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Mechanism to make a heat sink in contact with a pluggable transceiver, a pluggable optical transceiver and a cage assembly providing the same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0332199 (2008-12-10)
등록번호 US7974098 (2011-06-22)
우선권정보 JP-2007-007-329668(2007-12-21)
발명자 / 주소
  • Oki, Kazushige
  • Kurashima, Hiromi
출원인 / 주소
  • Sumitomo Electric Industries, Ltd.
대리인 / 주소
    Venable LLP
인용정보 피인용 횟수 : 24  인용 특허 : 19

초록

A heat-dissipating mechanism with a thermo-conducting sheet is arranged between a pluggable optical transceiver and a heat sink. One of the optical transceiver and the heat sink includes the thermo-conducting sheet. The heat sink is assembled with a cage to be movable vertically and against a downwa

대표청구항

What is claimed is: 1. A mechanism to dissipate heat from a pluggable optical transceiver set in a cage to a heat sink assembled with said cage through a thermo-conducting sheet put between said transceiver and said heat sink, said mechanism comprising:at least a projection provided in a rear end of

이 특허에 인용된 특허 (19)

  1. Neer,Jay H.; Dirkers,Christopher P.; Seamands,Edward, Adapter module with a compliant press-fit mounting pins.
  2. Ice, Donald A.; Aronson, Lewis B., Angled EMI shield for transceiver-PCB interface.
  3. Yu, Juhyun; Takahashi, Ryuta; Sunaga, Yoshinori, Electronic module.
  4. Zumbrunnen,Michael L.; Day,Leland L., Heat dissipating cages for optical transceiver systems.
  5. Phillips, Michael J.; Henry, Randall Robert; Murr, Keith McQuilkin, Heat transfer system for a receptacle assembly.
  6. Malagrino, Jr.,Gerald Daniel; Zumbrunnen,Michael L., High density optical transceiver.
  7. Miller, Jason J., Integrated heat sink and light pipe mounting assembly.
  8. Ice,Donald A., Modular cage with heat sink for use with pluggable module.
  9. Branch, Scott Michael; Distad, Eugene E.; Freitag, Ladd W.; Hanley, Michael Francis; Gaio, David Peter, Modular heat sinks.
  10. Inujima, Takayoshi; Tsumura, Eiji; Kurashima, Hiromi; Oki, Kazushige, Optical module.
  11. Kruger, Bruce P.; Heitkamp, Gary; Branch, Scott Michael, Optical transceiver cage.
  12. Ahrens,Michael E., Optical transponder with active heat transfer.
  13. Hanley, Michael Francis; Malagrino Jr., Gerald Daniel, Pluggable optical transceiver latch.
  14. Oki,Kazushige; Kurashima,Hiromi, Pluggable optical transceiver with a ground finger.
  15. Oki,Kazushige; Kurashima,Hiromi; Funada,Tomoyuki; Kiyotake,Shojiro; Nito,Kou; Murata,Hiroshi, Pluggable optical transceiver with highly shielded structure.
  16. Kurashima, Hiromi; Mizue, Toshio; Oki, Kazushige; Ogushi, Toshiyuki, Releasing mechanism of an optical module from a host board.
  17. Bench,Samantha R.; Dirkson,John C.; Douma,Darin James, Systems, devices and methods for thermal testing of an optoelectronic module.
  18. Meadowcroft,David; Mitchell,Ian; Reilly,Declan, Temperature control of heat-generating devices.
  19. Malagrino, Jr.,Gerald Daniel, Transceiver guide rail with heat sink guide.

이 특허를 인용한 특허 (24)

  1. Jandt, Tyler; Mann, Phillip V.; Plucinski, Mark D.; Shirk/Heath, Sandra, Active cable heat sink.
  2. Jandt, Tyler; Mann, Phillip V.; Plucinski, Mark D.; Shirk/Heath, Sandra J., Active cable heat sink.
  3. Obasih, Kem M.; DeKeuster, Richard M., Battery module passive thermal management features and positioning.
  4. Phillips, Michael John, Caged electrical connector assemblies having indicator lights.
  5. Lima, David J., Circuit boards defining openings for cooling electronic devices.
  6. Nguyen, Long Van, Communication module assembly with heat sink and methods of manufacture.
  7. Xue, Tim; Yang, Jason; Cai, Alex; Yu, Tommy, Connector.
  8. Shi, Kris, Cooling device for pluggable module, assembly of the cooling device and the pluggable module.
  9. McColloch, Laurence Ray; Yu, Paul, Direct cooling system and method for transceivers.
  10. Bucher, Alan Weir; Shankar, Nikhil; Briant, Eric David, Electrical connector assembly having stepped surface.
  11. David, James J.; Minich, Steven E.; Houtz, Timothy W.; Zerebilov, Arkady Y., Electrical connector assembly including compliant heat sink.
  12. Wei, Chao-Ke; Wang, Wen-Chen, Heat dissipation apparatus for electronic device.
  13. Pikovsky, Anatoly, Heat dissipation system.
  14. Del Prete, Stephen D; Stratton, Robert; Dedonato, David A., Heat sink assembly for a pluggable module.
  15. Lima, David J., Heat sinks having a thermal interface for cooling electronic devices.
  16. Macall, Thomas George, Heat transfer using a durable low-friction interface.
  17. Aspas Puertolas, Jesus; Maisonnave, Nicolas; Colongo, Emile; Bourdou, Sylvain, Housing for an on-board electronic card.
  18. Cooper, Frank G.; Hoffman, Eric J., Mechanical arrangement for use within galvanically-isolated, low-profile micro-inverters for solar power installations.
  19. Yi, Robert; Yu, Paul, Optical transceiver module having a deformable heat sink structure.
  20. Scholeno, Michael, Receptacle heat sink connection.
  21. Elison, Bret P.; Mann, Phillip V.; Moore, Arden L.; Sinha, Arvind K., Receptacle with heat management for electronic and optical systems.
  22. Lima, David J., Thermal interface members for removable electronic devices.
  23. Lima, David J., Thermal interface members for removable electronic devices.
  24. Henry, Randall R.; Shirk, Michael E., Transceiver assembly.
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