contact system and method for contacting a semiconductor wafer.
    상세보기
  93. James Marc Leas ; Robert William Koss ; Jody John Van Horn ; George Frederick Walker ; Charles Hampton Perry ; David Lewis Gardell ; Steve Leo Dingle ; Ronald Prilik, Semiconductor wafer test and burn-in.
    상세보기
  94. Leas James M. (South Burlington VT) Koss Robert W. (Burlington VT) Walker George F. (New York NY) Perry Charles H. (Poughkeepsie NY) Van Horn Jody J. (Underhill VT), Semiconductor wafer test and burn-in.
    상세보기
  95. Briggs Merton Darrell ; Miller Alfred H., Socket including centrally distributed test tips for testing unpackaged singulated die.
    상세보기
  96. Brown Candice H. (San Jose CA), Test fixture capable of electrically testing an integrated circuit die having a planar array of contacts.
    상세보기
  97. Schmid Rainer,DEX ; Giringer Klaus,DEX ; Gauss Ulrich,DEX ; Deusch Heinz,DEX, Test head for microstructures with interface.
    상세보기
  98. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof.
    상세보기
  99. Barabi Nasser, Test socket for an IC device.
    상세보기
  100. Lau James C. K. (Torrance CA) Malmgren Richard P. (Castaic CA) Lui Kenneth (Fountain Valley CA), Testing device for integrated circuits on wafer.
    상세보기
  101. Khandros Igor Y. ; Pedersen David V., Wafer-level burn-in and test.
    상세보기
  102. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Wafer-level test and burn-in, and semiconductor process.
    상세보기

이 특허를 인용한 특허 (4) 인용/피인용 타임라인 분석

  1. Beroz, Masud, Fluid pressure activated electrical contact devices and methods.
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  2. Beroz, Masud, Fluid pressure activated electrical contact devices and methods.
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  3. Beroz, Masud, Fluid pressure activated electrical contact devices and methods.
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  4. Beroz, Masud, Multiplexing, switching and testing devices and methods using fluid pressure.
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