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Dual interface inlays 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06K-019/06
출원번호 US-0117748 (2008-05-09)
등록번호 US7980477 (2011-07-06)
발명자 / 주소
  • Finn, David
출원인 / 주소
  • Féinics Amatech Teoranta
대리인 / 주소
    Gerald E., Linden
인용정보 피인용 횟수 : 18  인용 특허 : 55

초록

A dual interface inlay having a bottom sheet; an antenna wire mounted to the top surface of the bottom sheet; end portions of the antenna wire formed with squiggles or meanders forming contact areas of increased surface area for subsequent attachment of a chip or chip module to the antenna wire; con

대표청구항

What is claimed is: 1. A dual interface inlay comprising:a bottom sheet;a transponder site on a top surface of the bottom sheet;an antenna wire mounted to the top surface of the bottom sheet;end portions of the antenna wire are formed with squiggles or meanders forming contact areas on opposite side

이 특허에 인용된 특허 (55)

  1. Date, Hiroaki; Motoyama, Yuko; Tokuhira, Hideshi; Usui, Makoto; Imaizumi, Nobuhiro, Adhesive, bonding method and assembly of mounting substrate.
  2. Matsushita, Taiga; Nakata, Yasukazu; Murakami, Takakazu, Antenna circuit, IC inlet and IC tag.
  3. Swiggett Brian E. (Huntington NY) Morino Ronald (Sea Cliff NY) Keogh Raymond J. (Huntington NY) Crowell Jonathan C. (Lakeville MA), Apparatus for making scribed circuit boards and circuit board modifications.
  4. Kobayashi Mamoru (Hadano JPX) Ishige Kanji (Kanagawa JPX) Sasaki Hideaki (Hadano JPX) Tani Mitsukiyo (Hadano JPX) Kawakami Yashuhiko (Yokohama JPX), Automatic wiring machine for printed circuit boards.
  5. Fox James M. (Kings Park NY) Malone Howard F. (Southold NY), Broken wire detector for wire scribing machines.
  6. Ghaem Sanjar ; O'Malley Grace ; Gore Kiron, Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly.
  7. Kreft Hans-Diedrich,DEX, Chip card.
  8. Kreft Hans-Diedrich,DEX, Chip card capable of both contact and contactless operation including a contact block.
  9. Kreft Hans-Diedrich,DEX, Chip card with chip support element and coil support element.
  10. Finn David,DEX ; Rietzler Manfred,DEX, Chip module and manufacture of same.
  11. Hiroshi Kaiya JP; Toshiyuki Honda JP, Combination card having an IC chip module.
  12. Finn David,DEX ; Rietzler Manfred,DEX, Contact or contactless chip card with brace.
  13. Kobayashi, Izumi; Watanabe, Takanori, Contactless IC card.
  14. Finn, David; Rietzler, Manfred, Device for bonding a wire conductor.
  15. Finn David,DEXITX DE-87459 ; Rietzler Manfred,DEXITX DE-87616, Device for the application of joint material deposit.
  16. Yamamura Takemi (Ube JPX) Ishikawa Toshihiro (Ube JPX) Shibuya Masaki (Ube JPX), Electromagnetic wave absorbing material.
  17. Matsumura, Kazuhito; Yoshida, Kenichi; Iwai, Tohru; Nakata, Hidekazu; Yoshizawa, Masato, Electromagnetic wave absorbing sheet.
  18. Van Heerden, Clive R.; Marmaropoulos, George, Fabric antenna for tags.
  19. Friedrich Marju L. (Babylon NY) Branigan John G. (Smithtown NY) Fitzgibbon Maurice E. (Glen Cove NY), Heat activatable adhesive for wire scribed circuits.
  20. Taban, Vahid, High speed system for embedding wire antennas in an array of smart cards.
  21. Finn David,DEX ; Rietzler Manfred,DEX, IC board module for producing an IC board and process for producing an IC board.
  22. Hoppe Joachim (Munich DEX) Haghiri-Tehrani Yahya (Munich DEX), Identification card having an IC module.
  23. Milheiser Thomas A. (Littleton CO), Identification system.
  24. Milheiser Thomas A. (Littleton CO), Identification system.
  25. Milheiser Thomas A. (Littleton CO), Identification system.
  26. Hadden Leonard D. (Minneapolis MN) Zirbes Glen L. (Silver Lake MN), Integrated circuit device including means for facilitating connection of antenna lead wires to an integrated circuit die.
  27. Plepys Anthony R. ; Harvey Paul M., Laminated integrated circuit package.
  28. Dimmler,Klaus, Laser ablation method for fabricating high performance organic devices.
  29. Amador Gonzalo (Dallas) Alfaro Rafael C. (The Colony) Davis Robert A. (Irving TX), Linear, direct-drive microelectronic bonding apparatus and method.
  30. Monico Dominick L., Low cost long distance RFID reading.
  31. Brown Jerald L. (Huntington NY) Berzins Vaironis (Hicksville NY), Method and apparatus for cutting wire.
  32. Amadeo, Paul, Method and apparatus for rapid staking of antennae in smart card manufacture.
  33. Wilm Robert,DEX ; Houdeau Detlef,DEX ; Reiner Robert,DEX ; Rettig Rainer,DEX, Method and connection arrangement for producing a smart card.
  34. Finn David,DEX ; Rietzler Manfred,DEX, Method and device for bonding a wire conductor.
  35. Na,Myung Hee; Nowak,Edward J., Method and structures for measuring gate tunneling leakage parameters of field effect transistors.
  36. Morton Greene ; G. William Hurley, Method for forming a radio frequency responsive target and apparatus for verifying the authenticity of same.
  37. Ayala, Stephane; Bourneix, Gerard; Beausoleil, Christine; Martin, David; Odduo, Laurent; Patrice, Philippe; Zafrany, Michael, Method for making smart cards capable of operating with and without contact.
  38. Fischer Dirk,DEX ; Fannasch Lothar,DEX, Method for manufacturing a chip card and chip card manufactured in accordance with said method.
  39. Mundigl Josef,DEX ; Houdeau Detlef,DEX, Method for producing a smart card module for contactless smart cards.
  40. Lee, Chi Keung; Kwan, Kwok Lam, Method of forming a dual-interface IC card and a card formed of such a method.
  41. Gregory, John, Method of forming an opening or cavity in a substrate for receiving an electronic component.
  42. Houdeau Detlef,DEX ; Wilm Robert,DEX, Method of producing a smart card module, a smart card module produced by the method, and a combination smart card containing the smart card module.
  43. Distefano Thomas H. (Monte Sereno CA) Kovac Zlata (Los Gatos CA) Grange John (Cupertino CA), Microelectronic bonding with lead motion.
  44. Credelle, Thomas Lloyd; Gengel, Glenn; Stewart, Roger Green; Joseph, William Hill, Multi-feature-size electronic structures.
  45. Geissler Randolph K. ; Fearing D. Michael ; Battista William, Premise identification system.
  46. Anderegg Fredy (Lohn CHX) Furrer Josef (Luterbach CHX) Dppen Heinz (Flumenthal CHX), Printed circuit assembly.
  47. Finn David,DEX ; Rietzler Manfred,DEX, Procedure for producing a chip mounting board and chip-mounting board thus produced.
  48. Brollier, Brian W.; Soehnlen, John Pius, RFID enabled corrugated structures.
  49. Eberhardt Noel H. ; Ghaem Sanjar, Radio frequency identification tag having an article integrated antenna.
  50. Kondo, Yasuo; Matsuzaki, Toru; Suematsu, Yutaka; Okamoto, Masaru; Yamamoto, Tomohisa, Radio wave absorber and production method thereof.
  51. Ahn Tae O. (Seoul KRX) Park Kyoung N. (Seoul KRX) Kim Beom S. (Kyungki KRX), Resin composition for absorbing electromagnetic waves.
  52. Houser David E. (Appalachin NY) Morenus Richard J. (Endwell NY), Resonant stylus support.
  53. Robertz Bernd,DEX ; Liebler Ralf,DEX, Surface-printable RFID-transponders.
  54. Taylor Vern (Broomfield CA) Koturov Daniel (both of CO) Bradin John (both of CO) Loeb Gerald E. (Clarksburg MD), Syringe-implantable identification transponder.
  55. Morino Ronald (Seacliff NY) Conti Joseph A. (Whitestone NY), Ultrasonic stylus position stabilizer.

