초록 ▼

Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are configured to be thermally coupled to one or more of the electronic components. Internally, each of the cold plat

Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are configured to be thermally coupled to one or more of the electronic components. Internally, each of the cold plates has a cooling fluid flowing inside of at least one passageway. The cooling fluid thus removes heat from the electronic components primarily by conductive heat transfer. An input and an output header are attached to opposite ends of the passageway to allow entry and exit of the cooling fluid. The input and output headers are attached to an external system to circulate the cooling fluid.

대표청구항 ▼

What is claimed is: 1. A system to provide cooling to an electronic component, the system comprising:a flexible cold plate that thermally couples to the electronic component, the flexible cold plate having a passageway configured to allow a cooling fluid to flow therein;an input header coupled to a

What is claimed is: 1. A system to provide cooling to an electronic component, the system comprising:a flexible cold plate that thermally couples to the electronic component, the flexible cold plate having a passageway configured to allow a cooling fluid to flow therein;an input header coupled to a first end of the passageway to allow entry of the cooling fluid;an output header coupled to a second end of the passageway to allow exit of the cooling fluid;a coupling mechanism to couple the input header and the output header to an external system to circulate the cooling fluid; anda force application mechanism that translates a rotational force into a substantially distributed normal force across a face of the flexible cold plate, wherein the normal force brings the flexible cold plate into thermal contact with the electronic component.