이 특허를 인용한 특허 (18)

  1. Finn, David; Czornack, Jan Thomas; Lotya, Mustafa; Fendt, Theodor; Ummenhofer, Klaus, Antenna modules for dual interface smart cards, booster antenna configurations, and methods.
  2. Finn, David; Lotya, Mustafa; Ummenhofer, Klaus, Booster antenna configurations and methods.
  3. Finn, David; Ummenhofer, Klaus, Coupling in and to RFID smart cards.
  4. Finn, David; Ummenhofer, Klaus, Coupling in and to RFID smart cards.
  5. Finn, David; Conneely, Patrick Gerard; Czornack, Jan Thomas; Ummenhofer, Klaus; Lotya, Mustafa, Dual interface smart cards, and methods of manufacturing.
  6. Bashan, Oded; Shafran, Guy, Electronic interface apparatus and method and system for manufacturing same.
  7. Felic, Gordana; Skafidas, Stan, Integration of microstrip antenna with CMOS transceiver.
  8. Finn, David, RFID antenna modules and increasing coupling.
  9. Finn, David, RFID antenna modules and increasing coupling.
  10. Finn, David, RFID antenna modules and methods.
  11. Finn, David; Carré, Lionel, RFID antenna modules and methods of making.
  12. Maus, Christopher; Maus, Brandon, Smartcard with iChip contact pad.
  13. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  14. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  15. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  16. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.
  17. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus and related methods.
  18. Schwandt, Sheldon Terry; Dehmoubed, Farzin; Infanti, James Carl; Lepp, James Randolph Winter; Los, Oleg, Universal integrated circuit card apparatus and related methods.
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